Semiconductor industry: it is imperative to innovate. Advanced packaging is the path forward…
Leading players must act fast and play on their strengths to innovate and compete. And advanced packaging could most certainly be a pivotal approach.
Advanced packaging has become essential for semiconductor innovation. Advanced packaging platforms allow this industry to explore new eras and innovate. And today, advanced packaging technologies are the key to bridge the gap between die and PCB.
In this dynamic context and encouraged by 7 consecutive years of successful symposiums that have attracted more than 200 participants on average, Yole and its partner NCAP (National Center for Advanced Packaging) are proud to announce this year again, the Symposium by Yole Développement and NCAP on Advanced Packaging Semiconductors – SYNAPS.
May 18-20, 2021 | Online
As a digital event, SYNAPS offers a unique place in the world where leading companies can share their vision of the advanced packaging industry, evaluate the emerging platforms, and identify business opportunities.
SYNAPS, an unprecedented program.
SYNAPS’s aim is to deliver a comprehensive understanding of the status of the advanced packaging industry and help companies to be part of the ‘tomorrow’ industry.
SYNAPS is unique. Don’t miss it!
The Symposium Technical Committee is a member group that takes the leadership role in setting and driving the conference’s content, working together with the Organizing Committee. Our Committee is responsible for ensuring a well-balanced, high quality conference program and is composed of a diverse set of senior industry experts:
Chief Marketing Officer and Senior Vice President of Mergers and Acquisitions, FormFactor
President and CEO,
Global Head of semiconductor packaging market segment, Henkel
Principal Analyst & Director Packaging, Assembly & Substrates, Yole Korea
Dr. Peng Sun
VP, National Center for Advanced Packaging, NCAP China
VP of Engineering, ASE Group
Sponsoring SYNAPS is a prime opportunity to put your company in front of more than 180 of the key industry players and decision makers of the industry. Different levels of opportunities to suit your needs – Discover our offers now
For more information, please contact Maelle Montmessin (email@example.com)
TIME ACCORDING TO TIMEZONE
- JST – Japan Standard Time : 16pm
- SGT – Singapore Standard Time : 15pm
- CST – China Standard Time : 15pm
- CET – Central European Time : 9am
- EST – Eastern Standard Time : 3am
- PST – Western Standard Time : 0am
Discover more information about the symposium through the 2020 edition by clicking here.
Wafer-Level Packaging: Fan-In, Fan-Out
3D and 2.5D Stack
Antennas in Packages (AiP)
Advanced Materials for Packaging
Merging Materials for Packaging Substrates
Dr. Tanja Braun - Fraunhofer
Head of the group Assembly & Encapsulation Technologies at Institute for Reliability and Microintegration
Ms. Debbie-Claire Sanchez - ERS
FO Equipment Business Unit Manager
Mr. Ramesh Chidambaram - Applied Material
Global Strategy Director for the advanced packaging business unit
Dr. Eu Poh Leng - NXP
Director, External Package Innovation
Mr. Asif-San Chowdhury - UTAC
Senior Vice President of Marketing and Corporate Business Development and Head of Japan Sales
Ms. Li-San Chan - Heraeus
Head of Semiconductor Advanced Packaging Market”.
Mr. Chan Pin Chong - Kulicke & Soffa
Vice President of Wedge Bonders business unit
Mr. Mike Lee - Samsung Electronics
Principal Engineer, RnD Strategy, Package Technology Planning, Samsung Electronics
Dr. Xue Haiyun - NCAP
Senior engineer at R&D Center of NCAP
Mr. Christian Vockenberger - AT&S
Manager Electronics Development Services – AT&S
Mr. Chris Scanlan - Besi
Senior Vice President Technology
LUCKY DRAW SPONSOR
BE Semiconductor Industries N.V. (“Besi”) is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries focusing primarily on the advanced packaging segment of the market. Besi develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, cloud infrastructure, computing, automotive, industrial, LED and solar energy. Customers are primarily leading semiconductor manufacturers, assembly subcontractors and electronics and industrial companies. Besi’s ordinary shares are listed on Euronext Amsterdam (symbol: BESI). Its Level 1 ADRs are listed on the OTC markets (symbol: BESIY Nasdaq International Designation) and its headquarters are located in Duiven, the Netherlands. Research and Development is organized in Switzerland, Austria and the Netherlands. Support and production is in Singapore, Malaysia and China. For more information, please visit our website at www.besi.com.
SPTS Technologies, a KLA company, designs, manufactures, and markets wafer processing equipment for the global semiconductor and related industries, with a focus on the advanced packaging, MEMS, high speed RF, power management and photonics markets. SPTS offers a broad range of process solutions for advanced packaging, which include Si etch for TSVs, via reveal or wafer thinning, PVD for UBM/RDL and TSV barrier/seed layers, CVD of low temperature dielectrics, and plasma dicing.
SPTS is headquartered and has its main manufacturing facility in Newport, UK, and operates across 19 countries in Europe, North America and Asia-Pacific. For more information, visit spts.com.
ERS has been supplying innovative thermal test solutions to the semiconductor industry since 1970 and is famous for fast-ramping and precise low-noise thermal systems (-65°C to +400°C) for analytical, parametric and wafer sort probing up to 300mm. The patented ERS flagship product for hot/cold wafer test, AC3(R), is available for package-level tri-temp applications for MEMS test. We design and build stand-alone thermal-forcing systems and custom production tools for difficult thermal applications. We also supply the advanced wafer level packaging market with its fully automatic debonders and manual warpage adjust tools used in the production of both 200mm and 300mm eWLB device packages. On a broader scale, ERS supports not only eWLB but many other Fan-Out Wafer-Level-Packaging (FOWLP) and Panel-Level-Packaging (FOPLP) technologies. Our headquarter, sales department, engineering center and production facilities are in the Munich suburb of Germering, and we also have sales and support offices in the US, China, Singapore and Taiwan.
Learn more at: www.ers-gmbh.com
KLA develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward.
Additional information may be found at https://www.kla.com/
The best valued Company which leads the future
Our goal is to be the best valued company leading technology standard
Since HANMI Semiconductor founded the semiconductor equipment industry in 1980, we have grown steadily into a world best Middle-End Semiconductor Equipment Manufacturer & maintain the top position. Through our continued export promotion policy, our high-end technology has been shipping abroad to our more than 280 global customers and this led to more widespread appreciation of its value. Especially, Sawing & Placement System, which was designated as the “World-Class Product’ is recording the first of global market share. Hanmi TSV Dual Stacking TC Bonder has won “2017 iR52 Jang Young-Sil Award”
Hanmi provides distinguished products and services for ‘Customer Satisfaction’. Hanmi won 2016 VLSI Customer Satisfaction Survey The Best Award & 10 Best Award.
Also, HANMI has been successful to get original technology with intensive R&D investment and selected as “Advanced Technology Center’ in 2008. Hanmi has 290 R&D Engineers and owns 810 worldwide Intellectual Properties.
HANMI Semiconductor is trying to be the best valued company as the pioneer spirit of the first Korean semiconductor equipment manufacturer.
Learn more at : http://www.hanmisemi.com/
In 1957, Japan was finishing postwar reconstruction and starting a period of high economic growth. Petrochemical products were essential for industrial development. JSR Corporation (formerly Japan Synthetic Rubber Co., Ltd.) was established as a national policy concern to pioneer synthetic rubber production in Japan. We later applied our polymer technologies in the fine chemicals sector to produce semiconductor materials, display materials, and other products. JSR is currently taking up the challenge of materials innovation applicable in new fields, including the life sciences, environment and energy that make use of the acquired technologies in the fine chemicals sector. These are under development as future JSR core businesses.
More : http://www.jsr-sh.com.cn/
Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor and electronic assembly solutions serving the global automotive, consumer, communications, computing and industrial markets. Founded in 1951, K&S prides itself on establishing foundations for technological advancement – creating pioneering interconnect solutions that enable performance improvements, power efficiency, form-factor reductions and assembly excellence of current and next-generation semiconductor devices.
Leveraging decades of development proficiency and extensive process technology expertise, Kulicke & Soffa’s expanding portfolio provides equipment solutions, aftermarket products and services supporting a comprehensive set of interconnect technologies including wire bonding, advanced packaging, lithography, and electronics assembly. Dedicated to empowering technological discovery, always, K&S collaborates with customers and technology partners to push the boundaries of possibility, enabling a smarter future (www.kns.com).
The SMT Solutions segment within the ASM Pacific Technology Group
The mission of the SMT Solutions segment within the AMS Pacific Technology Group (ASMPT) is to implement and support the smart SMT factory at electronics manufacturers worldwide.
ASM solutions such as SIPLACE placement systems and DEK printing systems support the networking, automation and optimization of central workflows with hardware, software and services that enable electronics manufacturers to transition to the smart SMT factory in stages and enjoy dramatic improvements in productivity, flexibility and quality.
Since maintaining close relationships with customers and partners is a central component of ASM’s strategy, the company has established the SMT Smart Network as a global forum for the active exchange of information between and with smart champions. In addition to being a founding member of the ADAMOS joint venture for the development of an IIoT platform for manufacturing companies, ASM is establishing together with other SMT manufacturers the open HERMES standard as a successor to the SMEMA standard for M2M communication in SMT lines.
For more information about ASM, visit www.asm-smt.com.
Yole Développement provides market research, technology analysis, strategy consulting, targeted media, and financial advisory services.
With a strong focus on emerging applications using silicon and/or micro manufacturing since 1998, Yole Développement has expanded to include more than 80 collaborators worldwide covering Photonics – Lighting – Imaging – Sensing & Actuating – Display – RF Devices & Technologies – Compound Semiconductors & Emerging Materials – Power Electronics – Batteries & Energy Management – Semiconductor Packaging and Substrates – Semiconductor Manufacturing – Memory – Computing and Software.
The market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting and PISEO – all part of the Yole Group of Companies-, support industrial companies, investors and R&D organizations worldwide to follow technology trends to grow their business and help them understand the 6 specific markets.
More information: www.yole.fr
As an innovation model, National Center for Advanced Packaging Co., Ltd. (NCAP China) was registered in Wuxi New District, China, in September 2012. Supported by Wuxi and Jiangsu government, National Science and Technology Major Project(02 Project) and IC Packaging and Testing Industry Chain Technology Innovation Strategic Alliance, NCAP China, a joint venture with a capital of 234.45 million, is established by ten investors, including the leaders of the IC packaging and testing industry in China (Jiangsu Changjiang Electronics Technology, TongFu Microelectronics, Huatian Technology, Shennan Circuit Company, China Wafer Level CSP, AKM Electronic Technology (Suzhou), Jiangsu CAS Internet-of-things Technology Venture Capital, Shenzhen Fastprint Circuit Tech) and CDB Capital. NCAP’s goal is to establish a national R&D center for advanced packaging and system integration, play a global leading role in the development and commercialization of advanced technologies for microelectronics packaging and system integration, and promote and sustain the technological and commercial advancement of the microelectronics industry in China.
More information: www.ncap-cn.com