The AVS 22nd International Conference on Atomic Layer Deposition (ALD 2022) featuring the 9th International Atomic Layer Etching Workshop (ALE 2022) will be a three-day meeting dedicated to the science and technology of atomic layer controlled deposition of thin films and now topics related to atomic layer etching. Since 2001, the ALD conference has been held alternately in the United States, Europe and Asia, allowing fruitful exchange of ideas, know-how and practices between scientists. This year, the ALD conference will again incorporate the Atomic Layer Etching 2022 Workshop (ALE 2022), so that attendees can interact freely. The conference will take place Sunday, June 26-Wednesday, June 29, 2022, at the International Convention Center (ICC) Ghent in Ghent, Belgium.
As in past conferences, the meeting will be preceded (Sunday, June 26) by one day of tutorials and a welcome reception. Sessions will take place (Monday-Wednesday, June 27-29) along with an industry tradeshow. All presentations will be audio-recorded and provided to attendees following the conference (posters will be included as PDFs). Anticipated attendance is 800+.
Yole Développement will participate in the following:
Atomic Layer Deposition Equipment Used in Industrial Production of More Than Moore Devices
Tuesday, June 28, 2022 1:30 PM
By Taguhi Yeghoyan, Technology & Market Analyst, Semiconductor Manufacturing, Yole Développement
“In semiconductor community, Atomic Layer Deposition (ALD) is often associated with upmost advanced nodes, used for manufacturing of logic and memory devices, so called More Moore (MM) applications. For MM, ALD is used in High Volume Production (HVM) already for 20 years, starting with DRAM capacitor coating and logic transistor node shift from 65 nm to 45 nm. From that time on, ALD played a vital role to enable subsequent nodes and transistor architecture evolution, first to FinFet and currently to Gate-All-Around (GAA).HVM of MM devices is done with 300 mm Si wafers, with ALD equipment tailored to a specific process and high throughput. Thus, only few ALD equipment makers are present in MM HVM, generating highest equipment sales revenue.
On the other side of semiconductor industry, More-than-Moore (MtM) device production flourishes with diversified substrates in terms of material, size and sometimes shape. MtM devices encompass MEMS and sensors, Radiofrequency (RF) devices, power devices, CMOS Image Sensors (CIS), photonic devices and various packaging approaches. Among all MtM devices, CIS are manufactured mostly on 300 mm Si wafers on MM-like production lines and require similar ALD equipment. Other MtM devices are manufactured mostly on up to 200 mm production lines at lower volumes and with varied process flow. This MtM devices need flexible ALD equipment able to deposit often thicker films thermally or with plasma assistance, on various substrate sizes and substrate material, i.e. compound, Si, piezoelectric, dies on frame tape among others. Currently, more MtM ALD equipment providers qualify their equipment for Fab production, driven by several applications, where ALD is indispensable. These are for example: GaN HEMT transistors, mini-LEDs and microLEDs as well as wafer level encapsulation.
This presentation aims to give a market research overview on ALD equipment used in industrial production of MtM devices, with market size estimated to $345M in 2020, which is expected to increase to $680.5M in 2026. Moreover, ALD supply chain is outlined: ALD equipment subparts and inspection, process developers and materials suppliers. Finally, commercial MtM devices with identified ALD use are showed.“