Yole Développement and NCAP invite you to submit an abstract for the 6th edition of the Symposium by Yole Développement and NCAP on Advanced Packaging Semiconductors.

Yole Développement and NCAP welcome original submissions in the following range of areas:

New technologies:

• Wafer-Level Packaging: Fan-In, Fan-Out
• Heterogeneous Integration
• 3D and 2.5D stack
• Flip-Chip
• Embedded Dies
• IC Substrate
• System-in-Package
• Panel-Level Packaging
• Antennas in Packages (AiP)
• EMI shielding
• Advanced materials for packaging (polymeric, metal chemistry…)
• Emerging materials for packaging substrates (glass, LTCC, …)

Market status:

• Mobile & Consumer
• Automotive & Transportation
• Telecom & Infrastructure
• Industrial

Main and emerging applications:

• 5G
• Artificial Intelligence
• High Performance Computing
• Memory
• IoT
• Machine learning applied to packaging and assembly

Please submit abstract (200 words max.) to Fanny Vitrey (fanny.vitrey@yole.fr) by May 8, 2020. Your abstract can include one or two illustrations (graph, images…).

Find more information, by downloading the SYNAPS call for paper guidelines here.

Yole Développement and National Center for Advanced Packaging (NCAP China) decided to create and form the 1st Symposium Technical Committee. The Symposium Technical Committee is a 6-member group that takes the leadership role in setting and driving the conference’s content, working together with the Organizing Committee. Our Committee is responsible for ensuring a well-balanced, high quality conference program and is composed of a diverse set of senior industry experts – already confirmed:

Santosh Kumar
Principal Analyst & Director Packaging, Assembly & Substrates, Yole Korea

Dr. Peng Sun
Director of Technology Division, National Center for Advanced Packaging, NCAP China

Farhang Yazdani
President and CEO,
BroadPak Corporation

Ram Trichur
Global Head of semiconductor packaging market segment, Henkel

Amy Leong
Chief Marketing Officer and Senior Vice President of  Mergers and Acquisitions, FormFactor

Yifan Guo
VP of Engineering, ASE Group

Sponsoring SYNAPS is a prime opportunity to put your company in front of more than 180 of the key industry players and decision makers of the industry. Different levels of opportunities to suit your needs – Discover our offers now

For more information, please contact Camille Veyrier (camille.veyrier@yole.fr)

Location

Known as the “Venice of the East,” Suzhou is a major city located along the southeastern edge of Jiangsu Province in eastern China, bordered by Wuxi in the north, Shanghai in the east, Zhejiang Province in the south and Lake Taihu in the west.

Historically, Suzhou was synonymous with high culture and elegance. Generations of Chinese artists, scholars, writers and high society were drawn to its exquisite art forms and the delicate beauty of its gardens. Discover Suzhou’s famous canals, romantic water towns, thousand-year-old temples and world-class museums. Savor traditional tea and cuisine along Suzhou’s historic streets. Treat your eyes and ears to ancient architecture and music. Rest your head in a bed that’s authentically Suzhou. Explore Suzhou’s unique offerings for an once-in-a-lifetime experience.

Economy

Suzhou is one of the most dynamic cities in China, with GDP of RMB1.73 trillion in 2017 and attracts more than 150 Top 500 Enterprises to invest there.

Suzhou is also famous for its semiconductor industry. As we know, the Yangtze River Delta is one of the cradles for semiconductor industry in China. The city clusters there, including Shanghai, Wuxi and Suzhou, are developing fast with a complete IC industry chain. In 2018, Suzhou IC industry was reported reaching RMB46.776B, with 7.1% YoY growth. IC design constituted 10%, IC packaging and testing 61%.

Suzhou has a large number of scientific research institutes and leading enterprises, and most of them are located in Suzhou Industrial Park, including Samsung, Hisilicon, HeJian, TF-AMD, China WLCSP.

Discover more information about the symposium through the 2019 edition by clicking here.