The Semicon Europa is one of the largest international trade fairs for semiconductor equipment, materials and services in Europe.
The exhibition focuses on the critical issues and challenges in the field of microelectronics. Companies providing equipment, materials and services for the manufacturing of semiconductors including wafer manufacturing, test and packaging will be offered its own platform. This fair shows the latest products and innovations of the semiconductor technology, the centerpiece of the exhibition, such as thin-film and processor technology, PV systems and their materials as well as solar panels and displays. Here, particular emphasis is placed on the needs of the steadily increasing applications market, calling for the development of special materials, packaging and testing, as well as innovative structures and processes. The Semicon Europa is Europe’s leading showcase for technologies that are at the cutting edge of the microelectronics industry and highlights the areas of research and development. As an information and communication platform it offers high-caliber technical conferences, forums and programs and excellent networking opportunities.
The Semicon Europa will take place on 4 days from Tuesday, 12. November to Friday, 15. November 2019 in Munich.
Yole Développement will participate in the following:
Polymeric Materials for Advanced Packaging
On November 12, 2019 at 1:10PM during the Strategic Materials Conference
Amandine Pizzagalli, Technology & Market Analyst, Semiconductor Manufacturing at Yole Développement
Driven by movements towards further miniaturization and higher functionalities, megatrend applications like artificial intelligence (AI), 5G, and augmented reality (AR)/virtual reality (VR) are creating huge business opportunities and contributing to the growth of AP applications. Indeed, these megatrend applications are fueling the next generation of AP platforms (high-density FOWLP, 3D stacked TSV memory, WLCSP, and flip-chip), which have reached a new level of complexity and now demand higher integration-level requirements. These lofty standards will strongly influence the increasing demand for advanced materials with new technical specifications, in order to achieve better performance.
Polymeric materials are primarily used to protect printed wiring boards (PWB) from moisture, handling, and environmental influences. However, over the last few years polymeric materials have attracted significant interest in the microelectronics field, and have already found integration in major process steps: RDL, bump/UBM, through-silicon vias (TSV), and assembly levels, as well as at the bonding interface.
This presentation will provide a comprehensive analysis of the different existing polymeric materials used for Advanced Packaging as well as their status. In addition, key technical trends, requirements and challenges regarding the polymeric materials applied at each advanced packaging process step will be addressed. A technology roadmap showing the future steps for these polymeric materials solutions as well as market forecast, competitive landscape of the major material suppliers will be covered.
5G’s impact on RF Front-End: from telecom infrastructure to hand sets
On November 12, 2019 during the Technologies for Communication – TechARENA
Claire Troadec, Division Director, Power & Wireless at Yole Développement
The telecom infrastructure market has not moved much in the past decade interms of the value of operators’ investments. Customer pricingalsokeepsdecreasing, and building new infrastructure keeps showing smaller and smallerreturns oninvestments for telecomoperators. In this context, an attempt tocreate new markets and enlargeoperators’ reachto customersbeyond hand setscreated 5G.
Theglobal landscape at network level willnotmove much before 2025. But it will definitely change in terms of technology and antenna systems,thus completely restructuring the radiofrequency (RF) component industry. On one hand frequencies are going from less than 3 GHzto up to 6 GHz for macro deployments, while small cells exploit millimetre-wavelengths(mm-waves).MeanwhileRF line power levels in front-ends will decrease from a few hundred watts to down to a few watts in macro site antenna systems, thanks to massive MIMO and active antennasystems implementation.
At Hand set level, the main phone manufacturers differentiate from each other on the RF field by adopting either an integrated or a discrete approach. The market leaders Samsung, Apple, as well as smaller OEMs such as Sony, LG, Google or ZTE are moving towards integration using complex RF modules from Broadcom, Skyworks, Qorvo, Qualcomm and Murata, while the markets challengers, Huawei, Xiaomi, Oppo and Vivo, which drive as much volume as the market leaders, differentiate by favouring a discrete approach whenever possible.
In our presentation, we will review how 5G is reshaping the RF Front-End industry. We will explain the positioning of the maincomponentand modulesuppliers and review the technology mix needed to support 5G (Bulk Silicon, SiGe, GaAs, RFSOI, GaN,…) both at Telecom Infrastructure level and Hand set level.
How next generation cars will impact the automotive industry?
On November 13, 2019 at 9:55AM during the SMART Transportation Forum
Pierrick Boulay, Technology & Market Analyst, Solid-state Lighting at Yole Développement
A vision shared by OEMs and Tier-1s is that next generation of cars will be more and more electric, autonomous and connected. To achieve these goals, automotive players will have to work on the electrification of vehicles that can be hybrid or 100% electric. They will also have to develop and integrate sensors like radars, cameras and LiDARs to increase the level of autonomy. Cars will be increasingly connected meaning that more and more software and AI will be needed as well as technology to connect cars to their environment.
Stricter emission regulations, lower battery costs, and increasing consumer acceptance will create new and strong momentum for penetration of electrified vehicles in the coming years. The speed of adoption will be determined by the interaction of consumer pull and regulatory push, which will vary strongly at the regional and local level.
The autonomous trend is pushed by the development of sensors to monitor the surroundings of the vehicle. To do that, sensors are continuously developed to increase resolution, frame rate and dynamic range for cameras. Radar manufacturers have also released products from short-range to long-range detection and new entrants are working on 4D radars to increase the level of resolution. Finally, the interest into LiDAR sensors is continuously increasing with different technologies being pushed by manufacturers.
Finally all these sensors will need higher level of computation as the amount of data generated will boom in the next years. Therefore, the artificial intelligence is slowly but surely invading the automotive ecosystem through autonomous cars and infotainment applications/systems. On the connectivity side, V2X, pushed by the development of 4G/5G-based cellular communication, provides direct communication from the car to other vehicles and infrastructure, and does not involve network operators in the process.
5G enabler : Advanced Packaging
On November 12, 2019 at 12:40PM during the Advanced Packaging Conference
Emilie Jolivet, Division Director, Semiconductor & Software at Yole Développement
5G will totally redefine how the radio frequency (RF) front-end interacts in-between the network and the modem and the new RF bands, sub-6 GHz, and mm-wave pose big challenges for the industry. LTE evolution has led to complex architecture in today’s mobile phones, mostly due to carrier aggregation and RF’s board area and available antenna space have been reduced, leading to a densification trend with more handset OEMs adopting power amplifier modules and implementing new technics, i.e. antenna-sharing between LTE and WiFi. More densification in front-end modules will be required to enable new band integration and without tight integration 5G NR in the mmWave spectrum won’t be able to deliver the multi-gigabit speeds that is the key USP of 5G. Advanced multi die SiP packaging holds a large set of key technologies to address all flavors of 5G requirements that will enable its implementation in mobile.Advanced packaging represents an opportunity to increase end-product value offering advantages both in the scaling and functional roadmaps. Fan-Out platforms are increasingly viewed as one of the top options amongst leading package technologies. Fan-Out Packaging technology is not only a bridge to the CPI mismatch in pitch size but it is also a solution for functional performance and package dimension. Fan-Out packaging is essentially adopted in Radar for Automotive, APE for Smartphones and now potentially Antenna-in-Package for 5G mmWave smartphones and stacked memories-on-substrate for HPCs. Currently, all key players of different business models have Fan-Out packaging solutions in the market with a strong emphasis on cost and performance trade-off between Panel-level vs Wafer-level processing.
In addition, Yole Développement will be exhibiting at Booth B1258 with our experts on hand to answer questions and discuss your needs.