SYNAPS 2020 – Symposium by Yole Développement and NCAP on Advanced Packaging for Semiconductors
Yole Events
Suzhou, China
In accordance with the Chinese government guidelines and to protect the health and safety of our guests, we regret to inform you that the Organizing Committee of SYNAPS took the decision to postpone its symposium initially scheduled from March 31 to April 1 in Suzhou, China.
Be sure that we are actively looking for a new date for this event and we will keep you informed as soon as a confirmed plan is in place. We apologize for any inconvenience caused by this change and warmly thank you for your comprehension.
We would like to thank you again for your support and wish you all good health.
ADVANCED PACKAGING
IS EVERYONE’S BUSINESS!
We invite you to join the Symposium by Yole Développement and NCAP on Advanced Packaging Semiconductors, 2020 edition! For its 6th edition, the event has been renamed for:
SYNAPS
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Symposium by Yole Développement and NCAP on Advanced Packaging Semiconductors
One year has passed since the latest successful edition. NCAP and Yole Développement are now back with an exciting 2020 program for you in Suzhou, China, this year.
The agenda will be a powerful mix of key sessions related to the industry evolution and technical innovations and effective network times , organized within Suzhou’s advanced packaging ecosystem. By combining their technical and market expertise, both partners invite you during two days to meet leading executives and gain an in-depth understanding of the advanced packaging industry evolution.
Advanced packaging processes are at the crossroad of all semiconductor manufacturing process steps today. For the overall semiconductor companies, advanced packaging is strategic to answer to the industry evolution and ensure the development of their activities. With more and more functionalities, companies have to manage their ability to integrate more and more components on a same die and propose a final product with a high reliability level.
At SYNAPS, 2020 edition, NCAP and Yole Développement invite you to dive deep into the advanced packaging technologies, understand the latest innovations and discover new business opportunities.
Save the date in your agenda right now and let us meet in Suzhou, China on March 31, 2020 !
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WHY SUZHOU?
LOCATION AND KEY INFORMATION
PREVIOUS EDITION
Partners
POWERED BY
Founded in 1998, Yole Développement, the “More than Moore” market research & strategy consulting company has grown to become a group of companies providing marketing, technology and strategy consulting, media in addition to corporate finance services. Yole Développement group provides market research, technology analysis, strategy consulting, targeted media, and financial advisory services. We have a global vision and customer base… The “More than Moore” company Yole and its partners System Plus Consulting, Blumorpho, PISEO and KnowMade support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business… Our fields of expertise: MEMS & Sensors – Imaging – Medical Technologies – Compound Semiconductors – RF Electronics – Solid State Lighting – Displays – Photonics – Power Electronics – Batteries & Energy Management – Advanced Packaging – Semiconductor Manufacturing – Software & Computing – Memory and more…
More information: www.yole.fr
HOSTED BY
As an innovation model, National Center for Advanced Packaging Co., Ltd. (NCAP China) was registered in Wuxi New District, China, in September 2012. Supported by Wuxi and Jiangsu government, National Science and Technology Major Project(02 Project) and IC Packaging and Testing Industry Chain Technology Innovation Strategic Alliance, NCAP China, a joint venture with a capital of 234.45 million, is established by ten investors, including the leaders of the IC packaging and testing industry in China (Jiangsu Changjiang Electronics Technology, TongFu Microelectronics, Huatian Technology, Shennan Circuit Company, China Wafer Level CSP, AKM Electronic Technology (Suzhou), Jiangsu CAS Internet-of-things Technology Venture Capital, Shenzhen Fastprint Circuit Tech) and CDB Capital. NCAP’s goal is to establish a national R&D center for advanced packaging and system integration, play a global leading role in the development and commercialization of advanced technologies for microelectronics packaging and system integration, and promote and sustain the technological and commercial advancement of the microelectronics industry in China.
More information: www.ncap-cn.com