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TRADESHOW & CONFERENCES

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15th International Conference and Exhibition on DEVICE PACKAGING
From Monday 04 March 2019
To Thursday 07 March 2019

imaps dpc2019 USA yole developpementThe 15th Annual Device Packaging Conference (DPC 2019) will be held in Fountain Hills, Arizona, on March 4-7, 2019. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

  

This email address is being protected from spambots. You need JavaScript enabled to view it. and meet Yole Developpement's team on booth 58.

Location Fountain Hills, Arizona USA
January 2019
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