MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » which be held in Grenoble, France, on WTC congress center on May 22-23, 2019
MiNaPAD is a 2 days conference with an exhibition. The objective of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community:
parallel technical sessions
additional technical events (May 21, 2019)
Grenoble – Europe’s conveniently located technology cluster for semiconductor research, design and manufacturing – easy access to Lyon (1 hour), Geneva (2 hours), Paris (3 hours by high speed train– TGV) airports.
Yole Développement and System Plus Consulting will participate in the following:
“Packaging for the Automotive Industry”
On May 22nd, Session L: Market analysis at 2:55PM By Mario Ibrahim, Advanced Packaging Technolgy and Market Analyst at Yole Développement
“System-in-Package and heterogeneous integration: evolution or revolution?”
On May 23rd, Keynote at 3:20PM By Stéphane Elisabeth, PhD, Costing Analyst Expert at System Plus Consulting and Emilie Jolivet, Semiconductor & Software Division Director at Yole Développement
In addition, Yole Développement will be exhibitingwith our experts on hand to answer questions and discuss your needs.
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