Trends in Power Package Design & Material Compatibility – Webinar

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Trends in Power Package Design and Material Compatibility: How a New, High Thermal Semi-Sintering Die Attach Adhesive for BSM-optional Die Integration is Changing the Game

Join Henkel’s technology experts to learn more about today’s high power design trends and the requirement for new semiconductor materials to enable their integration and optimized performance. The webinar will present market characteristics and share information about Henkel’s LOCTITE ABLESTIK ABP 8068TD, the latest semi-sintering die attach adhesive to address emerging requirements. Ideal for power packages and designed for use with back-side metallized (BSM) or non-BSM die, the new die attach adhesives provides thermal control in an easy-to-process, high-reliability formulation.

Attendees can expect to learn about:

  • Drivers and market trends dictating power package design
  • Challenges with current die attach material solutions
  • Semi-sintering material attributes and how are they different from other die attach systems
  • Thermal requirements for high power designs
  • Reliability and processing performance of a new semi-sintering material for BSM-optional die

Note: There will be 2 identical sessions to accommodate global time zones:

  • Tuesday May 18, 2021 5:00 PM – 6:00 PM CEST
  • Wednesday May 19, 2021 2:00 AM – 3:00 AM CEST

Yole Développement will participate to the following:

Shalu Agarwal, Technology & Market Analyst, Power Electronics & Materials


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