In these uncertain times, Yole Développement and NCAP are working together to run the symposium as scheduled while guaranteeing health and safety of our participants and an international quality event. Thereby, we adapted the format of our event for this year: in addition to the conference hold onsite in Wuxi, on-demand presentations will be available online for all the attendees who cannot join on-site. In addition, this year, NCAP Open Day will be combined to SYNAPS. We believe that this solution will allow everyone to stay connected with the worldwide packaging industry anyway.
Also, please note that we had to shorten the live date from 2 to 1 day, on September 15th, 2020 and moved to Wuxi, instead of Suzhou.
SYNAPS is happy to be co-hosted with the 7th NCAP Open Day.
We look forward to conference’s great success during this special time of year.
ADVANCED PACKAGING
IS EVERYONE’S BUSINESS!
We invite you to join the Symposium by Yole Développement and NCAP on Advanced Packaging Semiconductors, 2020 edition! For its 6th edition, the event has been renamed for:
SYNAPS
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Symposium by Yole Développement and NCAP on Advanced Packaging Semiconductors

One year has passed since the latest successful edition. NCAP and Yole Développement are now back with an exciting 2020 program for you in Wuxi, China, this year.
As of, the agenda will be a powerful mix of key sessions related to the industry evolution and technical innovations and effective network times for people who will get the chance to join us on-site. By combining their technical and market expertise, both partners invite you during one exceptionnal day to gain an in-depth understanding of the advanced packaging industry evolution.
Advanced packaging processes are at the crossroad of all semiconductor manufacturing process steps today. For the overall semiconductor companies, advanced packaging is strategic to answer to the industry evolution and ensure the development of their activities. With more and more functionalities, companies have to manage their ability to integrate more and more components on a same die and propose a final product with a high reliability level.
At SYNAPS, 2020 edition, NCAP and Yole Développement invite you to dive deep into the advanced packaging technologies, understand the latest innovations and discover new business opportunities.

Save the date in your agenda right now and let us meet in Wuxi, China on September 15, 2020 !
TECHNICAL COMMITTEE
Yole Développement and National Center for Advanced Packaging (NCAP China) decided to create and form the 1st Symposium Technical Committee. The Symposium Technical Committee is a 6-member group that takes the leadership role in setting and driving the conference’s content, working together with the Organizing Committee. Our Committee is responsible for ensuring a well-balanced, high quality conference program and is composed of a diverse set of senior industry experts:

Santosh Kumar
Principal Analyst & Director Packaging, Assembly & Substrates, Yole Korea

Dr. Peng Sun
Director of Technology Division, National Center for Advanced Packaging, NCAP China

Farhang Yazdani
President and CEO,
BroadPak Corporation

Ram Trichur
Global Head of semiconductor packaging market segment, Henkel

Amy Leong
Chief Marketing Officer and Senior Vice President of Mergers and Acquisitions, FormFactor

Yifan Guo
VP of Engineering, ASE Group

SPONSORSHIP OPPORTUNITIES
Sponsoring SYNAPS is a prime opportunity to put your company in front of more than 180 of the key industry players and decision makers of the industry. Different levels of opportunities to suit your needs – Discover our offers now

For more information, please contact Camille Veyrier (camille.veyrier@yole.fr)
LOCATION AND KEY INFORMATION
UPCOMING DATES
- Call for paper submission: from November 11, 2019 to May 8, 2020
- Registration opening : June 17, 2020
- Author notification: July 2, 2020
- Program reveiled: July 9, 2020
- Symposium dates: September 15, 2020
CONTACT
Need more information? Please contact Fanny: fanny.vitrey@yole.fr
2 offers to suit your needs

PREVIOUS EDITION
Agenda
Septembre 15, 2020
Registration
Welcome and Introduction
Session 1 - (1/2) - Embedded Technologies and System in Package
Keynote: Low Cost Solution for 2.5D using Fan-Out Embedded Bridge - ONLINE
C. Key Chung, PhD
Senior Director of Advanced Package R&D - SPIL
Reliability Issues in Advanced Packaging - ONLY ON-SITE
Hongwen He, Ph.D.
Responsible for collaboration plans with colleges and industry - HiSilicon
Meeting the challenges of Large Panel, high density placement in Embedded Die SIP packaging - ONLINE
Sylvester Demmel
Senior Product Manager for SIPLACE Advanced Packaging - ASM Assembly Systems
Panel level sputter tool for High Volume Manufacturing (HVM) - ONLINE
Ewald Strolz
Head of Process Development / BU Advanced Packaging - Evatec
Coffee break - Networking time
Session 1 - (2/2) - Embedded Technologies and System in Package
Keynote: Overview of the Latest PVD Developments for High Density FOWLP - ONLINE
David Butler
EVP & General Manager - SPTS Technologies
Advanced Packaging Substrate in NCAP - ON-SITE
Qidong Wang
Director of R&D Department - NCAP
Session 2 - Memory Packaging
Advanced Assembly Technology for Memory Product - ON-SITE
Shen, Guoqiang
JSCC WB GROUP R&D CENTER AND ENGINEERING TEAM MANAGER - JCET
Memory packaging technology - ON-SITE
Wade Liu
Technical marketing Director - Huatian Technology
Lunch and Networking
Session 3 - (1/2) - High-End Packaging and 3D
Keynote: The future of wafer-level 3D IC technologies: Multiple wafer stacking (M-stacking) and Heterogeneous Integration (Hi-stacking) - ON-SITE
Dr. Holly Sun
COO & Senior VP - XMC
Collective D2W Hybrid Bonding for 3D SIC and Heterogeneous Integration - ONLINE
Dr. Thomas Uhrmann
Director of business development - EV Group (EVG)
Advancement in Bonding and Molding Technology for High End Devices - ONLINE
Ruurd Boomsma
Chief Technology Officer - Besi
Heterogeneous Integration - ON-SITE
Wang Qiong An
Senior manager of product marketing department - EA/APMR Business Unit - K&S
Coffee break - Networking time
Session 3 - (2/2) - High-End Packaging and 3D
Keynote: Solving test and measurement challenges for 2.5D/3D heterogenous integration challenges - ONLINE
Co-presentation
Amy Leong - CMO, SVP M&A - FormFactor Inc. & Kenan Görgülü - Chief Sales Officer - FRT GmbH Germany a FormFactor company
Heterogeneous Integrations: Challenges and Solutions - ON-SITE
Percy Lam
Sales Manager - ASM Pacific Technology
Inspection and Metrology Challenges for Advanced Packaging - ONLINE
Ramy Langer
Chief Operating Officer - Camtek
Session 4 - Glass Packaging
Keynote: Glass Carriers for Advanced Packaging Applications - ONLINE
Varun Singh
Product Line Manager, Carrier Solutions - Corning
Development of 3D Wafer Level Packaging and Integration Technologies for 5G Applications - ON-SITE
Dr. Daquan Yu
CEO - Xiamen Sky Semiconductor
To be announced - ONLINE
Santosh Kumar
Principal Analyst - Yole Développement
Thank You and Adjourn
Speakers
C. Key Chung, PhD
SENIOR DIRECTOR OF ADVANCED PACKAGE R&D - SPIL
Hongwen He
In charge of Collaboration Plans with Colleges and Industry - HiSilicon
Sylvester Demmel
Senior Product Manager for SIPLACE Advanced Packaging - ASM Assembly Systems
Ewald Strolz
Head of Process Development - Evatec
David Butler
Executive Vice President and General Manager - SPTS Technologies, a KLA company
Qidong Wang
Director of R&D Department - NCAP
Shen Guoqiang
JSCC WB group R&D Center and Engineering Team Manager - JCET
Wade Liu
Technical Marketing Director of Huatian Technology
Dr. Holly Sun
COO & Senior VP - XMC
Dr. Thomas Uhrmann
Director of Business Development - EV Group
Ruurd Boomsma
Chief Technology Officer - Besi
Wang Qiong An
Senior Manager of Product Marketing Department - K&S
Kenan Görgülü
Chief Sales Officer - FRT GMBH GERMANY A FORMFACTOR COMPANY
Amy Leong
CMO, SCP M&A - FormFactor Inc
Percy Lam
Sales Manager - ASM Pacific Technology
Ramy Langer
Chief Operating Officer - Camtek
Varun Singh
Product Line Manager, Carrier Solutions - Corning
Dr. Daquan Yu
CEO - Xiamen Sky Semiconductor
Santosh Kumar
Principal Analyst - Yole Développement
Sponsored by

PLATINIUM SPONSOR
SPTS Technologies, a KLA company, designs, manufactures, and markets wafer processing equipment for the global semiconductor and related industries, with focus on the Advanced Packaging, MEMS, high speed RF, power management and LED markets.
SPTS is headquartered and has its main manufacturing facility in Newport, UK, and operates across 19 countries in Europe, North America and Asia-Pacific. For more information, visit spts.com.

LUCKY DRAW SPONSOR
BE Semiconductor Industries N.V. (“Besi”) is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries focusing primarily on the advanced packaging segment of the market. Besi develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, cloud infrastructure, computing, automotive, industrial, LED and solar energy. Customers are primarily leading semiconductor manufacturers, assembly subcontractors and electronics and industrial companies. Besi’s ordinary shares are listed on Euronext Amsterdam (symbol: BESI). Its Level 1 ADRs are listed on the OTC markets (symbol: BESIY Nasdaq International Designation) and its headquarters are located in Duiven, the Netherlands. Research and Development is organized in Switzerland, Austria and the Netherlands. Support and production is in Singapore, Malaysia and China. For more information, please visit our website at www.besi.com.

BADGE HOLDER SPONSOR
Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor and electronic assembly solutions serving the global automotive, consumer, communications, computing and industrial markets. Founded in 1951, K&S prides itself on establishing foundations for technological advancement – creating pioneering interconnect solutions that enable performance improvements, power efficiency, form-factor reductions and assembly excellence of current and next-generation semiconductor devices.
Leveraging decades of development proficiency and extensive process technology expertise, Kulicke & Soffa’s expanding portfolio provides equipment solutions, aftermarket products and services supporting a comprehensive set of interconnect technologies including wire bonding, advanced packaging, lithography, and electronics assembly. Dedicated to empowering technological discovery, always, K&S collaborates with customers and technology partners to push the boundaries of possibility, enabling a smarter future (www.kns.com).

BADGE SPONSOR
The best valued Company which leads the future
Our goal is to be the best valued company leading technology standard
Since HANMI Semiconductor founded the semiconductor equipment industry in 1980, we have grown steadily into a world best Middle-End Semiconductor Equipment Manufacturer & maintain the top position. Through our continued export promotion policy, our high-end technology has been shipping abroad to our more than 280 global customers and this led to more widespread appreciation of its value. Especially, Sawing & Placement System, which was designated as the “World-Class Product’ is recording the first of global market share. Hanmi TSV Dual Stacking TC Bonder has won “2017 iR52 Jang Young-Sil Award”
Hanmi provides distinguished products and services for ‘Customer Satisfaction’. Hanmi won 2016 VLSI Customer Satisfaction Survey The Best Award & 10 Best Award.
Also, HANMI has been successful to get original technology with intensive R&D investment and selected as “Advanced Technology Center’ in 2008. Hanmi has 290 R&D Engineers and owns 810 worldwide Intellectual Properties.
HANMI Semiconductor is trying to be the best valued company as the pioneer spirit of the first Korean semiconductor equipment manufacturer.

BADGE SPONSOR
NAURA Technology Group Co., Ltd. (Hereinafter referred to as NAURA), is a leading enterprise of integrated circuit high-end technological equipment in China. It was formed through a strategic restructuring between Beijing Sevenstar Electronics Co., Ltd. (Hereinafter referred to as Sevenstar Electronics) and Beijing North Microelectronics Co., Ltd. (Hereinafter referred to as NMC).
Having inherited years of high-technology research and development strength of Sevenstar Electronics and NMC, NAURA integrated its resources and complemented its advantages with a new futuristic perspective based on technological innovation. The company devotes itself to quickening its strategic transformation to become a part of the new-type manufacturing industry, becoming an international leading product service provider for high-end electronic technological equipment and precision electronic components, to improving the smart-living, and realizing China’s dream of “strengthening a country through intelligence“.
NAURA owns four business groups: semiconductor equipment, vacuum equipment, new energy lithium battery equipment and precision components, which provide solutions for semiconductors, new energy resources, new materials as well as other fields. At present, NAURA owns four major industrial manufacturing bases, and its marketing service system covers major countries and regions in Europe, America and Asia.
In the future, NAURA will shine in the world arena as a leading firm in high-end electronic technology equipment and precision electronics, strive for further development and lead the way for the future. Furthermore, NAURA will also stick to customer demand-oriented sustainable innovation to promote the progress of industrial technology and bring infinite possibilities for the industry.

LOGO SPONSOR
In 1957, Japan was finishing postwar reconstruction and starting a period of high economic growth. Petrochemical products were essential for industrial development. JSR Corporation (formerly Japan Synthetic Rubber Co., Ltd.) was established as a national policy concern to pioneer synthetic rubber production in Japan. We later applied our polymer technologies in the fine chemicals sector to produce semiconductor materials, display materials, and other products. JSR is currently taking up the challenge of materials innovation applicable in new fields, including the life sciences, environment and energy that make use of the acquired technologies in the fine chemicals sector. These are under development as future JSR core businesses.

LOGO SPONSOR
The SMT Solutions segment within the ASM Pacific Technology Group
The mission of the SMT Solutions segment within the AMS Pacific Technology Group (ASMPT) is to implement and support the smart SMT factory at electronics manufacturers worldwide.
ASM solutions such as SIPLACE placement systems and DEK printing systems support the networking, automation and optimization of central workflows with hardware, software and services that enable electronics manufacturers to transition to the smart SMT factory in stages and enjoy dramatic improvements in productivity, flexibility and quality.
Since maintaining close relationships with customers and partners is a central component of ASM’s strategy, the company has established the SMT Smart Network as a global forum for the active exchange of information between and with smart champions. In addition to being a founding member of the ADAMOS joint venture for the development of an IIoT platform for manufacturing companies, ASM is establishing together with other SMT manufacturers the open HERMES standard as a successor to the SMEMA standard for M2M communication in SMT lines.
For more information about ASM, visit www.asm-smt.com.

GIVEAWAYS & BROCHURES SPONSORSHIP
LexisNexis IP is a LexisNexis company. We are the provider of best-in-class information-based solutions and services to meet the needs of the intellectual property market, government agencies, and the life sciences industry. We have worked in the patent arena with the U.S. Patent and Trademark Office (USPTO) for nearly half a century and offer a suite of IP solutions that deliver the results you need across the patent workflow under the LexisNexis IP name. The corporate culture is driven by a commitment to excellence, innovation, and a strong dedication to our customers, employees and communities. Learn more about LexisNexis Legal & Professional.

EXHIBITOR
Baihe Instruments was founded in Shanghai. Sales Network in China, with east China as the center, for all parts of the country. Is a set of pre-sales support and after-sales service as one of the technical enterprises. The company professional agent sales of advanced materials testing equipment, products from Europe, the United States, Japan and other well-known equipment suppliers in the industry. The company has experienced technical personnel and professional service team in the industry, can provide effective equipment technical support, and even the overall laboratory solutions. The company has a good product supply chain and a complete customer network to better serve the Chinese market.
www.bahens.cn

EXHIBITOR
CoreTech System Co., Ltd. (Moldex3D) was founded in 1995, it has provided the professional plastic injection molding simulation solution “Moldex” series for the plastic injection molding industry, and the current product “Moldex3D” is marketed worldwide.
Moldex3D IC Packaging provides a complete series of molding solutions, and supports comprehensive solutions such as : Transfer Molding, Molded Underfill, Capillary Underfill (CUF), Compression Molding, Embedded Wafer Level Package (EMWLP), and No Flow Underfill (NFU) / Non Conductive Paste (NCP). Auto meshing function supports for user to complete encapsulation analysis more easily. User also can adopt advanced manual meshing for more complex component like undercut-shaped lead frame.
Moldex3D IC Packaging helps designers to fully analyze the chip encapsulation process from filling, curing, cooling, to advanced manufacturing demands, such as filler concentration, underfill encapsulation, post-molding curing, stress distribution, or structural evaluation. Significant molding problems can be predicted and solved upfront, which helps engineers enhance chip quality and prevent potential defects more efficiently. The accurate simulation also helps design optimization and well cost management.
www.moldex3d.com

EXHIBITOR
ERS has been supplying innovative thermal test solutions to the semiconductor industry since 1970 and is famous for fast-ramping and precise low-noise thermal systems (-65°C to +400°C) for analytical, parametric and wafer sort probing up to 300mm. The patented ERS flagship product for hot/cold wafer test, AC3(R), is available for package-level tri-temp applications for MEMS test. We design and build stand-alone thermal-forcing systems and custom production tools for difficult thermal applications. We also supply the advanced wafer level packaging market with its fully automatic debonders and manual warpage adjust tools used in the production of both 200mm and 300mm eWLB device packages. On a broader scale, ERS supports not only eWLB but many other Fan-Out Wafer-Level-Packaging (FOWLP) and Panel-Level-Packaging (FOPLP) technologies. Our headquarter, sales department, engineering center and production facilities are in the Munich suburb of Germering, and we also have sales and support offices in the US, China, Singapore and Taiwan.
Learn more at: www.ers-gmbh.com

MEDIA SPONSOR
Silicon Semiconductor China is the ‘sister’ title to Silicon Semiconductor –the world most respected and authoritative publication, published by ACT International in Hong Kong, reports the latest news, in-depth analysis, and authoritative commentary on the semiconductor industry. It provides for Chinese semiconductor professionals with the business and technology &product information. Its editorial covers semiconductor manufacturing advanced packaging, wafer fabrication, integrated circuits, MEMs, FPDs, etc. The publication serves Chinese semiconductor industry, from IC design, manufacture, package to application, etc.
http://www.siscmag.com/

MEDIA SPONSOR
GSI Media was established in 2015, with the mission of building and serving the semiconductor community with most valuable industry based contents and services. GSI Media is currently one of China’s top-rated media and community brands, thanks to the high quality of contents and its long term commitment to grow the broad base of community. The business of GSI Media ranges from news reporting, market research, headhunting and finance.
Currently there are 5 Wechat public accounts under the GSI Media umbrella,GSI Media has a total of 300,000 readers from semiconductor industry, owns and manages 100+ Wechat communication group. Until today, GSI Media has influenced millions of professionals from semiconductor industry.
Partners

POWERED BY
Yole Développement provides market research, technology analysis, strategy consulting, targeted media, and financial advisory services.
With a strong focus on emerging applications using silicon and/or micro manufacturing since 1998, Yole Développement has expanded to include more than 80 collaborators worldwide covering Photonics – Lighting – Imaging – Sensing & Actuating – Display – RF Devices & Technologies – Compound Semiconductors & Emerging Materials – Power Electronics – Batteries & Energy Management – Semiconductor Packaging and Substrates – Semiconductor Manufacturing – Memory – Computing and Software.
The market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting, Blumorpho and PISEO – all part of the Yole Group of Companies-, support industrial companies, investors and R&D organizations worldwide to follow technology trends to grow their business and help them understand the 6 specific markets.
More information: www.yole.fr

HOSTED BY
As an innovation model, National Center for Advanced Packaging Co., Ltd. (NCAP China) was registered in Wuxi New District, China, in September 2012. Supported by Wuxi and Jiangsu government, National Science and Technology Major Project(02 Project) and IC Packaging and Testing Industry Chain Technology Innovation Strategic Alliance, NCAP China, a joint venture with a capital of 234.45 million, is established by ten investors, including the leaders of the IC packaging and testing industry in China (Jiangsu Changjiang Electronics Technology, TongFu Microelectronics, Huatian Technology, Shennan Circuit Company, China Wafer Level CSP, AKM Electronic Technology (Suzhou), Jiangsu CAS Internet-of-things Technology Venture Capital, Shenzhen Fastprint Circuit Tech) and CDB Capital. NCAP’s goal is to establish a national R&D center for advanced packaging and system integration, play a global leading role in the development and commercialization of advanced technologies for microelectronics packaging and system integration, and promote and sustain the technological and commercial advancement of the microelectronics industry in China.
More information: www.ncap-cn.com