SYNAPS 2020 – Symposium by Yole Développement and NCAP on Advanced Packaging for Semiconductors

Yole Events

Wuxi, China & Online

In these uncertain times, Yole Développement and NCAP are working together to run the symposium as scheduled while guaranteeing health and safety of our participants and an international quality event. Thereby, we adapted the format of our event for this year: in addition to the conference hold onsite in Wuxi, on-demand presentations will be available online for all the attendees who cannot join on-site. In addition, this year, NCAP Open Day will be combined to SYNAPS. We believe that this solution will allow everyone to stay connected with the worldwide packaging industry anyway.

Also, please note that we had to shorten the live date from 2 to 1 day, on September 15th, 2020 and moved to Wuxi, instead of Suzhou.

We look forward to conference’s great success during this special time of year.


We invite you to join the Symposium by Yole Développement and NCAP on Advanced Packaging Semiconductors, 2020 edition! For its 6th edition, the event has been renamed for:

Symposium by Yole Développement and NCAP on Advanced Packaging Semiconductors

SYNAPS logo yole

One year has passed since the latest successful edition. NCAP and Yole Développement are now back with an exciting 2020 program for you in Wuxi, China, this year.

As of, the agenda will be a powerful mix of key sessions related to the industry evolution and technical innovations and effective network times for people who will get the chance to join us on-site. By combining their technical and market expertise, both partners invite you during one exceptionnal day to gain an in-depth understanding of the advanced packaging industry evolution.

Advanced packaging processes are at the crossroad of all semiconductor manufacturing process steps today. For the overall semiconductor companies, advanced packaging is strategic to answer to the industry evolution and ensure the development of their activities. With more and more functionalities, companies have to manage their ability to integrate more and more components on a same die and propose a final product with a high reliability level.

At SYNAPS, 2020 edition, NCAP and Yole Développement invite you to dive deep into the advanced packaging technologies, understand the latest innovations and discover new business opportunities.

Save the date in your agenda right now and let us meet in Wuxi, China on September 15, 2020 !


Yole Développement


Yole Développement provides market research, technology analysis, strategy consulting, targeted media, and financial advisory services.

With a strong focus on emerging applications using silicon and/or micro manufacturing since 1998, Yole Développement has expanded to include more than 80 collaborators worldwide covering Photonics – Lighting – Imaging – Sensing & Actuating – Display – RF Devices & Technologies – Compound Semiconductors & Emerging Materials – Power Electronics – Batteries & Energy Management – Semiconductor Packaging and Substrates – Semiconductor Manufacturing – Memory – Computing and Software.

The market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting, Blumorpho and PISEO – all part of the Yole Group of Companies-, support industrial companies, investors and R&D organizations worldwide to follow technology trends to grow their business and help them understand the 6 specific markets.

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As an innovation model, National Center for Advanced Packaging Co., Ltd. (NCAP China) was registered in Wuxi New District, China, in September 2012. Supported by Wuxi and Jiangsu government, National Science and Technology Major Project(02 Project) and IC Packaging and Testing Industry Chain Technology Innovation Strategic Alliance, NCAP China, a joint venture with a capital of 234.45 million, is established by ten investors, including the leaders of the IC packaging and testing industry in China (Jiangsu Changjiang Electronics Technology, TongFu Microelectronics, Huatian Technology, Shennan Circuit Company, China Wafer Level CSP, AKM Electronic Technology (Suzhou), Jiangsu CAS Internet-of-things Technology Venture Capital, Shenzhen Fastprint Circuit Tech) and CDB Capital. NCAP’s goal is to establish a national R&D center for advanced packaging and system integration, play a global leading role in the development and commercialization of advanced technologies for microelectronics packaging and system integration, and promote and sustain the technological and commercial advancement of the microelectronics industry in China.

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