Secure payment on i-micronews Contact Yole Développement for I Micronews reports

RSS I-micronewsYole Dévelopement on TwitterYole Développement on Google +LinkedIn Yole pageSlideshare Yole Développement I-Micronews

WEBCAST

Previous month Previous day Next day Next month
Search
3D and 2.5D TSV integration
Thursday 07 September 2017, 05:00pm - 06:00pm
Contact Camille Veyrier (This email address is being protected from spambots. You need JavaScript enabled to view it.)

 webcast 3D yole link 646x220

REGISTER TO ACCESS THE ARCHIVE FOR FREE 

FREE WEBCAST - September 7 at 5:00 PM CET

You just need to register and fill the form here.
Share this invitation with your colleagues !

  webcast microfmuidics

PROGRAM :

3D and 2.5D TSV integration
From imaging to deep learning: TSV has found its playground and it’s time to play!

Yole Développement has followed the 3D and 2.5D integration market since its early stage, and it is with pleasure that Yole Développement dedicates a webcast to make a point around TSV technology. Yole observes that TSV has found its place in packaging area and have settled for good offering unequalled performance, a supply chain was built with large semiconductor players involved. Key technical challenges were solved; now it’s all about increasing production volume.


This webcast will give you:
• An understanding of TSV technology business and market forecasts for middle and high performance market segments (networking, HPC, deep learning and imaging).
• An overview of applications requiring TSV integration including a status of commercialized products
• Help to understand how TSV are essential for performance and good form factor but also how alternative solutions are targeted to overcome challenges
• A deep-analysis of leading GPU cards based on reverse engineering from System Plus Consulting including technology analysis of high-bandwidth memory and 2.5D package and cost simulations

Farhang Yazdani, President & CEO of BroadPak Corporation, will also give his vision of the industry.

 ______________________________

Speakers:

EmilieJolivet YOLE2016 Casual BDEmilie Jolivet is a Technology & Market Analyst, in the Advanced Packaging and Semiconductor Manufacturing team, at Yole Développement the "More than Moore" market research and strategy consulting company. She holds a master’s degree Applied Physics specialized in Microelectronics from INSA Toulouse. After an internship in failure analysis in Freescale, she took the position of R&D engineer for 7 years in photovoltaic business and co-authored several scientific articles. Strong for this experience, she graduated from a master in Business Administration at IAE Lyon and then joined EV Group as a business development manager in 3D & Advanced Packaging before joining Yole Développement in 2016.

 

 

Romain Fraux System Plus Consulting

Romain Fraux is Chief Technology Officer (CTO) at the company System Plus Consulting, specialized in the reverse costing analysis of electronics, from semiconductor devices to electronic systems. Supporting industrial companies in their development, Romain and his team are offering a complete range of services, costing tools and reports. They deliver in-depth production cost studies and estimate objective selling price of a product, all based on a detailed physical analysis of each component in System Plus Consulting laboratory. Thanks to his deep technical expertise and his knowledge of the industrial landscape, Romain performs costing analyses of MEMS devices, Integrated Circuit and Advanced Packaging. He has significant experience in the modeling of the manufacturing costs of electronics components as well.
Romain has spoken in more than 20 industry conferences worldwide over the last 10 years. Romain holds a BEng from Heriot-Watt University of Edinburgh (Scotland) in addition to a master's degree in Microelectronics from the University of Nantes (France).

 

FarhangYazdani

Farhang Yazdani is the President and CEO of BroadPak Corporation. His company provides total solution and technologies to help its clients develop and launch 2.5D/3D products. Through his 18 years with the industry, he has served in various technical, management, and advisory positions with leading semiconductor companies worldwide. He has numerous publications and IPs in the area of 2.5D/3D Packaging and Assembly, serves on various technical committees and is a frequent reviewer for IEEE Journal of Advanced Packaging. He received his undergraduate and graduate degrees in Chemical Engineering and Mechanical Engineering from the University of Washington, Seattle.

 

 

Moderator:

FEK 19

As part of the Commercial & Communication team of Yole Développement (Yole), Fayçal El Khamassi serves as a Global Sales Support & Coordinator. He is in charge of the development of technology & market reports activity and is closely working with the international sales team to support Yole’s customers. For few years, Fayçal is composing business development actions, especially to the attention of major accounts. He has more than 15 years of experience in the “More than Moore” semiconductor marketplace.
Fayçal holds a Beng Honours (Bachelor - Mechanical Engineering) from the University of the West of England, Bristol (England) as well as an Mechanical and Production Engineering degree from University Claude Bernard (Lyon, France).

 

Discover the related reports about the Advanced Packaging Industry here

 

Powered by   Hosted by Sponsored by
 Yole Développement Logo SC V2013 i-micronews broadpak

 

 

Location From your computer

Archives



Category: Power electronics

From: Tuesday November 7 To Tuesday November 7, Location: 



Category: MEMS & Sensors

From: Thursday October 26 To Thursday October 26, Location: On your computer



Category: Advanced Packaging

From: Wednesday October 25 To Wednesday October 25, Location: On your computer



Category: Imaging

From: Tuesday September 26 To Tuesday September 26, Location: 



Category: Advanced Packaging

From: Thursday September 7 To Thursday September 7, Location: From your computer



Category: Advanced Packaging

From: Wednesday July 26 To Wednesday July 26, Location: From your computer



Category: RF Devices & Technologies

From: Wednesday June 14 To Wednesday June 14, Location: From your computer



Category: Medtech

From: Tuesday April 25 To Tuesday April 25, Location: From your computer



Category: Displays

From: Wednesday March 29 To Wednesday March 29, Location: From your computer



Category: Advanced Packaging

From: Monday January 16 To , Location: From your computer



Category: Compound Semi

From: Tuesday January 10 To Tuesday January 10, Location: From your computer



Category: Advanced Packaging

From: Tuesday December 13 To , Location: From your computer



Category: MEMS & Sensors

From: Wednesday December 7 To , Location: From your computer



Category: Imaging

From: Wednesday September 28 To Wednesday September 28, Location: on your computer



Category: Manufacturing

From: Wednesday September 14 To , Location: 



Category: MEMS & Sensors

From: Thursday July 21 To , Location: From your computer



Category: MEMS & Sensors

From: Thursday July 7 To Thursday July 7, Location: 



Category: Power electronics

From: Tuesday June 28 To , Location: From your computer



Category: MEMS & Sensors

From: Tuesday June 21 To , Location: From your computer



Category: MEMS & Sensors

From: Wednesday May 11 To Wednesday May 11, Location: 



Category: Advanced Packaging

From: Tuesday May 10 To Tuesday May 10, Location: 



Category: MEMS & Sensors

From: Tuesday May 3 To Tuesday May 3, Location: