Yole Group of Companies invites you to join us at iMAPS Advanced SiP Tehnology 2019.
IMAPS has established the Advanced System-in-Package conference to focus exclusively on innovative SiP technology developments, solutions and business trends. Advanced SiP 2019 will be a high-end event that combines the IMAPS System-in Package Conference and the 3D ASIP Conference (recognized as the premier conference on 2.5/3D ICs, focused on commercialization and infrastructure). Advanced SiP 2019 will offer cutting-edge presentations from scientists, technologists and business leaders across the globe in cellular, IoT, automotive, computing and networking market segments.
“Advanced SiP technology” is an umbrella term to cover a variety of SiP subsets, such as laminate/glass/ ceramic/silicon/leadframe based SiP, Fanout SiP, Heterogeneous integration, 2.5D/3D SiP and modules. Advanced SiP 2019 covers two major segments: microelectronic system design and system integration in a package.
The current trend is to integrate a full system or subsystem in an extremely miniaturized, smaller volume package structure with high functioning system performance, mechanical reliability, thermal management and high yield manufacturability.
Featuring two and a half days of technical sessions, panel discussions, exhibits and local networking activities, Advanced SiP 2019 will provide dynamic learning and technology updates on SiP trends and new engineering innovations from the industry’s global SiP leaders.
System Plus Consulting will participate in the following:
On June 25th, 2019 from 10:30am to 11:45am
Romain Fraux, CEO of System Plus Consulting