All key players with different FO technologies are facing an unavoidable battle of cost and performance trade-off between panel-level vs. wafer-level.
In 2019, key players from all different business models like OSATs, foundries and IDMs have Fan-Out packaging solutions in the market. Fan-out packaging technology is not only a bridge to chip-package interaction (CPI) mismatch in pitch size, but is also a viable solution for heterogeneous integration of functionalities, now potentially used for mmWave 5G and Cloud data server applications.
Fan-out packaging total market value is expected to grow at 19% CAGR from 2019 to 2024, reaching a market size of $3.8B. Fan-out success is evidently defined by the well-established “core” standard FO market and the startling market penetration of high-density FO (HDFO), which brought Fan-Out Packaging into a whole new level of spotlight.
FOWLP players like Amkor Portugal (NANIUM, S. A.) and JCET Group (STATS ChipPAC) used to have almost 80% market share prior to 2016. Since 2016 after Apple’s adoption of TSMC’s InFO for APE in iPhone 7 and beyond, new players like SEMCO, PTI, SPIL, Nepes, ASE/Deca are all entering FO market with different strategies and technologies.
Join Yole Développement and System Plus Consulting in this webcast to gain insights on the different levels of battles that are unfolding in, arguably, one of the most exciting advanced packaging platforms – Fan-Out Packaging.
Fan-Out Packaging: Technologies and Market Trends 2019
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
TECHNOLOGY AND MARKET ANALYST | Package, Assembly and Substrates - YOLE DÉVELOPPEMENT
Stéphane Elisabeth, PhD
Expert Cost Analyst - System Plus Consulting
David Jourdan (Moderator)
SALES COORDINATION & CUSTOMER SERVICE - YOLE DÉVELOPPEMENT
Founded in 1998, Yole Développement, the “More than Moore” market research & strategy consulting company has grown to become a group of companies providing marketing, technology and strategy consulting, media in addition to corporate finance services. Yole Développement group provides market research, technology analysis, strategy consulting, targeted media, and financial advisory services. We have a global vision and customer base… The “More than Moore” company Yole and its partners System Plus Consulting, Blumorpho, PISEO and KnowMade support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business… Our fields of expertise: MEMS & Sensors – Imaging – Medical Technologies – Compound Semiconductors – RF Electronics – Solid State Lighting – Displays – Photonics – Power Electronics – Batteries & Energy Management – Advanced Packaging – Semiconductor Manufacturing – Software & Computing – Memory and more…
System Plus Consulting specializes in the cost analysis of electronics, from semiconductor devices to electronic systems. Created more than 20 years ago, System Plus Consulting has developed a complete range of services, costing tools and reports to deliver in-depth production cost studies and estimate the objective selling price of a product. System Plus Consulting engineers are experts in:
Integrated Circuits – Power Devices & Modules – MEMS & Sensors – Photonics – LED – Imaging – Display – Packaging – Electronic Boards & Systems.
Through hundreds of analyses performed each year, System Plus Consulting offers deep added-value reports to help its customers understand their production processes and determine production costs. Based on System Plus Consulting’s results, manufacturers are able to compare their production costs to those of competitors. System Plus Consulting is a sister company of Yole Développement.
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