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NEPCON Japan : IC & Sensor Packaging Technology EXPO
From Wednesday 17 January 2018
To Friday 19 January 2018

ISP 2018 yole developpement nepconjapanThe 19th edition of the IC & Sensor Packaging Technology EXPO is Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services.

This exhibition is gathering of all kinds of products, technologies and services that can contribute to the miniaturization and thinning of cutting-edge devices such as Semiconductors, LED, Power Devices, Sensors and MEMS.



Meet Yole Developpement's team :

picto micro speaker blue Assist to the presentations of Yole's team on:

"MEMS Sensor and IC advanced package: how automotive and AI will challenge packaging business" on January 17 at 9:30AM - Session ISP-1
Emilie Jolivet, Technology & Market analyst from Yole Développement


Ask for a This email address is being protected from spambots. You need JavaScript enabled to view it.!

Location Tokyo, Japan
January 2019
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