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European 3D Summit
From Monday 22 January 2018
To Wednesday 24 January 2018

3DS18 Banner 150x87This year’s 6th edition of SEMI European 3D Summit will continue to explore a wider scope of 3D topics that will include 3DIC Through-Silicon-Via (TSV) technology and its challenges, but also talks on 2.5D, 3D FO-WLP/ e-WLB, Glass interposers, thermal management and 3D alternative technologies in order to create Heterogeneous Integration and High Density Systems for different applications.



Meet Yole Developpement's team on booth 2 :

picto micro speaker blue Assist to the presentations of Yole's team on:

"2018, the golden year for 3D integration" on January 22 at 5:25PM
Thibault Buisson, Business Unit Manager from Yole Développement


Ask for a This email address is being protected from spambots. You need JavaScript enabled to view it.!

Location Dresden, Germany