Power and RF Packaging Virtual Forums – presented by Yole Développement and CITC

Yole Events

Online

Packaging technologies are expanding the boundaries of RF and power applications

Yole Développement, a renowned market research company, and CITC, an innovation center with extensive technical and market experience, invite you to take part in two collaborative online forums covering power packaging and RF packaging. Challenges have emerged for both applications concerning the integration of devices and systems – and to ensure these applications’ continued evolution and activity development, packaging is the strategic answer.

With increased functionalities, companies must refine their ability to integrate more and more components on the same die while proposing an exceptionally reliable final product.
Save the date in your agenda today and let’s meet online on November 24 and December 1, 2020!

Co-organized by

Yole Développement

Yole Développement provides market researchtechnology analysisstrategy consultingtargeted media, and financial advisory services.

With a strong focus on emerging applications using silicon and/or micro manufacturing since 1998, Yole Développement has expanded to include more than 80 collaborators worldwide covering Photonics – Lighting – Imaging – Sensing & Actuating – Display – RF Devices & Technologies – Compound Semiconductors & Emerging Materials – Power Electronics – Batteries & Energy Management – Semiconductor Packaging and Substrates – Semiconductor Manufacturing – Memory – Computing and Software.

The market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting, Blumorpho and PISEO – all part of the Yole Group of Companies-, support industrial companies, investors and R&D organizations worldwide to follow technology trends to grow their business and help them understand the 6 specific markets.

More info: www.yole.fr

CITC

CITC is a non-profit innovation center that specializes in heterogeneous integration and advanced packaging technology. It is a place where companies, research and educational institutes work together on bridging the gap from academics to industry and create new and better solutions. Therefore we offer access to innovation, infrastructure and education.

Access to Innovation
Organizing and running innovation programs in the field of chip packaging and integration technology.

Access to Infrastructure
Providing access to lab infrastructure as one of CITC’s key capabilities.

Access to Education
Sharing knowledge about integrated chip technology and its applications.

More info: www.citc.org

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