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Advanced Packaging & System Integration Technology Symposium
From Monday 22 April 2019 -  08:00am
To Tuesday 23 April 2019 - 05:00pm
Contact Fanny (This email address is being protected from spambots. You need JavaScript enabled to view it.)

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Advanced packaging: at the heart of innovation


Advanced packaging is driven by the wind of changes...
Be part of our Advanced Packaging & System Integration Technology Symposium!

22PM - 23 April, 2019 | NEW LOCATION: Shanghai, China - Prior to NEPCON China 2019

For the 5th edition, NCAP and Yole Développement combine their expertise to build an innovative program dedicated to the advanced packaging industry – during one day and a half, meet the leading executives and gain an in-depth understanding of the market evolution!

It is a fact, Advanced packaging is at the heart of innovation. Mega-trend applications are bringing new challenges, and leading advanced packaging companies from all over the world will come to exchange ideas on their vision and future perspectives at the Advanced Packaging & System Integration Technology Symposium.

Yole Développement and NCAP have created an unprecedented program to understand the status of the advanced packaging industry and help the companies to be part of the ‘tomorrow’ industry. The Advanced Packaging & System Integration Technology Symposium is unique. Don’t miss it!

This year, the location will change, it will thus take place in Shanghai, China, from April 22PM to 23, 2019, prior to NEPCON China 2019.

During one day and a half, all packaging aspects, including Panel Level, Fan Out, System in Package, Advanced Substrates and 3D Technology, will be discussed. A focus on key applications such as AI, HPC, memory, transportation (48V, EV/HEV, embedded die packaging platform, PCB, advanced substrates…), 5G and consumer (WLP and Fan-Out platforms)… will be at the heart of the conference.


Gain an insight into a unique symposium...

  • 6 key industry focuses: AI, HPC, memory, transportation, 5G and consumer
  • About 20 inspiring presentations
  • Unique access to leading players and experts
  • A panel session to debate
  • Several networking times to discuss with your peers
  • Short courses to cover a broad range of topic areas at a variety of educational levels

 

Don't miss this opportunity to exchange with key players!

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Program to be unveiled!

The structure of the symposium will allow attendees to get valuable insights into the advanced packaging industry as well as provide unprecedented opportunities for meeting with industry leaders…

The program is today under construction. To submit an abstract, please contact: Fanny Vitrey (This email address is being protected from spambots. You need JavaScript enabled to view it.)

Networking sessions during the all event. Get the opportunity to exchange with all the leading players in the advanced packaging industry.


Discover the agenda of the previous edition here!


Registration

Registration will open soon!


Sponsorship opportunities coming soon

Sponsoring the Advanced Packaging & System Integration Technology Symposium is a prime opportunity to put your company in front of more than 150 of the key industry players and decision makers of the industry. Different levels of opportunities to suit your needs. - Discover our offers soon

For more information, please contact Fanny (This email address is being protected from spambots. You need JavaScript enabled to view it.)


Travel and venue

The symposium will be held at Shanghai. The location will be communicated soon.

Kind reminder to the overseas visitors: China visa are required to all the overseas passport holders for entry into Chinese territories. Visa Application may take a long period, and we kindly remind you to apply for the China visa as early as possible. If you need invitation letter, please contact This email address is being protected from spambots. You need JavaScript enabled to view it. or This email address is being protected from spambots. You need JavaScript enabled to view it.or download it: here.

For more information, please contact Fanny (This email address is being protected from spambots. You need JavaScript enabled to view it.)


Previous editions

Symposium 2018

Please consult the program of previous events:
Advanced Packaging & System Integration Technology Symposium 2018
Advanced Packaging & System Integration Technology Symposium 2017

For more information, please contact Fanny (This email address is being protected from spambots. You need JavaScript enabled to view it.)

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Location Shanghai, China