EPIC Meeting on Wafer Level Optics at SUSS MicroOptics
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The purpose of this meeting is to discuss the benefits and motivation of migrating towards wafer level manufacturing of optical diffractive, refractive or reflective components. The main goal of the meeting is to discuss applications in CMOS image sensors, automotive lighting, AR/VR headsets, medical, datacom, consumer electronics etc. between technology providers, system integrators and users. Some manufacturing processes will also be discussed including large area master fabrication using a step and repeat UV-NIL (ultra-violet nanomprint lithography) systems, the working stamp material and its fabrication. Furthermore, processes to evaluate the quality of the wafer level optics and lens stacking will be evaluated according to the lens-to-lens and wafer-to-wafer alignment accuracy, quantitative optical/surface measurements and lens shape fidelity, depending on each of the application fields.
Yole Développement will participate in the following:
“2D and 3D Imaging markets overview and Wafer Level Optics opportunities”
By Guillaume Girardin, Division Director, Photonics, Sensing and Display, Yole Développement
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