MiNaPAD is a 2 days conference with an exhibition. The objective of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community: parallel technical sessions, poster sessions, an exhibition. The following topics will be addressed during MiNaPAD: Advanced Packaging, CAD and tools, Digital deep submicron, Innovative packaging, Materials, Emerging technologies, Assembly manufacturing, Reliability, Advanced interconnections.
Ask for a meeting and meet Yole Développement’s team on booth 6 !
Feel free to attend our presentation:
– “High End Performance Application key Driver for Advanced Packaging” on May 16 at 2:15PM
Emilie Jolivet, Director, Semiconductor & Software of Yole Développement
Abstract: F2017 was a tremendous year for the semiconductor industry and expectations are high for the next coming years. Driven by the adoption of more and more electronics components in end products, the semiconductor industry has been facing a very high demand. In this context, advanced packaging technology will become more and more preponderant, considering scaling and cost reduction will not be possible just by continuing to follow Moore’s law…