International Wafer-Level Packaging Conference – IWLPC – 2019

Tradeshows & Conferences

San Jose, California, USA

IWLPC - International Wafer Level Packaging Conference

SMTA and Chip Scale Review are pleased to announce the 16th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry’s most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing.

Yole Développement and System Plus Consulting will participate in the following:

“Advanced RF Packaging Technology Trends from WLP to 3D Integration Toward 5G and mmWave Applications”

On October 22nd, at Noon
By Stéphane Elisabeth, PhD, Costing Analyst Expert at System Plus Consulting

In addition, Yole Développement and System Plus Consutling will be exhibiting with our experts on hand to answer questions and discuss your needs.

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