NEPCON China 2019 will be held in Shanghai World Expo Exhibition and Convention Center from April 24 to 26, 2019. As an international event for the electronic manufacturing industry, it will focus on the display of equipment & technology of surface mount technology (SMT), soldering and dispensing, smart factory and automation, test and measurement, and new electronic materials. The Expo will attract more than 500 exhibitors and brands, displaying innovative solutions to more than 30,000 professional buyers from EMS/OEM/ODM factories of consumer electronics and hot industries and fields such as 5G, communication, smart home, IoT, automotive electronics and semiconductor packaging.
NEPCON China 2019 will specially launch innovative pavilion and conferences such as the Electronic Micro-Assembly & SiP Process Pavilion, the Electronic Micro-Assembly & SiP Process Conference, 2019 AWC Conference on Development and Testing Technologies for NEV Electromobility System and the Smart Manufacturing Dream Factory Conference, concurrently with the Smart Factory and Automation Technology Expo, to lead the future trend of smart manufacturing in the electronic industry. By participating in the NEPCON China, industrial well-known forums and high-end conferences, business recommendation and match-making services, and new product guide tour, the visitors can obtain new industry technologies, gain insight into product trends and achieve one-stop purchasing.
Yole Développement will participate in the following:
Keynote at the China Int’l Electronics Manufacturing Summit & Advanced Packaging and Micro-assembly Forum, on April 25th from 9:30AM to 10:00AM
Santosh Kumar, Principal Analyst & Director Packaging, Assembly & Substrates, Yole Korea, Semiconductor & Software Division at Yole Développement
In addition, Yole Développement will be exhibiting at the Electronic Micro-assembly and SiP Process Pavilion with our experts on hand to answer questions and discuss your needs.