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WHERE TO MEET US

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IMAPS Device Packaging Conference & Global Business Council
From Tuesday 06 March 2018
To Thursday 08 March 2018

imaps dpc2018 USA yole developpementThe 14th Annual Device Packaging Conference will be held in Fountain Hills, Arizona in 2018. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels.

 

This email address is being protected from spambots. You need JavaScript enabled to view it. and meet Yole Developpement's team on booth 36.
Feel free to attend our presentations:


-"2018 a turning point for 3D TSV integration: will AI be the real opportunity for 3D and 2.5D integration?" on March 6 at 2:00PM
Emilie Jolivet, Technology & Market analyst in Advanced Packaging

Photo EmilieJolivet YOLE 2018Abstract: The industry is looking for technology solutions combining performance, integration and cost not limited to the CMOS scaling. The semiconductor industry's hopes and patience were rewarded a few years ago when 3D stacked devices have entered the market using vertical interconnect TSV... More here

"Fan-Out Wafer-Level-Packaging: Market and Technology Trends" on March 6 at 2:00PM
Jerome Azemar, Technology & Market analyst in Advanced Packaging

Photo JéromeAzemar YOLE 2018Abstract: Advanced packaging importance will become more and more preponderant, considering scaling and cost reduction will not be possible just by continuing on the path the industry followed for the past few decades with Moore's law. In order to answer market demands, the industry seeks further performance and functionality boosts in integration... More here

"MEMS & Sensors for Next Generation Automotiveon March 7 at 9:30AM
Santosh Kumar, Senior Technology & Market analyst in Advanced Packaging

Photo SantoshKumar YOLE 2018Abstract: In a global automotive market worth than US$2.3T, the little world of automotive sensors has recently been shaken up by the emergence of electric and autonomous cars. Despite just 3% growth in the volume of cars sold expected through to 2022, Yole Développement expects an average growth rate in sensors sales volumes above 8% over the next five years, and above 14% growth in sales value... More here

"Memory Packaging Trends: from Wire-bond to TSV! " on March 7 at 5:30PM
Santosh Kumar, Senior Technology & Market analyst in Advanced Packaging

Photo SantoshKumar YOLE 2018Abstract: There are many different memory device packaging options, implying a wide range of packaging technologies ranging from low pin-count SOP packages to high pin-count TSV options, all depending on product requirements like density, performance, and cost. In 2016, wire- bond BGA accounted for more than 80% of the packaging market in dollar terms... More here

 

Location Fountain Hill, USA