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European 3D Summit
From Monday 23 January 2017
To Wednesday 25 January 2017

3D17 european summit 150x87px yole i micronews2017: Creating High Density Systems

This year’s 5th edition of SEMI European 3D Summit will continue to explore a wider scope of 3D topics that will include 3DIC Through-Silicon-Via (TSV) technology and its challenges, but also talks on 2.5D, 3D FO-WLP/ e-WLB, Glass interposers, and 3D alternative technologies in order to create Heterogeneous Integration and High Density Systems for different applications.

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Assist to the presentations of Yole Group of Companies on:

"Technology & Cost Review of 3D Packages in High Volume Manufacturing (HVM)" on Jan. 23 at 5:30PM 
Romain Fraux, CTO, System Plus Consulting

"3D Packaging: A Key Enabler for Further Integration and Performance" on Jan. 23 at 6:30PM 
Thibault Buisson, Business Unit Manager, Advanced Packaging, Yole Développement

Panel session: "How Bringing High Density Interconnect into Production?" on Jan. 24 at 5:30PM  
Jean-Christophe Eloy, CEO, Yole Developpement as Moderator

Our experts will welcome you on our booth in the Lobby area - Ask for a This email address is being protected from spambots. You need JavaScript enabled to view it. !

Location Grenoble, France
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