Power and RF Packaging Virtual Forums – presented by Yole Développement and CITC

Yole Events

Online

Packaging technologies are expanding the boundaries of RF and power applications

Yole Développement, a renowned market research company, and CITC, an innovation center with extensive technical and market experience, invite you to take part in two collaborative online forums covering power packaging and RF packaging. Challenges have emerged for both applications concerning the integration of devices and systems – and to ensure these applications’ continued evolution and activity development, packaging is the strategic answer.

With increased functionalities, companies must refine their ability to integrate more and more components on the same die while proposing an exceptionally reliable final product.
Save the date in your agenda today and let’s meet online on November 24 and December 1, 2020!

POWER PACKAGING VIRTUAL FORUM
Tuesday November 24th, 2020

How packaging energizes the needs of power applications

Power electronics plays a major role in today’s fast-paced world. Its key driving factors include electrical power-conversion optimization and expansion, driven by electrification trends in transportation, CO2 emission reduction goals, the development of clean electricity sources, and industrialization.

Choosing the right packaging solution is obviously key for power-related applications where reliability and safety play a major role.

Due to stronger requirements, a higher added-value for customers, and a greater desire for competitive differentiation, most innovative packaging solutions focus on power modules and integrated devices like system-on-chip (SoC) and system-in-package (SiP). Whereas in the past packaging needs were driven by industrial applications, today they are increasingly driven by electric and hybrid electric vehicles (EV/HEV). Hence, power module packaging solutions are moving towards high-performance materials and a reduction in the number of layers, size, and interfaces – all while conserving electrical, thermal, and mechanical characteristics.

Intended topics for the Power Packaging Forum are:

High thermal performance die-attach
Packaging technology for power electronics
New materials and technologies for power packaging
Global developments affecting power packaging technology

RF PACKAGING VIRTUAL FORUM
Tuesday December 1st, 2020

New market demands create a strong connection between packaging & RF

RF electronics is currently experiencing strong growth, driven mostly by 5G requirements and connected devices. Examples of RF electronics include connectivity modules in smartphones and smartwatches, and radar for ADAS vehicles. These are growing systems requiring innovative packaging solutions which simultaneously address specifications for cost, form factor, and performance. Other challenges related to signal integrity and low power consumption are starting to be addressed by the industry, with new solutions on the way.

Innovation is needed for the design and materials used, thus pushing the supply chain to explore new developments and more complex business models. The diversity of RF components (power amplifier, filters, switches, antennas, etc.) requires the use of several levels of integration as well as different packaging platforms and interconnects (TSV, wirebond, etc.).

Intended topics for the RF Packaging Forum are:

Package simulation and design for RF (20 – 120 GHz)
Antenna-in-package / antenna-on-chip / antenna-on-substrate / antenna-on-board
New materials and technologies for RF packaging
Global developments affecting RF packaging technology

SPONSORSHIP OPPORTUNITIES

Sponsored by

MEDIA SPONSOR

Chip Scale Review is the preeminent internationally-delivered magazine leading the way in middle-of-line (MOL), back-end-of-line (BEOL), and associated technologies for advanced semiconductors. Engineers, engineering managers, R&D technologists, scientists, and executives at key semiconductor companies are just a few of the broad array of industry experts and insiders who read CSR. Our readers require in-depth data and information to stay current on technological advances and their applications.

The magazine showcases industry leaders with technical articles along with executive interviews, market forecasts from veteran industry analysts, reports on research institutions, events and reviews, and international supplier directories of equipment manufacturers, materials suppliers and service providers.

www.chipscalereview.com

MEDIA SPONSOR

Microwave Journal provides leading-edge technical content for RF, microwave and wireless engineers worldwide. MWJ the magazine reaches 50,000 qualified subscribers with practical design application articles for working engineers. Microwave Journal delivers the latest news, events, webinars, whitepapers, videos and newsletters to RF/microwave professionals. EDI CON China and USA events bring industry and engineers together for information exchange and education. For over 60 years, Microwave Journal has been THE resource for engineers who are developing infrastructure for the next-generation of wireless and defense technologies.

www.microwavejournal.com

Co-organized by

Yole Développement provides market research, technology analysis, strategy consulting, targeted media, and financial advisory services.

With a strong focus on emerging applications using silicon and/or micro manufacturing since 1998, Yole Développement has expanded to include more than 80 collaborators worldwide covering Photonics – Lighting – Imaging – Sensing & Actuating – Display – RF Devices & Technologies – Compound Semiconductors & Emerging Materials – Power Electronics – Batteries & Energy Management – Semiconductor Packaging and Substrates – Semiconductor Manufacturing – Memory – Computing and Software.

The market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting, Blumorpho and PISEO – all part of the Yole Group of Companies-, support industrial companies, investors and R&D organizations worldwide to follow technology trends to grow their business and help them understand the 6 specific markets.

More info: www.yole.fr

CITC is a non-profit innovation center that specializes in heterogeneous integration and advanced packaging technology. It is a place where companies, research and educational institutes work together on bridging the gap from academics to industry and create new and better solutions. Therefore we offer access to innovation, infrastructure and education.

Access to Innovation
Organizing and running innovation programs in the field of chip packaging and integration technology.

Access to Infrastructure
Providing access to lab infrastructure as one of CITC’s key capabilities.

Access to Education
Sharing knowledge about integrated chip technology and its applications.

More info: www.citc.org

#Packaging #Power Electronics #RF Devices And Technology

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