Power and RF Packaging Virtual Forums – presented by Yole Développement and CITC

Yole Events


Packaging technologies are expanding the boundaries of RF and power applications

Yole Développement, a renowned market research company, and CITC, an innovation center with extensive technical and market experience, invite you to take part in two collaborative online forums covering power packaging and RF packaging. Challenges have emerged for both applications concerning the integration of devices and systems – and to ensure these applications’ continued evolution and activity development, packaging is the strategic answer.

With increased functionalities, companies must refine their ability to integrate more and more components on the same die while proposing an exceptionally reliable final product.
Save the date in your agenda today and let’s meet online on November 24 and December 1, 2020!

Speakers have been confirmed – Discover who they are for each forum below!

Our Program

Speakers of Power and RF Packaging Forum

  • Shijo Nagao

    Associate Professor - Osaka University / Yamato Scientific - Power Forum

  • Ronald Eisele

    Professor - University of Applied Science, Fachhochschule Kiel - Power Forum

  • Braham Ferreira

    Professor in Power Electronics, Electrical Engineering, Mathematics & Computer Science - University of Twente - Power Forum

  • Christoph F. Bayer

    Group Manager Packaging for Power Modules - Fraunhofer Institute for Integrated Systems and Device Technology IISB - Power Forum

  • Shaun Bowers

    VP, Mainstream Advanced Package Integration - Amkor Technology - Power Forum

  • Alexander Streibel

    Senior Application Engineer - Danfoss - Power Forum

  • Jussi Säily

    Senior Scientist, VTT Technical Research Centre of Finland - RF Forum

  • Hanwen Zhang

    Global Product Manager of Advanced Packaging Solder Materials, Heraeus - RF Forum

  • Mario Ibrahim

    Senior Market & Technology Analyst, AT&S - RF Forum

  • Michael Gallagher

    R&D Fellow, DuPont Electronics and Imaging - RF Forum

  • Marco Spirito

    Associate Professor, TU Delft - RF Forum

  • Ram Trichur

    Global Market Segment Head, Semiconductor Packaging Materials, Henkel - RF Forum

Sponsored by



Chip Scale Review is the preeminent internationally-delivered magazine leading the way in middle-of-line (MOL), back-end-of-line (BEOL), and associated technologies for advanced semiconductors. Engineers, engineering managers, R&D technologists, scientists, and executives at key semiconductor companies are just a few of the broad array of industry experts and insiders who read CSR. Our readers require in-depth data and information to stay current on technological advances and their applications.

The magazine showcases industry leaders with technical articles along with executive interviews, market forecasts from veteran industry analysts, reports on research institutions, events and reviews, and international supplier directories of equipment manufacturers, materials suppliers and service providers.


MWJ Logo


Microwave Journal provides leading-edge technical content for RF, microwave and wireless engineers worldwide. MWJ the magazine reaches 50,000 qualified subscribers with practical design application articles for working engineers. Microwave Journal delivers the latest news, events, webinars, whitepapers, videos and newsletters to RF/microwave professionals. EDI CON China and USA events bring industry and engineers together for information exchange and education. For over 60 years, Microwave Journal has been THE resource for engineers who are developing infrastructure for the next-generation of wireless and defense technologies.


Co-organized by

Yole Développement

Yole Développement provides market researchtechnology analysisstrategy consultingtargeted media, and financial advisory services.

With a strong focus on emerging applications using silicon and/or micro manufacturing since 1998, Yole Développement has expanded to include more than 80 collaborators worldwide covering Photonics – Lighting – Imaging – Sensing & Actuating – Display – RF Devices & Technologies – Compound Semiconductors & Emerging Materials – Power Electronics – Batteries & Energy Management – Semiconductor Packaging and Substrates – Semiconductor Manufacturing – Memory – Computing and Software.

The market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting, Blumorpho and PISEO – all part of the Yole Group of Companies-, support industrial companies, investors and R&D organizations worldwide to follow technology trends to grow their business and help them understand the 6 specific markets.

More info: www.yole.fr


CITC is a non-profit innovation center that specializes in heterogeneous integration and advanced packaging technology. It is a place where companies, research and educational institutes work together on bridging the gap from academics to industry and create new and better solutions. Therefore we offer access to innovation, infrastructure and education.

Access to Innovation
Organizing and running innovation programs in the field of chip packaging and integration technology.

Access to Infrastructure
Providing access to lab infrastructure as one of CITC’s key capabilities.

Access to Education
Sharing knowledge about integrated chip technology and its applications.

More info: www.citc.org

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