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SiC and GaN devices for the power electronics market
Tuesday 10 January 2017, 05:00pm - 06:00pm
Contact Camille Veyrier (This email address is being protected from spambots. You need JavaScript enabled to view it.)

Webcast GaN SiC for Power Electronics market - Yole Développement

FREE WEBCAST - January 10 at 5:00 PM CET

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SiC and GaN devices for the power electronics market
Technology is progressing, players are arriving, and promising applications are emerging. The SiC and GaN power device market is growing.

For power electronics applications, wide bandgap (WBG)-based technologies (particularly silicon carbide (SiC) and gallium nitride (GaN)) are commonly accepted as capable alternatives to incumbent silicon-based technology. In fact, most power module and power inverter manufacturers have already included WBG in their roadmap as an option or a firm project. Time-to-market does, however, differ from application to application as a value function related to cost, specifications, availability, etc.

Based on Yole Développement’s most recent reports and System Plus Consulting’s latest teardowns, this important webcast offers an in-depth summary of the strategy, business, and technology trends impacting the SiC and GaN power industry.



HongLin Casual YOLE2015 WB

Hong Lin, Compound Semiconductors & Power Electronics Technology & Market Analyst, Yole Développement
Dr. Hong Lin works at Yole Développement, the "More than Moore" market research and strategy consulting company, as a technology and market analyst since 2013. She is specialized in compound semiconductors and provides technical and economic analysis. Before joining Yole Développement, she worked as R&D engineer at Newstep Technologies. She was in charge of the development of cold cathodes by PECVD for visible and UV lamp applications based on nanotechnologies. She holds a Ph.D in Physics and Chemistry of materials.



Elena Barbarini System Plus Consulting
Elena Barbarini, Senior Cost Engineer, System Plus Consulting

Elena Barbarini is in charge of costing analyses for MEMS, IC and Power Semiconductors. She has a deep knowledge of Electronics R&D and Manufacturing environment. Elena holds a Master in Nanotechnologies and a PhD in PowerElectronics.






Camille Veyrier, Marketing & Communication Project Manager, Yole Développement

Since 2009, Camille Veyrier has been one of Yole Développement’s Marketing and Communication Project Managers, in charge of events organization and media product development (websites, e-newsletters, etc.). Camille works closely with Yole Développement’s Corporate Communication department, specifically in the fields of Power Electronics, Advanced Packaging, Compound Semiconductors, LED and Displays. Camille earned a degree in Communication & Marketing from a leading Translation and International Business school in Lyon.



Discover the related report about SiC and GaN here


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Category: RF Devices & Technologies

From: Wednesday June 14 To Wednesday June 14, Location: From your computer

Category: Medtech

From: Tuesday April 25 To Tuesday April 25, Location: From your computer

Category: Displays

From: Wednesday March 29 To Wednesday March 29, Location: From your computer

Category: Advanced Packaging

From: Monday January 16 To , Location: From your computer

Category: Compound Semi

From: Tuesday January 10 To Tuesday January 10, Location: From your computer

Category: Advanced Packaging

From: Tuesday December 13 To , Location: From your computer

Category: MEMS & Sensors

From: Wednesday December 7 To , Location: From your computer

Category: Imaging

From: Wednesday September 28 To Wednesday September 28, Location: on your computer

Category: Manufacturing

From: Wednesday September 14 To , Location: 

Category: MEMS & Sensors

From: Thursday July 21 To , Location: From your computer

Category: MEMS & Sensors

From: Thursday July 7 To Thursday July 7, Location: 

Category: Power electronics

From: Tuesday June 28 To , Location: From your computer

Category: MEMS & Sensors

From: Tuesday June 21 To , Location: From your computer

Category: MEMS & Sensors

From: Wednesday May 11 To Wednesday May 11, Location: 

Category: Advanced Packaging

From: Tuesday May 10 To Tuesday May 10, Location: 

Category: MEMS & Sensors

From: Tuesday May 3 To Tuesday May 3, Location: 

Category: Imaging

From: Tuesday November 10 To , Location: From your computer