RF Packaging Virtual Forums – presented by Yole Développement and CITC

Yole Events

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New market demands create a strong connection between packaging & RF

RF electronics is currently experiencing strong growth, driven mostly by 5G requirements and connected devices. Examples of RF electronics include connectivity modules in smartphones and smartwatches, and radar for ADAS vehicles. These are growing systems requiring innovative packaging solutions which simultaneously address specifications for cost, form factor, and performance. Other challenges related to signal integrity and low power consumption are starting to be addressed by the industry, with new solutions on the way.

Innovation is needed for the design and materials used, thus pushing the supply chain to explore new developments and more complex business models. The diversity of RF components (power amplifier, filters, switches, antennas, etc.) requires the use of several levels of integration as well as different packaging platforms and interconnects (TSV, wirebond, etc.).

RF PACKAGING VIRTUAL FORUM
Tuesday December 1st, 2020 – 2:00PM – 5:00PM CET

Confirmed speakers:

  • Jussi Säily, Senior Scientist – VTT Technical Research Centre of Finland
  • Hanwen Zhang, Global Product Manager of Advanced Packaging Solder Materials – Heraeus
  • Mario Ibrahim, Senior Market & Technology Analyst – AT&S
  • Michael Gallagher, R&D Fellow – Advanced Packaging Technologies – DuPont Electronics and Imaging
  • Marco Spirito, Associate Professor – TU Delft
  • Ram Trichur, Global Market Segment Head, Semiconductor Packaging Materials – Henkel

Our Program

Speakers of RF Packaging Forum

  • Jussi Säily

    Senior Scientist, VTT Technical Research Centre of Finland

  • Hanwen Zhang

    Global Product Manager of Advanced Packaging Solder Materials, Heraeus

  • Mario Ibrahim

    Senior Market & Technology Analyst, AT&S

  • Michael Gallagher

    R&D Fellow, DuPont Electronics and Imaging

  • Marco Spirito

    Associate Professor, TU Delft - RF Forum

  • Ram Trichur

    Global Market Segment Head, Semiconductor Packaging Materials, Henkel - RF Forum

Sponsored by

CSR_logo_2019

MEDIA SPONSOR

Chip Scale Review is the preeminent internationally-delivered magazine leading the way in middle-of-line (MOL), back-end-of-line (BEOL), and associated technologies for advanced semiconductors. Engineers, engineering managers, R&D technologists, scientists, and executives at key semiconductor companies are just a few of the broad array of industry experts and insiders who read CSR. Our readers require in-depth data and information to stay current on technological advances and their applications.

The magazine showcases industry leaders with technical articles along with executive interviews, market forecasts from veteran industry analysts, reports on research institutions, events and reviews, and international supplier directories of equipment manufacturers, materials suppliers and service providers.

www.chipscalereview.com

MWJ Logo

MEDIA SPONSOR

Microwave Journal provides leading-edge technical content for RF, microwave and wireless engineers worldwide. MWJ the magazine reaches 50,000 qualified subscribers with practical design application articles for working engineers. Microwave Journal delivers the latest news, events, webinars, whitepapers, videos and newsletters to RF/microwave professionals. EDI CON China and USA events bring industry and engineers together for information exchange and education. For over 60 years, Microwave Journal has been THE resource for engineers who are developing infrastructure for the next-generation of wireless and defense technologies.

www.microwavejournal.com

Co-organized by

Yole Développement

Yole Développement provides market researchtechnology analysisstrategy consultingtargeted media, and financial advisory services.

With a strong focus on emerging applications using silicon and/or micro manufacturing since 1998, Yole Développement has expanded to include more than 80 collaborators worldwide covering Photonics – Lighting – Imaging – Sensing & Actuating – Display – RF Devices & Technologies – Compound Semiconductors & Emerging Materials – Power Electronics – Batteries & Energy Management – Semiconductor Packaging and Substrates – Semiconductor Manufacturing – Memory – Computing and Software.

The market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting, Blumorpho and PISEO – all part of the Yole Group of Companies-, support industrial companies, investors and R&D organizations worldwide to follow technology trends to grow their business and help them understand the 6 specific markets.

More info: www.yole.fr

CITC

CITC is a non-profit innovation center that specializes in heterogeneous integration and advanced packaging technology. It is a place where companies, research and educational institutes work together on bridging the gap from academics to industry and create new and better solutions. Therefore we offer access to innovation, infrastructure and education.

Access to Innovation
Organizing and running innovation programs in the field of chip packaging and integration technology.

Access to Infrastructure
Providing access to lab infrastructure as one of CITC’s key capabilities.

Access to Education
Sharing knowledge about integrated chip technology and its applications.

More info: www.citc.org

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