Power Packaging Virtual Forums – presented by Yole Développement and CITC

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How packaging energizes the needs of power applications

Power electronics plays a major role in today’s fast-paced world. Its key driving factors include electrical power-conversion optimization and expansion, driven by electrification trends in transportation, CO2 emission reduction goals, the development of clean electricity sources, and industrialization.

Choosing the right packaging solution is obviously key for power-related applications where reliability and safety play a major role.

Due to stronger requirements, a higher added-value for customers, and a greater desire for competitive differentiation, most innovative packaging solutions focus on power modules and integrated devices like system-on-chip (SoC) and system-in-package (SiP). Whereas in the past packaging needs were driven by industrial applications, today they are increasingly driven by electric and hybrid electric vehicles (EV/HEV). Hence, power module packaging solutions are moving towards high-performance materials and a reduction in the number of layers, size, and interfaces – all while conserving electrical, thermal, and mechanical characteristics.

POWER PACKAGING VIRTUAL FORUM
Tuesday November 24th, 2020 – 2:00PM – 5:00PM CET

Confirmed speakers:

  • Shijo Nagao, Associate Professor – Osaka University / Yamato Scientific
  • Ronald Eisele, Professor – Fachhochschule Kiel, Institut für Mechatronik
  • Braham Ferreira, Professor in Power Electronics, Electrical Engineering, Mathematics & Computer Science – University of Twente
  • Christoph F. Bayer, Group Manager Packaging for Power Modules – Fraunhofer Institute for Integrated Systems and Device Technology IISB
  • Shaun Bowers, VP, Mainsteam Advanced Package Integration – Amkor Technology
  • Alexander Streibel, Senior Application Engineer – Danfoss

Our Program

Speakers of Power Packaging Forum

  • Shijo Nagao

    Associate Professor - Osaka University / Yamato Scientific

  • Ronald Eisele

    Professor - University of Applied Science, Fachhochschule Kiel

  • Braham Ferreira

    Professor in Power Electronics, Electrical Engineering, Mathematics & Computer Science - University of Twente

  • Christoph F. Bayer

    Group Manager Packaging for Power Modules - Fraunhofer Institute for Integrated Systems and Device Technology IISB

  • Shaun Bowers

    VP, Mainstream Advanced Package Integration - Amkor Technology

  • Alexander Streibel

    Senior Application Engineer - Danfoss

Sponsored by

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MEDIA SPONSOR

Chip Scale Review is the preeminent internationally-delivered magazine leading the way in middle-of-line (MOL), back-end-of-line (BEOL), and associated technologies for advanced semiconductors. Engineers, engineering managers, R&D technologists, scientists, and executives at key semiconductor companies are just a few of the broad array of industry experts and insiders who read CSR. Our readers require in-depth data and information to stay current on technological advances and their applications.

The magazine showcases industry leaders with technical articles along with executive interviews, market forecasts from veteran industry analysts, reports on research institutions, events and reviews, and international supplier directories of equipment manufacturers, materials suppliers and service providers.

www.chipscalereview.com

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MEDIA SPONSOR

Microwave Journal provides leading-edge technical content for RF, microwave and wireless engineers worldwide. MWJ the magazine reaches 50,000 qualified subscribers with practical design application articles for working engineers. Microwave Journal delivers the latest news, events, webinars, whitepapers, videos and newsletters to RF/microwave professionals. EDI CON China and USA events bring industry and engineers together for information exchange and education. For over 60 years, Microwave Journal has been THE resource for engineers who are developing infrastructure for the next-generation of wireless and defense technologies.

www.microwavejournal.com

Co-organized by

Yole Développement provides market researchtechnology analysisstrategy consultingtargeted media, and financial advisory services.

With a strong focus on emerging applications using silicon and/or micro manufacturing since 1998, Yole Développement has expanded to include more than 80 collaborators worldwide covering Photonics – Lighting – Imaging – Sensing & Actuating – Display – RF Devices & Technologies – Compound Semiconductors & Emerging Materials – Power Electronics – Batteries & Energy Management – Semiconductor Packaging and Substrates – Semiconductor Manufacturing – Memory – Computing and Software.a

The market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting, Blumorpho and PISEO – all part of the Yole Group of Companies-, support industrial companies, investors and R&D organizations worldwide to follow technology trends to grow their business and help them understand the 6 specific markets.

More info: www.yole.fr

CITC

CITC is a non-profit innovation center that specializes in heterogeneous integration and advanced packaging technology. It is a place where companies, research and educational institutes work together on bridging the gap from academics to industry and create new and better solutions. Therefore we offer access to innovation, infrastructure and education.

Access to Innovation
Organizing and running innovation programs in the field of chip packaging and integration technology.

Access to Infrastructure
Providing access to lab infrastructure as one of CITC’s key capabilities.

Access to Education
Sharing knowledge about integrated chip technology and its applications.

More info: www.citc.org

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