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IC & Sensor Packaging Technology EXPO - 2019
From Wednesday 16 January 2019
To Friday 18 January 2019

logo ispAsia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services.

Exhibition specialised in packaging technologies for semiconductors, LEDs, power devices, MEMS device, etc. Here is the best place to meet Japanese & overseas engineers from semiconductor/sensor manufacturers.

This email address is being protected from spambots. You need JavaScript enabled to view it. and meet Yole Developpement's team on our booth!

Location Tokyo, Japan
November 2018
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