New market demands create a strong connection between packaging & RF
RF electronics is currently experiencing strong growth, driven mostly by 5G requirements and connected devices. Examples of RF electronics include connectivity modules in smartphones and smartwatches, and radar for ADAS vehicles. These are growing systems requiring innovative packaging solutions which simultaneously address specifications for cost, form factor, and performance. Other challenges related to signal integrity and low power consumption are starting to be addressed by the industry, with new solutions on the way.
Innovation is needed for the design and materials used, thus pushing the supply chain to explore new developments and more complex business models. The diversity of RF components (power amplifier, filters, switches, antennas, etc.) requires the use of several levels of integration as well as different packaging platforms and interconnects (TSV, wirebond, etc.).
RF PACKAGING VIRTUAL FORUM
Tuesday December 1st, 2020 – 2:00PM – 5:00PM CET
- Jussi Säily, Senior Scientist – VTT Technical Research Centre of Finland
- Hanwen Zhang, Global Product Manager of Advanced Packaging Solder Materials – Heraeus
- Mario Ibrahim, Senior Market & Technology Analyst – AT&S
- Michael Gallagher, R&D Fellow – Advanced Packaging Technologies – DuPont Electronics and Imaging
- Marco Spirito, Associate Professor – TU Delft
- Ram Trichur, Global Market Segment Head, Semiconductor Packaging Materials – Henkel
Sponsorship of these Yole Développement- and CITC-designed forums represents an invaluable opportunity for visibility amongst the industry’s key players and decision makers. We offer several different sponsorship options, so discover our offers now and pursue the one that best suits your company’s needs.
For more information, please contact Camille Veyrier (email@example.com)
DECEMBER 1, 2020
Welcome and introduction
Program Manager RF Chip Packaging, CITC
Yole Développement presentation
Division Director, Semiconductor, Manufacturing & Computing, Yole Développement
Speaker 1: VTT Technical Research Centre of Finland
Design of advanced mm-wave phased arrays
Speaker 2: Heraeus
Challenges of Solder Joint Reliability in RF SiP Modules
Global Product Manager of Advanced Packaging Solder Materials
Speaker 3: AT&S
5G is a Megatrend no one is questioning that!
Senior Market & Technology Analyst
Speaker 4: DuPont Electronics and Imaging
Dielectric Materials for High Speed and High Frequency Applications
R&D Fellow – Advanced Packaging Technologies
Speaker 5: TU Delft
Dielectric characterization for next generation RF and mm-wave packages
Speaker 6: Henkel
Critical Materials for 5G and RF Semiconductor Packaging
Global Market Segment Head, Semiconductor Packaging Materials
Thanking, summarize and provide follow up information
Speakers of RF Packaging Forum
Senior Scientist, VTT Technical Research Centre of Finland
Global Product Manager of Advanced Packaging Solder Materials, Heraeus
Senior Market & Technology Analyst, AT&S
R&D Fellow, DuPont Electronics and Imaging
Associate Professor, TU Delft - RF Forum
Global Market Segment Head, Semiconductor Packaging Materials, Henkel - RF Forum
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CITC is a non-profit innovation center that specializes in heterogeneous integration and advanced packaging technology. It is a place where companies, research and educational institutes work together on bridging the gap from academics to industry and create new and better solutions. Therefore we offer access to innovation, infrastructure and education.
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Organizing and running innovation programs in the field of chip packaging and integration technology.
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Providing access to lab infrastructure as one of CITC’s key capabilities.
Access to Education
Sharing knowledge about integrated chip technology and its applications.
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