ECTC 2021 – IEEE 71th Electronic Components and Technology Conference – Virtual Format

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The 71st Electronic Components and Technology Conference (ECTC) will be held virtually on a digital platform from June 1 until July 4, 2021. This premier international conference brings together key stakeholders of the global microelectronics packaging industry, such as semiconductor companies, foundry and OSAT service providers, equipment manufacturers, materials suppliers, research institutions and universities all in a single event.

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The virtual platform will allow for recorded presentations of over 350 papers in 46 technical sessions to be available on-demand throughout the conference. During the last two weeks of the conference, a live teleconferencing meeting for each session will be held by the session chairs; all the presenters of the session will be available live to field questions from the attendees. Authors from over twenty five countries are expected to present their work at the 71st ECTC, covering ongoing technology development within established disciplines or emerging topics of interest for our industry such as mobile, 5G, medical wearables, autonomous driving, photonics, quantum computing, and artificial intelligence (AI) hardware.

This year’s ECTC will feature a record 12 special sessions, which will be held live during the first two weeks of the conference. The attendees will be able to ask questions during the live panel discussion. The special sessions will be recorded and be made available for on-demand streaming from the date of the session until the end of the conference. The special sessions will not only focus on the technical topics but also cover topics such as market trends, geopolitical and economic outlook, and transformation of the industry in a post-Covid world.

Sam Naffziger, Senior Vice President of AMD, will deliver the first keynote speech entitled, “What the Chiplet-Based Future of Compute Means for Components and Technology.” The second keynote speech entitled “Transitioning to a Renewable Energy-Based Grid,” will be delivered by Pedro Arsuaga, the Renewable Energy Business Program Manager at GE Research. Additionally, Bill Chen and Bill Bottoms will host a half-day workshop on Heterogeneous Integration Roadmap.

Supplementing the technical program, ECTC also offers Professional Development Courses (PDCs). The 71st ECTC will offer fourteen PDCs, organized by Kitty Pearsall and Jeffrey Suhling.

ECTC offers value for everyone in the microelectronics packaging and components industry; it has multiple items of interest for engineers, managers, students, business and marketing professionals and executives. Please go to ectc.net to view the technical program and to register.

Yole Développement will participate to the following:

Jean Christophe Eloy CEO Yole Développement

How AI advanced nodes are driving Advanced Packaging towards High End Performance ?

On June 3rd, 2021 at 2am CEST
Jean-Christophe Eloy, CEO & President of Yole Développement

Market Trends, Geopolitical & Economic Outlook Panel : This session will focus on addressing market trends in the semiconductor industry, emerging applications, economic and geopolitical uncertainties and impact on the global supply chain in microelectronics packaging.

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