In these uncertain times, Yole Développement and NCAP are working together to run the symposium as scheduled while guaranteeing health and safety of our participants and an international quality event. Thereby, we adapted the format of our event for this year: in addition to the conference hold onsite in Wuxi, on-demand presentations will be available online for all the attendees who cannot join on-site. In addition, this year, NCAP Open Day will be combined to SYNAPS. We believe that this solution will allow everyone to stay connected with the worldwide packaging industry anyway.
Also, please note that we had to shorten the live date from 2 to 1 day, on September 15th, 2020 and moved to Wuxi, instead of Suzhou.
We look forward to conference’s great success during this special time of year.
IS EVERYONE’S BUSINESS!
We invite you to join the Symposium by Yole Développement and NCAP on Advanced Packaging Semiconductors, 2020 edition! For its 6th edition, the event has been renamed for:
Symposium by Yole Développement and NCAP on Advanced Packaging Semiconductors
One year has passed since the latest successful edition. NCAP and Yole Développement are now back with an exciting 2020 program for you in Wuxi, China, this year.
As of, the agenda will be a powerful mix of key sessions related to the industry evolution and technical innovations and effective network times for people who will get the chance to join us on-site. By combining their technical and market expertise, both partners invite you during one exceptionnal day to gain an in-depth understanding of the advanced packaging industry evolution.
Advanced packaging processes are at the crossroad of all semiconductor manufacturing process steps today. For the overall semiconductor companies, advanced packaging is strategic to answer to the industry evolution and ensure the development of their activities. With more and more functionalities, companies have to manage their ability to integrate more and more components on a same die and propose a final product with a high reliability level.
At SYNAPS, 2020 edition, NCAP and Yole Développement invite you to dive deep into the advanced packaging technologies, understand the latest innovations and discover new business opportunities.
Save the date in your agenda right now and let us meet in Wuxi, China on September 15, 2020 !
Yole Développement and National Center for Advanced Packaging (NCAP China) decided to create and form the 1st Symposium Technical Committee. The Symposium Technical Committee is a 6-member group that takes the leadership role in setting and driving the conference’s content, working together with the Organizing Committee. Our Committee is responsible for ensuring a well-balanced, high quality conference program and is composed of a diverse set of senior industry experts:
Principal Analyst & Director Packaging, Assembly & Substrates, Yole Korea
Dr. Peng Sun
Director of Technology Division, National Center for Advanced Packaging, NCAP China
President and CEO,
Global Head of semiconductor packaging market segment, Henkel
Chief Marketing Officer and Senior Vice President of Mergers and Acquisitions, FormFactor
VP of Engineering, ASE Group
Sponsoring SYNAPS is a prime opportunity to put your company in front of more than 180 of the key industry players and decision makers of the industry. Different levels of opportunities to suit your needs – Discover our offers now
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LOCATION AND KEY INFORMATION
No 30 Hefeng Road
- Call for paper submission: from November 11, 2019 to May 8, 2020
- Registration opening : June 17, 2020
- Author notification: July 2, 2020
- Program reveiled: July 9, 2020
- Symposium dates: September 15, 2020
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Discover more information about the symposium through the 2019 edition by clicking here.
With a strong focus on emerging applications using silicon and/or micro manufacturing since 1998, Yole Développement has expanded to include more than 80 collaborators worldwide covering Photonics – Lighting – Imaging – Sensing & Actuating – Display – RF Devices & Technologies – Compound Semiconductors & Emerging Materials – Power Electronics – Batteries & Energy Management – Semiconductor Packaging and Substrates – Semiconductor Manufacturing – Memory – Computing and Software.
The market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting, Blumorpho and PISEO – all part of the Yole Group of Companies-, support industrial companies, investors and R&D organizations worldwide to follow technology trends to grow their business and help them understand the 6 specific markets.
More information: www.yole.fr
As an innovation model, National Center for Advanced Packaging Co., Ltd. (NCAP China) was registered in Wuxi New District, China, in September 2012. Supported by Wuxi and Jiangsu government, National Science and Technology Major Project(02 Project) and IC Packaging and Testing Industry Chain Technology Innovation Strategic Alliance, NCAP China, a joint venture with a capital of 234.45 million, is established by ten investors, including the leaders of the IC packaging and testing industry in China (Jiangsu Changjiang Electronics Technology, TongFu Microelectronics, Huatian Technology, Shennan Circuit Company, China Wafer Level CSP, AKM Electronic Technology (Suzhou), Jiangsu CAS Internet-of-things Technology Venture Capital, Shenzhen Fastprint Circuit Tech) and CDB Capital. NCAP’s goal is to establish a national R&D center for advanced packaging and system integration, play a global leading role in the development and commercialization of advanced technologies for microelectronics packaging and system integration, and promote and sustain the technological and commercial advancement of the microelectronics industry in China.
More information: www.ncap-cn.com