In accordance with the Chinese government guidelines and to protect the health and safety of our guests, we regret to inform you that the Organizing Committee of SYNAPS took the decision to postpone its symposium initially scheduled from March 31 to April 1 in Suzhou, China.
Be sure that we are actively looking for a new date for this event and we will keep you informed as soon as a confirmed plan is in place. We apologize for any inconvenience caused by this change and warmly thank you for your comprehension.
We would like to thank you again for your support and wish you all good health.
IS EVERYONE’S BUSINESS!
We invite you to join the Symposium by Yole Développement and NCAP on Advanced Packaging Semiconductors, 2020 edition! For its 6th edition, the event has been renamed for:
Symposium by Yole Développement and NCAP on Advanced Packaging Semiconductors
One year has passed since the latest successful edition. NCAP and Yole Développement are now back with an exciting 2020 program for you in Suzhou, China, this year.
The agenda will be a powerful mix of key sessions related to the industry evolution and technical innovations and effective network times , organized within Suzhou’s advanced packaging ecosystem. By combining their technical and market expertise, both partners invite you during two days to meet leading executives and gain an in-depth understanding of the advanced packaging industry evolution.
Advanced packaging processes are at the crossroad of all semiconductor manufacturing process steps today. For the overall semiconductor companies, advanced packaging is strategic to answer to the industry evolution and ensure the development of their activities. With more and more functionalities, companies have to manage their ability to integrate more and more components on a same die and propose a final product with a high reliability level.
At SYNAPS, 2020 edition, NCAP and Yole Développement invite you to dive deep into the advanced packaging technologies, understand the latest innovations and discover new business opportunities.
Save the date in your agenda right now and let us meet in Suzhou, China on March 31, 2020 !
CALL FOR PAPER
Yole Développement and NCAP invite you to submit an abstract for the 6th edition of the Symposium by Yole Développement and NCAP on Advanced Packaging Semiconductors.
Yole Développement and NCAP welcome original submissions in the following range of areas:
- Wafer-Level Packaging: Fan-In, Fan-Out
- Heterogeneous Integration
- 3D and 2.5D stack
- Embedded Dies
- IC Substrate
- Panel-Level Packaging
- Antennas in Packages (AiP)
- EMI shielding
- Advanced materials for packaging (polymeric, metal chemistry…)
- Emerging materials for packaging substrates (glass, LTCC, …)
- Mobile & Consumer
- Automotive & Transportation
- Telecom & Infrastructure
Main and emerging applications:
- Artificial Intelligence
- High Performance Computing
- Machine learning applied to packaging and assembly
Please submit abstract (200 words max.) to Fanny Vitrey (email@example.com) by January 10, 2020. Your abstract can include one or two illustrations (graph, images…).
Find more information, by downloading the SYNAPS call for paper guidelines here.
Yole Développement and National Center for Advanced Packaging (NCAP China) decided to create and form the 1st Symposium Technical Committee. The Symposium Technical Committee is a 6-member group that takes the leadership role in setting and driving the conference’s content, working together with the Organizing Committee. Our Committee is responsible for ensuring a well-balanced, high quality conference program and is composed of a diverse set of senior industry experts – already confirmed:
Principal Analyst & Director Packaging, Assembly & Substrates, Yole Korea
Dr. Peng Sun
Director of Technology Division, National Center for Advanced Packaging, NCAP China
President and CEO,
Global Head of semiconductor packaging market segment, Henkel
Chief Marketing Officer and Senior Vice President of Mergers and Acquisitions, FormFactor
VP of Engineering, ASE Group
Sponsoring SYNAPS is a prime opportunity to put your company in front of more than 180 of the key industry players and decision makers of the industry. Different levels of opportunities to suit your needs – Discover our offers now
For more information, please contact Camille Veyrier (firstname.lastname@example.org)
Known as the “Venice of the East,” Suzhou is a major city located along the southeastern edge of Jiangsu Province in eastern China, bordered by Wuxi in the north, Shanghai in the east, Zhejiang Province in the south and Lake Taihu in the west.
Historically, Suzhou was synonymous with high culture and elegance. Generations of Chinese artists, scholars, writers and high society were drawn to its exquisite art forms and the delicate beauty of its gardens. Discover Suzhou’s famous canals, romantic water towns, thousand-year-old temples and world-class museums. Savor traditional tea and cuisine along Suzhou’s historic streets. Treat your eyes and ears to ancient architecture and music. Rest your head in a bed that’s authentically Suzhou. Explore Suzhou’s unique offerings for an once-in-a-lifetime experience.
Suzhou is one of the most dynamic cities in China, with GDP of RMB1.73 trillion in 2017 and attracts more than 150 Top 500 Enterprises to invest there.
Suzhou is also famous for its semiconductor industry. As we know, the Yangtze River Delta is one of the cradles for semiconductor industry in China. The city clusters there, including Shanghai, Wuxi and Suzhou, are developing fast with a complete IC industry chain. In 2018, Suzhou IC industry was reported reaching RMB46.776B, with 7.1% YoY growth. IC design constituted 10%, IC packaging and testing 61%.
Suzhou has a large number of scientific research institutes and leading enterprises, and most of them are located in Suzhou Industrial Park, including Samsung, Hisilicon, HeJian, TF-AMD, China WLCSP.
LOCATION AND KEY INFORMATION
88 Huachi Street, Suzhou Industrial Park, Suzhou, China, 215028
A discount rate is available on your room booking. You will find all the information needed in your registration confirmation email.
- Call for paper submission: from November 11, 2019 to January 10, 2020
- Registration opening – early bird rate: November 20, 2019
- Author notification: February 4, 2020
- Program reveiled: February 11, 2020
- Early bird rate ending: February 28, 2020
- Symposium dates: From March 31 to April 1, 2020
Need more information? Please contact Fanny: email@example.com
Discover more information about the symposium through the 2019 edition by clicking here.
Founded in 1998, Yole Développement, the “More than Moore” market research & strategy consulting company has grown to become a group of companies providing marketing, technology and strategy consulting, media in addition to corporate finance services. Yole Développement group provides market research, technology analysis, strategy consulting, targeted media, and financial advisory services. We have a global vision and customer base… The “More than Moore” company Yole and its partners System Plus Consulting, Blumorpho, PISEO and KnowMade support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business… Our fields of expertise: MEMS & Sensors – Imaging – Medical Technologies – Compound Semiconductors – RF Electronics – Solid State Lighting – Displays – Photonics – Power Electronics – Batteries & Energy Management – Advanced Packaging – Semiconductor Manufacturing – Software & Computing – Memory and more…
More information: www.yole.fr
As an innovation model, National Center for Advanced Packaging Co., Ltd. (NCAP China) was registered in Wuxi New District, China, in September 2012. Supported by Wuxi and Jiangsu government, National Science and Technology Major Project(02 Project) and IC Packaging and Testing Industry Chain Technology Innovation Strategic Alliance, NCAP China, a joint venture with a capital of 234.45 million, is established by ten investors, including the leaders of the IC packaging and testing industry in China (Jiangsu Changjiang Electronics Technology, TongFu Microelectronics, Huatian Technology, Shennan Circuit Company, China Wafer Level CSP, AKM Electronic Technology (Suzhou), Jiangsu CAS Internet-of-things Technology Venture Capital, Shenzhen Fastprint Circuit Tech) and CDB Capital. NCAP’s goal is to establish a national R&D center for advanced packaging and system integration, play a global leading role in the development and commercialization of advanced technologies for microelectronics packaging and system integration, and promote and sustain the technological and commercial advancement of the microelectronics industry in China.
More information: www.ncap-cn.com