Advanced Packaging & System Integration Technology Symposium – 2019

Yole Events

Shanghai, China

Advanced packaging: at the heart of innovation

Advanced packaging is driven by the wind of changes… 
Be part of our Advanced Packaging & System Integration Technology Symposium!

For the 5th edition, NCAP and Yole Développement combine their expertise to build an innovative program dedicated to the advanced packaging industry – during one day and a half, meet the leading executives and gain an in-depth understanding of the market evolution!

It is a fact, Advanced packaging is at the heart of innovation. Mega-trend applications are bringing new challenges, and leading advanced packaging companies from all over the world will come to exchange ideas on their vision and future perspectives at the Advanced Packaging & System Integration Technology Symposium.

Yole Développement and NCAP have created an unprecedented program to understand the status of the advanced packaging industry and help the companies to be part of the ‘tomorrow’ industry. The Advanced Packaging & System Integration Technology Symposium is unique. Don’t miss it!

This year, the location will change, it will thus take place in Shanghai, China, from April 22PM to 23, 2019, prior to NEPCON China 2019.

During one day and a half, all packaging aspects, including Panel Level, Fan Out, System in Package, Advanced Substrates and 3D Technology, will be discussed. A focus on key applications such as AI, HPC, memory, transportation (48V, EV/HEV, embedded die packaging platform, PCB, advanced substrates…), 5G and consumer (WLP and Fan-Out platforms)… will be at the heart of the conference.

Gain an insight into a unique symposium…

  • 5 key industry focuses: AI/HPC, memory, transportation, 5G and consumer
  • About 20 inspiring presentations
  • Unique access to leading players and experts
  • A panel session to debate
  • Several networking times to discuss with your peers
  • Short courses to cover a broad range of topic areas at a variety of educational levels

The advanced packaging is also driven by the wind of changes, due to the impressive impact of the megatrends. Yole and NCAP China have decided to combine their expertise this year again to propose the Advanced Packaging & System Integration Technology Symposium in Shanghai, prior NEPCON China. This Shanghai edition will be the place to be to understand the industry evolution and measure the impact of the megatrends.

Emilie Jolivet

Division director, semiconductors & software

Prelimenary agenda now unveiled !

The program is now avalaible (see below in the agenda section). For more information, please contact Fanny Vitrey (vitrey@yole.fr)

The structure of the symposium will allow attendees to get valuable insights into the advanced packaging industry as well as provide unprecedented opportunities for meeting with industry leaders…

Networking sessions during the all event. Get the opportunity to exchange with all the leading players in the advanced packaging industry.

Agenda

Speakers

  • Farhang Yazdani BroadPak Corporation

    Farhang Yazdani

    President & CEO - BroadPak

  • Qiwei Fu

    Director - Deephi

  • John Lee Amkor

    John Lee

    Sr. Director, Strategic Marketing Greater China Sales & Marketing - Amkor Technology

  • Yaojian Lin

    Vice President - JCET

  • David Wang SPIL

    David Wang

    Manager Product Application Engineering and Corporate R&D - SPIL

  • Thomas Uhrmann EV Group

    Dr. Thomas Uhrmann

    Director of Business Development - EV Group

  • Dongshun Bai Brewer Science

    Dongshun Bai, Ph.D.

    Deputy Business Development Director of the Wafer-Level Packaging Materials Business Unit - Brewer Science

  • Stephen Hiebert KLA

    Stephen Hiebert

    Senior Director of Marketing Department LS-SWIFT Division, Global Products Group - KLA

  • Lio Li Li Hongyu

    Front-End Engineering Manager/ECP Program Manager - AT&S China

  • Romain Fraux System Plus Consulting

    Romain Fraux

    CEO

  • Chan Pin Chong

    Senior Vice President, EA/APMR & Wedge Bonders Business Units - Kulicke & Soffa

  • Pan Zhengang UNISOC

    Dr. Pan Zhengang

    VP of New Radio Tech. - Unisoc

  • Bin Fu Bosch Sensortec

    Bin Fu

    Head of Business Development and Marketing China - Bosch Sensortec

  • Min-hwa Chi Sienidm

    Min-hwa Chi

    Senior Vice President / Td - Sien (Qindao) Integated Circuit

  • Debbie Claire Sanchez

    FOWLP Equipment Product Manager - Ers Electronic Gmbh

  • Daping Yao NCAP

    Daping Yao, Ph. D.

    Technical Director - NCAP China

  • Vijay Wakharkar InvenSense

    Vijay Wakharker

    Manager Of Research & Development - Advanced Mems Packaging - TDK InvenSense

  • Chenggong Wang VisionOX

    Chenggong Wang

    Director of X-Vision Lab - Visionox Technology

Sponsors

PLATINUM SPONSOR: SPTS Technologies, an Orbotech company, designs, manufactures, sells, and supports advanced etch, PVD, CVD, and MVD® wafer processing equipment and solutions for the global semiconductor and micro-device industries, with focus on the Advanced Packaging, MEMS, high speed RF device, power management and LED markets. SPTS also offers Additive Printing solutions for 3D structural printing of dams and isolating layers for IC packaging and package marking. SPTS has manufacturing facilities in Newport, Wales and Allentown, Pennsylvania, and operates across 19 countries in Europe, North America and Asia-Pacific. More information: www.orbotech.com/spts

HANMI CI

BADGE HOLDERS SPONSOR: The best valued Company which leads the future. Our goal is to be the best valued company leading technology standard. Since HANMI Semiconductor founded the semiconductor equipment industry in 1980, we have grown steadily into a world best Middle-End Semiconductor Equipment Manufacturer & maintain the top position. Through our continued export promotion policy, our high-end technology has been shipping abroad to our more than 280 global customers and this led to more widespread appreciation of its value. Especially, Sawing & Placement System, which was designated as the “World-Class Product’ is recording the first of global market share. Hanmi TSV Dual Stacking TC Bonder has won “2017 iR52 Jang Young-Sil Award”. Hanmi provides distinguished products and services for ‘Customer Satisfaction’. Hanmi won 2016 VLSI Customer Satisfaction Survey The Best Award & 10 Best Award. Also, HANMI has been successful to get original technology with intensive R&D investment and selected as “Advanced Technology Center’ in 2008. Hanmi has 290 R&D Engineers and owns 810 worldwide Intellectual Properties. HANMI Semiconductor is trying to be the best valued company as the pioneer spirit of the first Korean semiconductor equipment manufacturer. More information: http://www.hanmisemi.com/

GIVEAWAYS & BROCHURE SPONSOR: ERS electronic GmbH, based in Germering, has been producing innovative thermal test solutions for the semiconductor industry for 50 years. Today, thermal chuck systems developed by ERS in its product families; AC3, AirCool©, AirCool© Plus and PowerSense© are an integral component in all larger-sized wafer probers right across the semiconductor industry. More information: https://www.ers-gmbh.com/

ks logo

GIVEAWAYS & BROCHURE SPONSOR: Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. As a pioneer in the semiconductor space, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings. Combined with its extensive expertise in process technology and focus on development, K&S is well positioned to help customers meet the challenges of packaging and assembling the next-generation of electronic devices. More information: www.kns.com

Bowman logo

EXHIBITOR: Bowman is a world-leading manufacturer of precision XRF coating measurement systems, with a robust local service network to support every system, at each customer location, worldwide. Our mission is to support you during every phase of your system’s lifecycle – from system evaluation, selection, and commissioning, through maintenance and modernization. Bowman service partners provide comprehensive, same-day service response for every need; we also work with customers to streamline their testing processes, and to generate the qualitative and quantitative information that's required, in less time. Our commitment : to deliver support solutions tailored to the needs and quality culture of each individual customer, so that, with each subsequent XRF system purchase, there is no question... that the system will be a Bowman. More information: www.bowmanxrf.com - www.applytest.com

Partners

Founded in 1998, Yole Développement, the "More than Moore" market research & strategy consulting company has grown to become a group of companies providing marketing, technology and strategy consulting, media in addition to corporate finance services. Yole Développement group provides market research, technology analysis, strategy consulting, targeted media, and financial advisory services. We have a global vision and customer base... The “More than Moore” company Yole and its partners System Plus Consulting, Blumorpho, PISEO and KnowMade support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business... Our fields of expertise: MEMS & Sensors - Imaging - Medical Technologies - Compound Semiconductors - RF Electronics - Solid State Lighting - Displays - Photonics - Power Electronics - Batteries & Energy Management - Advanced Packaging - Semiconductor Manufacturing - Software & Computing - Memory and more... More information: www.yole.fr

ncap logo

As an innovation model, National Center for Advanced Packaging Co., Ltd. (NCAP China) was registered in Wuxi New District, China, in September 2012. Supported by Wuxi and Jiangsu government, National Science and Technology Major Project(02 Project) and IC Packaging and Testing Industry Chain Technology Innovation Strategic Alliance, NCAP China, a joint venture with a capital of 234.45 million, is established by ten investors, including the leaders of the IC packaging and testing industry in China (Jiangsu Changjiang Electronics Technology, TongFu Microelectronics, Huatian Technology, Shennan Circuit Company, China Wafer Level CSP, AKM Electronic Technology (Suzhou), Jiangsu CAS Internet-of-things Technology Venture Capital, Shenzhen Fastprint Circuit Tech) and CDB Capital. NCAP’s goal is to establish a national R&D center for advanced packaging and system integration, play a global leading role in the development and commercialization of advanced technologies for microelectronics packaging and system integration, and promote and sustain the technological and commercial advancement of the microelectronics industry in China. More information: http://www.ncap-cn.com

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