IMAPS Device Packaging 2021 – Online

Tradeshows & Conferences

Online

The 17th IMAPS Device Packaging annual conference returns in 2021 from Monday 12, to Thursday 15, April.

This conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

IMAPS DPC 2021 will focus on advanced electronics packaging, covering topics selected from:

  • 3D Integration
  • Fan-Out, Wafer Level Packaging & Flip Chip
  • Advanced Packaging & Emerging Materials for Automotive, 5G & Next Gen Application

Yole Développement will participate in the following:

3D Packaging from Edge to the Datacenter:  An Imperative for the next decade – Keynote Presentation

Vaibhav Trivedi, Senior Technology & Market analyst, Yole Développement

As Moore’s law become increasingly challenging to achieve for front-end transistor scaling, back-end packaging processes are becoming critical than ever before.  As the scaling continues beyond 7 nm and recent delays announced by Intel on 7 nm product line, it is evident that cost of scaling is becoming very significant especially at larger die sizes.  Top IDMs such as Intel, TSMC, and Samsung continue to search for advanced back-end solution to bridge the gap between front-end and back-end interconnect advancement.  3D packaging is a high-end heterogeneous solution platform that can significantly increase performance of the “chip stack” compare to discrete solutions.  The growth of 3D packaging technologies primarily driven by the giants such as Intel and TSMC has opened new equipment eco-system such as hybrid bonding that is a revolutionary leap in back-end IC packaging industry.  This presentation will cover recent products and markets targeted with 3D packaging solutions and provide an extensive overview of supply chain eco-system with projected market forecast.  It will also shed light on key players and status of their current 3D packaging platforms and products with potential challenges and promises that it provides.

Increasing role of glass in the semiconductor applications: Market, technology trends, supply chain evolution and challenges

Santosh Kumar, Principal Analyst and Director Packaging, Assembly & Substrates, Yole Développement

Over the last few years, glass has gained considerable interest for electronic components, due to its very attractive electrical, physical, and chemical properties, as well as its prospects for a relevant, cost-efficient solution. As of today, the application scope of glass substrates in the semiconductor field is broad and highly diversified. Glass material can adopt various functionalities within Integrated Circuit (IC) and semiconductor devices, such as MEMS actuators and sensors, CMOS Image Sensors (CIS), memory and logic, Radio Frequency (RF), power electronics, photonics, microfluidics devices as well as the Fan Out Wafer Level Packaging (FO WLP) technology platform. The demand for glass today is mostly driven by WL Capping and glass carriers, fueled mostly by MEMS, CIS and FO WLP. In the coming years, the availability of other glass functionalities such as TGV interposers, still perceived as immature, in conjunction with end-applications like RF devices, could be the driving force for growth. This will create new challenges and new technical developments along the way. Although emerging glass applications could reshape the glass semiconductor industry, the competitive landscape has remained almost the same over the last few years. The number of glass vendors able to deliver wafers and panels with the specifications the industry needs is quite limited. The top two players, Schott and Corning, are still leading the glass material market. For the last few years, they held more than 60% of the total glass wafer market. Other glass raw material and glass wafer processors vendors such as NEG, AGC, PlanOptik and Tecnisco have captured share in this market. This presentation will focus on the market and technological trends including supply chain and challenges of glass material in semiconductor field for both established and emerging application.

Yole Développement will be exhibiting with our experts on hand to answer questions and discuss your needs.

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