IC & Sensor Packaging Technology EXPO – 2019

Tradeshows & Conferences

Tokyo, Japan

logo ispAsia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services.

Exhibition specialised in packaging technologies for semiconductors, LEDs, power devices, MEMS device, etc. Here is the best place to meet Japanese & overseas engineers from semiconductor/sensor manufacturers.

Ask for a meeting and meet Yole Developpement’s team on our booth E26-20!

Contact: http://www.reedexpo.co.jp/en/Exhibitors/207274/IC-Sensor-Packaging-Technology-EXPO-ISP

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