SYNAPS 2020 – Symposium by Yole Développement and NCAP on Advanced Packaging for Semiconductors

Yole Events

Wuxi, China & Online

In these uncertain times, Yole Développement and NCAP are working together to run the symposium as scheduled while guaranteeing health and safety of our participants and an international quality event. Thereby, we adapted the format of our event for this year: in addition to the conference hold onsite in Wuxi, on-demand presentations will be available online for all the attendees who cannot join on-site. In addition, this year, NCAP Open Day will be combined to SYNAPS. We believe that this solution will allow everyone to stay connected with the worldwide packaging industry anyway.

Also, please note that we had to shorten the live date from 2 to 1 day, on September 15th, 2020 and moved to Wuxi, instead of Suzhou.

We look forward to conference’s great success during this special time of year.

ADVANCED PACKAGING
IS EVERYONE’S BUSINESS!

We invite you to join the Symposium by Yole Développement and NCAP on Advanced Packaging Semiconductors, 2020 edition! For its 6th edition, the event has been renamed for:

SYNAPS
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Symposium by Yole Développement and NCAP on Advanced Packaging Semiconductors

SYNAPS logo yole


One year has passed since the latest successful edition. NCAP and Yole Développement are now back with an exciting 2020 program for you in Wuxi, China, this year.

As of, the agenda will be a powerful mix of key sessions related to the industry evolution and technical innovations and effective network times for people who will get the chance to join us on-site. By combining their technical and market expertise, both partners invite you during one exceptionnal day to gain an in-depth understanding of the advanced packaging industry evolution.

Advanced packaging processes are at the crossroad of all semiconductor manufacturing process steps today. For the overall semiconductor companies, advanced packaging is strategic to answer to the industry evolution and ensure the development of their activities. With more and more functionalities, companies have to manage their ability to integrate more and more components on a same die and propose a final product with a high reliability level.

At SYNAPS, 2020 edition, NCAP and Yole Développement invite you to dive deep into the advanced packaging technologies, understand the latest innovations and discover new business opportunities.

Save the date in your agenda right now and let us meet in Wuxi, China on September 15, 2020 !

Speakers

  • Varun Singh, Product Line Manager, Carrier Solutions Corning

    Varun Singh

    Product Line Manager, Carrier Solutions - Corning

  • Wade Liu

    Technical Marketing Director of Huatian Technology

  • Thomas Uhrmann EV Group

    Dr. Thomas Uhrmann

    Director of Business Development - EV Group

  • Hongwen He

    In charge of Collaboration Plans with Colleges and Industry - HiSilicon

  • Dr. Daquan Yu

    CEO - Xiamen Sky Semiconductor

  • David Butler

    David Butler

    Executive Vice President and General Manager - SPTS Technologies, a KLA company

  • Shen Guoqiang

    JSCC WB group R&D Center and Engineering Team Manager - JCET

  • Ramylanger

    Ramy Langer

    Chief Operating Officer - Camtek

  • Holly Sun

    General Manager of Hubei 3D Integration Manufacturing Innovation Center - XMC

  • Qidong Wang

    Director of R&D Department - NCAP

Sponsored by

PLATINIUM SPONSOR

SPTS Technologies, a KLA company, designs, manufactures, and markets wafer processing equipment for the global semiconductor and related industries, with focus on the Advanced Packaging, MEMS, high speed RF, power management and LED markets.

SPTS is headquartered and has its main manufacturing facility in Newport, UK, and operates across 19 countries in Europe, North America and Asia-Pacific. For more information, visit spts.com.

BADGE SPONSOR

The best valued Company which leads the future
Our goal is to be the best valued company leading technology standard
Since HANMI Semiconductor founded the semiconductor equipment industry in 1980, we have grown steadily into a world best Middle-End Semiconductor Equipment Manufacturer & maintain the top position. Through our continued export promotion policy, our high-end technology has been shipping abroad to our more than 280 global customers and this led to more widespread appreciation of its value. Especially, Sawing & Placement System, which was designated as the “World-Class Product’ is recording the first of global market share. Hanmi TSV Dual Stacking TC Bonder has won “2017 iR52 Jang Young-Sil Award”
Hanmi provides distinguished products and services for ‘Customer Satisfaction’. Hanmi won 2016 VLSI Customer Satisfaction Survey The Best Award & 10 Best Award.
Also, HANMI has been successful to get original technology with intensive R&D investment and selected as “Advanced Technology Center’ in 2008. Hanmi has 290 R&D Engineers and owns 810 worldwide Intellectual Properties.
HANMI Semiconductor is trying to be the best valued company as the pioneer spirit of the first Korean semiconductor equipment manufacturer.

BADGE SPONSOR

NAURA Technology Group Co., Ltd. (Hereinafter referred to as NAURA), is a leading enterprise of integrated circuit high-end technological equipment in China. It was formed through a strategic restructuring between Beijing Sevenstar Electronics Co., Ltd. (Hereinafter referred to as Sevenstar Electronics) and Beijing North Microelectronics Co., Ltd. (Hereinafter referred to as NMC).

Having inherited years of high-technology research and development strength of Sevenstar Electronics and NMC, NAURA integrated its resources and complemented its advantages with a new futuristic perspective based on technological innovation. The company devotes itself to quickening its strategic transformation to become a part of the new-type manufacturing industry, becoming an international leading product service provider for high-end electronic technological equipment and precision electronic components, to improving the smart-living, and realizing China’s dream of “strengthening a country through intelligence“.

NAURA owns four business groups: semiconductor equipment, vacuum equipment, new energy lithium battery equipment and precision components, which provide solutions for semiconductors, new energy resources, new materials as well as other fields. At present, NAURA owns four major industrial manufacturing bases, and its marketing service system covers major countries and regions in Europe, America and Asia.

In the future, NAURA will shine in the world arena as a leading firm in high-end electronic technology equipment and precision electronics, strive for further development and lead the way for the future. Furthermore, NAURA will also stick to customer demand-oriented sustainable innovation to promote the progress of industrial technology and bring infinite possibilities for the industry.

EXHIBITOR

Baihe Instruments was founded in Shanghai. Sales Network in China, with east China as the center, for all parts of the country. Is a set of pre-sales support and after-sales service as one of the technical enterprises. The company professional agent sales of advanced materials testing equipment, products from Europe, the United States, Japan and other well-known equipment suppliers in the industry. The company has experienced technical personnel and professional service team in the industry, can provide effective equipment technical support, and even the overall laboratory solutions. The company has a good product supply chain and a complete customer network to better serve the Chinese market.

www.bahens.cn

Partners

Yole Développement

POWERED BY

Yole Développement provides market research, technology analysis, strategy consulting, targeted media, and financial advisory services.

With a strong focus on emerging applications using silicon and/or micro manufacturing since 1998, Yole Développement has expanded to include more than 80 collaborators worldwide covering Photonics – Lighting – Imaging – Sensing & Actuating – Display – RF Devices & Technologies – Compound Semiconductors & Emerging Materials – Power Electronics – Batteries & Energy Management – Semiconductor Packaging and Substrates – Semiconductor Manufacturing – Memory – Computing and Software.

The market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting, Blumorpho and PISEO – all part of the Yole Group of Companies-, support industrial companies, investors and R&D organizations worldwide to follow technology trends to grow their business and help them understand the 6 specific markets.

More information: www.yole.fr

ncap logo

HOSTED BY

As an innovation model, National Center for Advanced Packaging Co., Ltd. (NCAP China) was registered in Wuxi New District, China, in September 2012. Supported by Wuxi and Jiangsu government, National Science and Technology Major Project(02 Project) and IC Packaging and Testing Industry Chain Technology Innovation Strategic Alliance, NCAP China, a joint venture with a capital of 234.45 million, is established by ten investors, including the leaders of the IC packaging and testing industry in China (Jiangsu Changjiang Electronics Technology, TongFu Microelectronics, Huatian Technology, Shennan Circuit Company, China Wafer Level CSP, AKM Electronic Technology (Suzhou), Jiangsu CAS Internet-of-things Technology Venture Capital, Shenzhen Fastprint Circuit Tech) and CDB Capital. NCAP’s goal is to establish a national R&D center for advanced packaging and system integration, play a global leading role in the development and commercialization of advanced technologies for microelectronics packaging and system integration, and promote and sustain the technological and commercial advancement of the microelectronics industry in China.

More information: www.ncap-cn.com

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