Semiconductor market driver is turning from mobile to more scattered applications in the future – IoT (and IIoT), Automotive, 5G, AR/VR, AI. In this digital new age, advanced nodes do not bring the desired cost benefit anymore and R&D investments in new lithography solutions and devices below 10nm nodes are rising substantially. Hence, advanced packaging represents an opportunity to increase product value (higher performance at lower cost) offering advantages down both the scaling and functional roadmaps. Advanced Packaging stands at $25.7B in 2017, continues to raise share in total packaging from 38% (2014) to 41% (2017) with 47% by 2023. Two advanced packaging roadmaps are foreseen – scaling (going to sub10 nm nodes) and functional (staying above 20nm nodes). Both roadmaps hold more multi-die heterogeneous integration (SiP) and higher levels of package customization in the future.

The RF FEM SiP assembly market was $2.5B & $3.0B in 2017 & 2018 respectively and will have a CAGR of 11% to reach $4.9B in 2023. 5G sub 6GHz require incremental innovation in packaging with small BOM increase while mmWave require disruptive innovation. Antenna technology and placement is one of the most critical challenges for 5G semiconductor systems. Thanks to AI, HPC and memory, high-end is the new segment for advanced packaging making a mandatory field to investigate and cover. Innovation in memory with HBM and 3D NAND is opening a new field for back-end and packaging with TSV, Hybrid bonding in stacking. This presentation will show the packaging market trends and technologies revolving round 5G and HPC.