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Advanced Packaging for Flexible Electronics Symposium
Thursday 26 April 2018

150x87 2018 FLEX PECTEC yole

This event will explore the market opportunities, emerging applications, and materials and process requirements to provide this functionality at an affordable cost. You’ll hear from experts in polymers and other flexible materials, effects of complex packaging structures on signal integrity, speed and power consumption, and the latest and most promising technology for heterogeneous packaging. Topics will also include cutting edge/niche concepts in medical implantable devices and “synthetic skin”, etc.

Location San Jose, USA
September 2018
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