Yole Développement will be pleased to give its vision of the Dicing Technologies and Market Forecast during the webcast “Plasma Dicing for Next Generation Ultra Small and Ultra Thin Die” organized by SPTS Technologies.
This webast will take place on September 14, with 2 sessions:
Part I: Overview of Dicing Technologies and Market Forecast (Amandine Pizzagalli, Yole Développement)
During this webinar, Yole Développement will give its vision and an overview of the key dicing technologies across MEMS devices, power devices, CMOS image sensors, and RFID devices, highlighting its major findings on the evolution and trends of the dicing technologies : technology evolution analysis and expectations for the next few years.
Part II: Latest Advances in Plasma Dicing (Richard Barnett, SPTS Technologies)
In this webinar SPTS will be presenting the latest data illustrating how processing routes affect die strength, share experiences with different types of tapes and other die features such as solder balls. We will share details of the latest equipment which is now available for plasma dicing wafers up to 300mm (on 400mm tape frames) for full production applications.