How packaging energizes the needs of power applications
Power electronics plays a major role in today’s fast-paced world. Its key driving factors include electrical power-conversion optimization and expansion, driven by electrification trends in transportation, CO2 emission reduction goals, the development of clean electricity sources, and industrialization.
Choosing the right packaging solution is obviously key for power-related applications where reliability and safety play a major role.
Due to stronger requirements, a higher added-value for customers, and a greater desire for competitive differentiation, most innovative packaging solutions focus on power modules and integrated devices like system-on-chip (SoC) and system-in-package (SiP). Whereas in the past packaging needs were driven by industrial applications, today they are increasingly driven by electric and hybrid electric vehicles (EV/HEV). Hence, power module packaging solutions are moving towards high-performance materials and a reduction in the number of layers, size, and interfaces – all while conserving electrical, thermal, and mechanical characteristics.
POWER PACKAGING VIRTUAL FORUM
Tuesday November 24th, 2020 – 2:00PM – 5:00PM CET
- Shijo Nagao, Associate Professor – Osaka University / Yamato Scientific
- Ronald Eisele, Professor – Fachhochschule Kiel, Institut für Mechatronik
- Braham Ferreira, Professor in Power Electronics, Electrical Engineering, Mathematics & Computer Science – University of Twente
- Christoph F. Bayer, Group Manager Packaging for Power Modules – Fraunhofer Institute for Integrated Systems and Device Technology IISB
- Shaun Bowers, VP, Mainsteam Advanced Package Integration – Amkor Technology
- Alexander Streibel, Senior Application Engineer – Danfoss
Sponsorship of these Yole Développement- and CITC-designed forums represents an invaluable opportunity for visibility amongst the industry’s key players and decision makers. We offer several different sponsorship options, so discover our offers now and pursue the one that best suits your company’s needs.
For more information, pleasea contact Camille Veyrier (email@example.com)
NOVEMBER 24, 2020
Welcome and introduction
Program Manager Power Packaging, CITC
Yole Développement presentation
Division Director, Power & Wireless, Yole Développement
Speaker 1: Osaka University / Yamato Scientific Co., Ltd.
Evaluating thermal properties of metalized ceramic substrates for power module packaging
Mr. Nagao Shijo
Speaker 2: Fachhochschule Kiel, Institut für Mechatronik
Inorganic encapsulation of power ribbons and wire bonds
Mr. Ronald Eisele
Speaker 3: University of Twente
Fabrication plant for Power Electronic System In Package
Mr. Braham Ferreira
Professor in Power Electronics, Electrical Engineering, Mathematics & Computer Science
Speaker 4: Fraunhofer Institute for Integrated Systems and Device Technology IISB
Future Packaging Technologies in Power Electronic Modules
Mr. Christoph F. Bayer
Group Manager Packaging for Power Modules
Speaker 5: Amkor Technology
Chip Scale Power Transistor Packaging
Mr. Shaun Bowers
VP, Mainstream Advanced Package Integration
Speaker 6: Danfoss
New Packaging Technologies boost drive train efficiency
Mr. Alexander Streibel
Senior Application Engineer
Thanking, summarize and provide follow up information
Speakers of Power Packaging Forum
Associate Professor - Osaka University / Yamato Scientific
Professor - University of Applied Science, Fachhochschule Kiel
Professor in Power Electronics, Electrical Engineering, Mathematics & Computer Science - University of Twente
Christoph F. Bayer
Group Manager Packaging for Power Modules - Fraunhofer Institute for Integrated Systems and Device Technology IISB
VP, Mainstream Advanced Package Integration - Amkor Technology
Senior Application Engineer - Danfoss
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