NEPCON Japan : IC & Sensor Packaging Technology EXPO

Tradeshows & Conferences

Tokyo, Japan

ISP 2018 yole developpement nepconjapanThe 19th edition of the IC & Sensor Packaging Technology EXPO is Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services.

This exhibition is gathering of all kinds of products, technologies and services that can contribute to the miniaturization and thinning of cutting-edge devices such as Semiconductors, LED, Power Devices, Sensors and MEMS.

 

 

Meet Yole Developpement’s team :

picto micro speaker blue Assist to the presentations of Yole’s team on:

– MEMS Sensor and IC advanced package: how automotive and AI will challenge packaging business” on January 17 at 9:30AM – Session ISP-1
Emilie Jolivet, Technology & Market analyst from Yole Développement

 

Ask for a meeting!

Contact: http://www.nepconjapan.jp/en/About/ICP/

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