Wafer Starts for More than Moore Applications – Webcast

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FREE WEBCAST – June 28 at 5 PM CEST – 8 AM PDT

Wafer Starts for More Than Moore Applications

Driven by megatrend markets, More than Moore devices’ overall wafer demand
is expected to grow at an almost 10% CAGR from 2017 to 2023

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PROGRAM :

Driven by the adoption of electronic components in an ever more diverse range of products, the semiconductor industry is facing a new era. Device scaling and cost reduction will no longer continue on the path they followed for the past few decades, as defined by Moore’s law. In order to answer market demands, the industry is looking for technology solutions to bridge the gap and revive the cost/performance curve, while adding more functionality through integration.

More-than-Moore devices deliver this new functional diversification, their technologies combining performance, integration and cost in a way that is not limited to CMOS scaling. They are therefore becoming more important.

Consequently, wafer demand for More than Moore devices is expected to grow with a compound annual growth rate (CAGR) of almost 8% from 2017–2023. The market is strongly driven by numerous megatrends such as fifth generation (5G) wireless infrastructure and mobile technology, additional mobile functionalities, voice processing, smart automotive and vehicle electrification, Augmented Reality/Virtual Reality (AR/VR), and artificial intelligence.

The webcast illustrate the different types of More than Moore devices as well as the megatrend applications drivers. Moreover, Yole Développement will present market forecasts in terms of wafer starts for all More than Moore devices as well as wafer size and semiconductor material trends. This one will be completed by a presentation “Trends in Wafer Processing Technologies for RF MEMS” of David Butler, Executive Vice President and General Manager at SPTS Technologies, and a presentation of Ravij Parmar, New Product Development Manager for Corning Precision Glass Solutions: “Benefits of through glass vias for RF applications”.

 

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Speakers:

Photo AmandinePizzagalli YOLE 2018Amandine Pizzagalli is a Technology & Market Analyst, Equipment & Materials – Semiconductor Manufacturing, at Yole Développement (Yole). Amandine is part of the development of the Semiconductor & Software division of Yole with the production of reports and custom consulting projects. She is in charge of comprehensive analyses focused on semiconductor equipment, materials and manufacturing processes.

Previously, Amandine worked as Process engineer on CVD and ALD processes for semiconductor applications at Air Liquide. Amandine was based in Japan during one year to manage these projects.

Amandine is graduated in Electronics from CPE Lyon (France), with a technical expertise in Semiconductor & Nano-Electronics and has a master focused on Semiconductor Manufacturing Technology, from KTH Royal Institute of Technology (Sweden).

She has spoken in numerous international conferences and has authored or co-authored more than 10 papers.

 

D Butler 2017David Butler currently serves as Executive Vice President and General Manager at SPTS Technologies with overall responsibility of product management and marketing of SPTS’s portfolio of industry leading etch and deposition process solutions and executive relationships with SPTS’s customers.

Previously, David served as VP of product and corporate marketing, overseeing all marketing efforts for SPTS’s full range of PVD, Etch, CVD, and thermal products. With more than two decades of experience in the semiconductor capital equipment and related industries, David first joined Electrotech in 1988 as a Senior Process Engineer, then moved to Product Marketing for Electrotech’s PVD products.

In 2004, he assumed the role of Director of Marketing for the PVD/Etch/CVD products at Trikon, becoming Vice President of Marketing for the three product lines at Aviza Technology following the merger of Aviza and Trikon.

 

Raj Parmar headshotRajiv Parmar is currently New Product Development Manager for Corning Precision Glass Solutions. He oversees glass substrates and materials targeted for Radio Frequency devices such as filters and front-end modules for mobile handsets, telecom infrastructure, and other markets such as fixed wireless access, and Internet of Things applications. He is responsible for all strategic engagements with OEMs, supply chain partners, and RF component vendors in the wireless industry. Rajiv leads all product concepts, roadmap, and product development strategies for this segment of Corning.

Rajiv has accumulated more than 20 years of experience in the semiconductor industry. He has previously held positions in technology development, modeling, integrated circuit design, and most recently in strategic marketing and product development. Rajiv has been Director of Marketing at Skyworks, Maxim Integrated Products and Motorola, and most recently at Qorvo. His marketing efforts have led to more-than $20 million in revenue growth for Maxim’s Battery Management Business Unit, which covers products in single cell fuel gauging, battery protection and charging. Rajiv has also had extensive experience in the development of power management (PMIC) ICs.

His technology interests include sensors, nanotechnology, wireless devices, Cleantech, 3D motion capture, transportation, and smart materials. Rajiv has a Master’s degree in Electrical Engineering from University of Florida and a Bachelor’s degree from Colgate University.


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RELATED REPORTS

Yole YD18011 Wafer starts for More than Moore applications March couv Wafer Starts for More Than Moore Applications

Driven by megatrend markets, More than Moore devices’ overall wafer demand is expected to grow at an almost 10% CAGR from 2017 to 2023.
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