NEPCON Japan : IC & Sensor Packaging Technology EXPO
Tradeshows & Conferences
Home > Events > NEPCON Japan : IC & Sensor Packaging Technology EXPO
The 19th edition of the IC & Sensor Packaging Technology EXPO is Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services.
This exhibition is gathering of all kinds of products, technologies and services that can contribute to the miniaturization and thinning of cutting-edge devices such as Semiconductors, LED, Power Devices, Sensors and MEMS.
Meet Yole Developpement’s team :
Assist to the presentations of Yole’s team on:
– “MEMS Sensor and IC advanced package: how automotive and AI will challenge packaging business” on January 17 at 9:30AM – Session ISP-1 Emilie Jolivet, Technology & Market analyst from Yole Développement
We want you to experience the full power of i-Micronews.com, and we need your consent to do so
Click “I agree” below to consent to the use of this technology.