This exhibition is gathering of all kinds of products, technologies and services that can contribute to the miniaturization and thinning of cutting-edge devices such as Semiconductors, LED, Power Devices, Sensors and MEMS.
Meet Yole Developpement’s team :
Assist to the presentations of Yole’s team on:
– “MEMS Sensor and IC advanced package: how automotive and AI will challenge packaging business” on January 17 at 9:30AM – Session ISP-1
Emilie Jolivet, Technology & Market analyst from Yole Développement