Secure payment on i-micronews Contact Yole Développement for I Micronews reports

RSS I-micronewsYole Dévelopement on TwitterYole Développement on Google +LinkedIn Yole pageSlideshare Yole Développement I-Micronews

TRADESHOW & CONFERENCES

Previous month Previous day Next day Next month
Search
IC Packaging Technology Expo
From Wednesday 18 January 2017
To Friday 20 January 2017

ICP2017

Asia’s leading exhibition for IC final manufacturing gathering advanced equipment, materials and services.

 

 

 

picto micro speaker blue


Make sure you attend our presentations:

"Fan-Out Packaging Market Trends" (Date and time to be announced) 
Jérôme Azemar, Market & Technology Analyst, Yole Développement

"Status of Advanced Packaging Industry" (Date and time to be announced)  
Thibault Buisson, Business Unit Manager, Advanced Packaging, Yole Développement

Our experts will welcome you on our booth W9-19 in the PWB Expo area - Ask for a This email address is being protected from spambots. You need JavaScript enabled to view it. !

Location Tokyo, Japan
March 2017
S M T W T F S
1 2 3 4
5 6 7 8 9 10 11
12 13 14 15 16 17 18
19 20 21 22 23 24 25
26 27 28 29 30 31