Secure payment on i-micronews Contact Yole Développement for I Micronews reports

RSS I-micronewsYole Dévelopement on TwitterYole Développement on Google +LinkedIn Yole pageSlideshare Yole Développement I-Micronews

TRADESHOW & CONFERENCES

Previous month Previous day Next day Next month
Search
13th International Conference and Exhibition on Device Packaging
From Monday 06 March 2017
To Thursday 09 March 2017

DP Ad 150x87The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

picto micro speaker blue


Meet Yole Developpement's team on booth #15 and attend our presentations:

What is Driving the 3D TSV Technologies Business: Market Update and Technical Trends on Mar. 7 at 10:30AM
Santosh Kumar, Senior Technology and Market Analyst at Yole Développement

Fan-Out Wafer-Level-Packaging: Market and Technology Trend on Mar. 7 at 10:30AM
Jérôme Azemar, Technology and Market Analyst at Yole Développement

Evening Panel Discussion organised by Yole Développement: The Fan-Out Breakout
On Mar. 7 at 6:30PM

Fan-Out is the most dynamic solution in the Advanced Packaging playground at the moment. All attendees are welcome to attend and interact in the panel discussion organized by Yole Développement. It will be the opportunity to learn and debate with key industrial players willing to share their different points-of-view and visions on Fan-Out, related strategy, business, and technology trends.

Moderator: Jérôme Azemar,Technology and Market Analyst at Yole Développement

Panelists:

- Santosh Kumar, Senior Technology and Market Analyst, Yole Développement
- Rich Rice, Sr. VP of Business Development, ASE Global
- Islam Salama,
Director: Pathfinding Department, Substrate and Packaging Technology Development, Intel
- Johannes Lodermeyer,
 Wafer Level Technology Development Responsible, Infineon Technologies
- Vinayak Pandey,
Product and Technology Marketing Director OR Scott Sikorski, Product Technology Marketing Vice-President,STATS ChipPAC

Ask for a This email address is being protected from spambots. You need JavaScript enabled to view it.!

Location Fountain Hills, Arizona
June 2017
S M T W T F S
1 2 3
4 5 6 7 8 9 10
11 12 13 14 15 16 17
18 19 20 21 22 23 24
25 26 27 28 29 30