SYNAPS 2020 – Symposium by Yole Développement and NCAP on Advanced Packaging for Semiconductors

Yole Events

Wuxi, China & Online

In these uncertain times, Yole Développement and NCAP are working together to run the symposium as scheduled while guaranteeing health and safety of our participants and an international quality event. Thereby, we adapted the format of our event for this year: in addition to the conference hold onsite in Wuxi, on-demand presentations will be available online for all the attendees who cannot join on-site. In addition, this year, NCAP Open Day will be combined to SYNAPS. We believe that this solution will allow everyone to stay connected with the worldwide packaging industry anyway.

Also, please note that we had to shorten the live date from 2 to 1 day, on September 15th, 2020 and moved to Wuxi, instead of Suzhou.

SYNAPS is happy to be co-hosted with the 7th NCAP Open Day.

We look forward to conference’s great success during this special time of year.

ADVANCED PACKAGING
IS EVERYONE’S BUSINESS!

We invite you to join the Symposium by Yole Développement and NCAP on Advanced Packaging Semiconductors, 2020 edition! For its 6th edition, the event has been renamed for:

SYNAPS
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Symposium by Yole Développement and NCAP on Advanced Packaging Semiconductors

SYNAPS logo yole


One year has passed since the latest successful edition. NCAP and Yole Développement are now back with an exciting 2020 program for you in Wuxi, China, this year.

As of, the agenda will be a powerful mix of key sessions related to the industry evolution and technical innovations and effective network times for people who will get the chance to join us on-site. By combining their technical and market expertise, both partners invite you during one exceptionnal day to gain an in-depth understanding of the advanced packaging industry evolution.

Advanced packaging processes are at the crossroad of all semiconductor manufacturing process steps today. For the overall semiconductor companies, advanced packaging is strategic to answer to the industry evolution and ensure the development of their activities. With more and more functionalities, companies have to manage their ability to integrate more and more components on a same die and propose a final product with a high reliability level.

At SYNAPS, 2020 edition, NCAP and Yole Développement invite you to dive deep into the advanced packaging technologies, understand the latest innovations and discover new business opportunities.

Save the date in your agenda right now and let us meet in Wuxi, China on September 15, 2020 !

Agenda

Speakers

  • C. Key Chung, SPIL

    C. Key Chung, PhD

    SENIOR DIRECTOR OF ADVANCED PACKAGE R&D - SPIL

  • Hongwen He

    In charge of Collaboration Plans with Colleges and Industry - HiSilicon

  • Sylvester Demmel

    Senior Product Manager for SIPLACE Advanced Packaging - ASM Assembly Systems

  • Ewald EVATEC

    Ewald Strolz

    Head of Process Development - Evatec

  • David Butler

    David Butler

    Executive Vice President and General Manager - SPTS Technologies, a KLA company

  • Qidong Wang

    Director of R&D Department - NCAP

  • Shen Guoqiang

    JSCC WB group R&D Center and Engineering Team Manager - JCET

  • Wade Liu

    Technical Marketing Director of Huatian Technology

  • Dr. Holly Sun

    COO & Senior VP - XMC

  • Thomas Uhrmann EV Group

    Dr. Thomas Uhrmann

    Director of Business Development - EV Group

  • Ruurd Boomsma Besi

    Ruurd Boomsma

    Chief Technology Officer - Besi

  • QA Wang K&S

    Wang Qiong An

    Senior Manager of Product Marketing Department - K&S

  • Görgülü, Kenan_ FormFactor

    Kenan Görgülü

    Chief Sales Officer - FRT GMBH GERMANY A FORMFACTOR COMPANY

  • Amy Leong

    CMO, SCP M&A - FormFactor Inc

  • ASMPT Percy Lam

    Percy Lam

    Sales Manager - ASM Pacific Technology

  • Ramylanger

    Ramy Langer

    Chief Operating Officer - Camtek

  • Varun Singh, Product Line Manager, Carrier Solutions Corning

    Varun Singh

    Product Line Manager, Carrier Solutions - Corning

  • Dr. Daquan Yu

    CEO - Xiamen Sky Semiconductor

  • Santosh Kumar

    Santosh Kumar

    Principal Analyst - Yole Développement

Sponsored by

PLATINIUM SPONSOR

SPTS Technologies, a KLA company, designs, manufactures, and markets wafer processing equipment for the global semiconductor and related industries, with focus on the Advanced Packaging, MEMS, high speed RF, power management and LED markets.

SPTS is headquartered and has its main manufacturing facility in Newport, UK, and operates across 19 countries in Europe, North America and Asia-Pacific. For more information, visit spts.com.

besi

LUCKY DRAW SPONSOR

BE Semiconductor Industries N.V. (“Besi”) is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries focusing primarily on the advanced packaging segment of the market. Besi develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, cloud infrastructure, computing, automotive, industrial, LED and solar energy. Customers are primarily leading semiconductor manufacturers, assembly subcontractors and electronics and industrial companies. Besi’s ordinary shares are listed on Euronext Amsterdam (symbol: BESI). Its Level 1 ADRs are listed on the OTC markets (symbol: BESIY Nasdaq International Designation) and its headquarters are located in Duiven, the Netherlands. Research and Development is organized in Switzerland, Austria and the Netherlands. Support and production is in Singapore, Malaysia and China.  For more information, please visit our website at www.besi.com.

KNS logo

BADGE HOLDER SPONSOR

Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor and electronic assembly solutions serving the global automotive, consumer, communications, computing and industrial markets. Founded in 1951, K&S prides itself on establishing foundations for technological advancement – creating pioneering interconnect solutions that enable performance improvements, power efficiency, form-factor reductions and assembly excellence of current and next-generation semiconductor devices.

Leveraging decades of development proficiency and extensive process technology expertise, Kulicke & Soffa’s expanding portfolio provides equipment solutions, aftermarket products and services supporting a comprehensive set of interconnect technologies including wire bonding, advanced packaging, lithography, and electronics assembly. Dedicated to empowering technological discovery, always, K&S collaborates with customers and technology partners to push the boundaries of possibility, enabling a smarter future (www.kns.com).

 

BADGE SPONSOR

The best valued Company which leads the future
Our goal is to be the best valued company leading technology standard
Since HANMI Semiconductor founded the semiconductor equipment industry in 1980, we have grown steadily into a world best Middle-End Semiconductor Equipment Manufacturer & maintain the top position. Through our continued export promotion policy, our high-end technology has been shipping abroad to our more than 280 global customers and this led to more widespread appreciation of its value. Especially, Sawing & Placement System, which was designated as the “World-Class Product’ is recording the first of global market share. Hanmi TSV Dual Stacking TC Bonder has won “2017 iR52 Jang Young-Sil Award”
Hanmi provides distinguished products and services for ‘Customer Satisfaction’. Hanmi won 2016 VLSI Customer Satisfaction Survey The Best Award & 10 Best Award.
Also, HANMI has been successful to get original technology with intensive R&D investment and selected as “Advanced Technology Center’ in 2008. Hanmi has 290 R&D Engineers and owns 810 worldwide Intellectual Properties.
HANMI Semiconductor is trying to be the best valued company as the pioneer spirit of the first Korean semiconductor equipment manufacturer.

BADGE SPONSOR

NAURA Technology Group Co., Ltd. (Hereinafter referred to as NAURA), is a leading enterprise of integrated circuit high-end technological equipment in China. It was formed through a strategic restructuring between Beijing Sevenstar Electronics Co., Ltd. (Hereinafter referred to as Sevenstar Electronics) and Beijing North Microelectronics Co., Ltd. (Hereinafter referred to as NMC).

Having inherited years of high-technology research and development strength of Sevenstar Electronics and NMC, NAURA integrated its resources and complemented its advantages with a new futuristic perspective based on technological innovation. The company devotes itself to quickening its strategic transformation to become a part of the new-type manufacturing industry, becoming an international leading product service provider for high-end electronic technological equipment and precision electronic components, to improving the smart-living, and realizing China’s dream of “strengthening a country through intelligence“.

NAURA owns four business groups: semiconductor equipment, vacuum equipment, new energy lithium battery equipment and precision components, which provide solutions for semiconductors, new energy resources, new materials as well as other fields. At present, NAURA owns four major industrial manufacturing bases, and its marketing service system covers major countries and regions in Europe, America and Asia.

In the future, NAURA will shine in the world arena as a leading firm in high-end electronic technology equipment and precision electronics, strive for further development and lead the way for the future. Furthermore, NAURA will also stick to customer demand-oriented sustainable innovation to promote the progress of industrial technology and bring infinite possibilities for the industry.

JSR logo

LOGO SPONSOR

In 1957, Japan was finishing postwar reconstruction and starting a period of high economic growth. Petrochemical products were essential for industrial development. JSR Corporation (formerly Japan Synthetic Rubber Co., Ltd.) was established as a national policy concern to pioneer synthetic rubber production in Japan. We later applied our polymer technologies in the fine chemicals sector to produce semiconductor materials, display materials, and other products. JSR is currently taking up the challenge of materials innovation applicable in new fields, including the life sciences, environ­ment and energy that make use of the acquired technologies in the fine chemicals sector. These are under development as future JSR core businesses.

http://www.jsr-sh.com.cn/

141120_Logo_ASM_Diamant_schwarz_rot

LOGO SPONSOR

The SMT Solutions segment within the ASM Pacific Technology Group
The mission of the SMT Solutions segment within the AMS Pacific Technology Group (ASMPT) is to implement and support the smart SMT factory at electronics manufacturers worldwide.

ASM solutions such as SIPLACE placement systems and DEK printing systems support the networking, automation and optimization of central workflows with hardware, software and services that enable electronics manufacturers to transition to the smart SMT factory in stages and enjoy dramatic improvements in productivity, flexibility and quality.

Since maintaining close relationships with customers and partners is a central component of ASM’s strategy, the company has established the SMT Smart Network as a global forum for the active exchange of information between and with smart champions. In addition to being a founding member of the ADAMOS joint venture for the development of an IIoT platform for manufacturing companies, ASM is establishing together with other SMT manufacturers the open HERMES standard as a successor to the SMEMA standard for M2M communication in SMT lines.

 For more information about ASM, visit www.asm-smt.com. 

LN_Logo_RGB_Primary_Full-Color_Positive

GIVEAWAYS & BROCHURES SPONSORSHIP

LexisNexis IP is a LexisNexis company. We are the provider of best-in-class information-based solutions and services to meet the needs of the intellectual property market, government agencies, and the life sciences industry. We have worked in the patent arena with the U.S. Patent and Trademark Office (USPTO) for nearly half a century and offer a suite of IP solutions that deliver the results you need across the patent workflow under the LexisNexis IP name. The corporate culture is driven by a commitment to excellence, innovation, and a strong dedication to our customers, employees and communities. Learn more about LexisNexis Legal & Professional.

EXHIBITOR

Baihe Instruments was founded in Shanghai. Sales Network in China, with east China as the center, for all parts of the country. Is a set of pre-sales support and after-sales service as one of the technical enterprises. The company professional agent sales of advanced materials testing equipment, products from Europe, the United States, Japan and other well-known equipment suppliers in the industry. The company has experienced technical personnel and professional service team in the industry, can provide effective equipment technical support, and even the overall laboratory solutions. The company has a good product supply chain and a complete customer network to better serve the Chinese market.

www.bahens.cn

Moldex3D logo

EXHIBITOR

CoreTech System Co., Ltd. (Moldex3D) was founded in 1995, it has provided the professional plastic injection molding simulation solution “Moldex” series for the plastic injection molding industry, and the current product “Moldex3D” is marketed worldwide.

Moldex3D IC Packaging provides a complete series of molding solutions, and supports comprehensive solutions such as : Transfer Molding, Molded Underfill, Capillary Underfill (CUF), Compression Molding, Embedded Wafer Level Package (EMWLP), and No Flow Underfill (NFU) / Non Conductive Paste (NCP). Auto meshing function supports for user to complete encapsulation analysis more easily. User also can adopt advanced manual meshing for more complex component like undercut-shaped lead frame.

Moldex3D IC Packaging helps designers to fully analyze the chip encapsulation process from filling, curing, cooling, to advanced manufacturing demands, such as filler concentration, underfill encapsulation, post-molding curing, stress distribution, or structural evaluation. Significant molding problems can be predicted and solved upfront, which helps engineers enhance chip quality and prevent potential defects more efficiently. The accurate simulation also helps design optimization and well cost management.

www.moldex3d.com

ERS-Logo-CMYK zoomed

EXHIBITOR

ERS has been supplying innovative thermal test solutions to the semiconductor industry since 1970 and is famous for fast-ramping and precise low-noise thermal systems (-65°C to +400°C) for analytical, parametric and wafer sort probing up to 300mm.  The patented ERS flagship product for hot/cold wafer test, AC3(R), is available for package-level tri-temp applications for MEMS test.  We design and build stand-alone thermal-forcing systems and custom production tools for difficult thermal applications. We also supply the advanced wafer level packaging market with its fully automatic debonders and manual warpage adjust tools used in the production of both 200mm and 300mm eWLB device packages. On a broader scale, ERS supports not only eWLB but many other Fan-Out Wafer-Level-Packaging (FOWLP) and Panel-Level-Packaging (FOPLP) technologies.  Our headquarter, sales department, engineering center and production facilities are in the Munich suburb of Germering, and we also have sales and support offices in the US, China, Singapore and Taiwan.

Learn more at: www.ers-gmbh.com

Silicon Semiconductor China

MEDIA SPONSOR

Silicon Semiconductor China is the ‘sister’ title to Silicon Semiconductor –the world most respected and authoritative publication, published by ACT International in Hong Kong, reports the latest news, in-depth analysis, and authoritative commentary on the semiconductor industry. It provides for Chinese semiconductor professionals with the business and technology &product information. Its editorial covers semiconductor manufacturing advanced packaging, wafer fabrication, integrated circuits, MEMs, FPDs, etc. The publication serves Chinese semiconductor industry, from IC design, manufacture, package to application, etc.

http://www.siscmag.com/

GSI Media

MEDIA SPONSOR

GSI Media was established in 2015, with the mission of building and serving the semiconductor community with most valuable industry based contents and services. GSI Media  is currently one of China’s top-rated media and community brands, thanks to the high quality of contents and its long term commitment to grow the broad base of community. The business of GSI Media ranges from news reporting, market research, headhunting and finance.

Currently there are 5 Wechat public accounts under the GSI Media umbrella,GSI Media has a total of 300,000 readers from semiconductor industry, owns and manages 100+ Wechat communication group. Until today, GSI Media has influenced millions of professionals from semiconductor industry.

Partners

Yole Développement

POWERED BY

Yole Développement provides market research, technology analysis, strategy consulting, targeted media, and financial advisory services.

With a strong focus on emerging applications using silicon and/or micro manufacturing since 1998, Yole Développement has expanded to include more than 80 collaborators worldwide covering Photonics – Lighting – Imaging – Sensing & Actuating – Display – RF Devices & Technologies – Compound Semiconductors & Emerging Materials – Power Electronics – Batteries & Energy Management – Semiconductor Packaging and Substrates – Semiconductor Manufacturing – Memory – Computing and Software.

The market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting, Blumorpho and PISEO – all part of the Yole Group of Companies-, support industrial companies, investors and R&D organizations worldwide to follow technology trends to grow their business and help them understand the 6 specific markets.

More information: www.yole.fr

ncap logo

HOSTED BY

As an innovation model, National Center for Advanced Packaging Co., Ltd. (NCAP China) was registered in Wuxi New District, China, in September 2012. Supported by Wuxi and Jiangsu government, National Science and Technology Major Project(02 Project) and IC Packaging and Testing Industry Chain Technology Innovation Strategic Alliance, NCAP China, a joint venture with a capital of 234.45 million, is established by ten investors, including the leaders of the IC packaging and testing industry in China (Jiangsu Changjiang Electronics Technology, TongFu Microelectronics, Huatian Technology, Shennan Circuit Company, China Wafer Level CSP, AKM Electronic Technology (Suzhou), Jiangsu CAS Internet-of-things Technology Venture Capital, Shenzhen Fastprint Circuit Tech) and CDB Capital. NCAP’s goal is to establish a national R&D center for advanced packaging and system integration, play a global leading role in the development and commercialization of advanced technologies for microelectronics packaging and system integration, and promote and sustain the technological and commercial advancement of the microelectronics industry in China.

More information: www.ncap-cn.com

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