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Advanced Substrates – How to answer demands on scaling and functional roadmaps?
Wednesday 28 March 2018, 05:00pm - 06:00pm
Contact Camille Veyrier (This email address is being protected from spambots. You need JavaScript enabled to view it.)

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FREE WEBCAST - March 28 at 5 PM CET - 8 AM PDT

Advanced Substrates

How to answer demands on scaling and functional roadmaps?

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Scaling is not the primary semiconductor driver anymore resulting in new markets and applications being explored with emphasis on system functionality rather than data processing capability. The semiconductor industry needs to develop products down both the scaling and functional roadmap simultaneously. Down the scaling roadmap, board and package substrates became one of the competition zones, leading to substrate-like-PCB. On the other hand, the functional roadmap is linked to devices that do not primarily require interconnect scaling but need to satisfy particular demands such as high frequency, high reliability, higher power etc. This also provoked the technology of embedded die in laminate.
Based on the most recent analyses from Yole Développement, System Plus Consulting and KnowMade, the following webcast gives an idea of the advanced substrate technology innovation and market dynamics.





Vivienne Hsu is a Technology & Market Analyst at Yole Développement (Yole). As part of the Advanced Packaging & Semiconductor Manufacturing team, Vivienne contributes to the development of Yole’s activities. She is engaged in development of market research reports and providing customized services for clients.
Graduated from Phelma, Grenoble INP (Grenoble, France), she completed her Master’s degree in Materials Science by carrying out a thesis about metal characterization with electron microscopy at EDF and joined Yole in 2017.




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Dr. Stéphane Elisabeth has joined System Plus Consulting's team last year. He has a deep knowledge of Materials characterizations and Electronics systems. He holds an Engineering Degree in Electronics and Numerical Technology, and a PhD in Materials for Microelectronics.





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Dr. Nicolas Baron is CEO and co-founder of Knowmade. He is leading the Microelectonics and Nanotechnology scientific and patent analysis department. He holds a PhD in Physics from the University of Nice Sophia-Antipolis, plus a University Diploma in Intellectual Property Strategy and Innovation from the European Institute for Enterprise and Intellectual Property (IEEPI Strasbourg), France.




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Mr. Steve Anderson, “Director Strategy & Business Development” joined AT&S Americas in 2015. In his current position, Steve is responsible for strategy, and business development focused on Semiconductor and Packaging reporting to Mr Schrems. He has 30+ years’ experience in the semiconductor and packaging industry developing advanced substrate technology with previous positions held at STATS ChipPAC, Surfect Technologies, Amkor Technology, and Texas Instruments as well as multiple startups. He holds a BS degree in Electrical Engineering from the University of North Dakota.





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Faycal El Khamassi, As part of the Commercial & Communication team of Yole Développement (Yole), Fayçal El Khamassi serves as a Global Sales Support & Coordinator. He is in charge of the development of technology & market reports activity and is closely working with the international sales team to support Yole’s customers. For few years, Fayçal is composing business development actions, especially to the attention of major accounts. He has more than 15 years of experience in the “More than Moore” semiconductor marketplace.
Fayçal holds a Beng Honours (Bachelor - Mechanical Engineering) from the University of the West of England, Bristol (England) as well as an Mechanical and Production Engineering degree from University Claude Bernard (Lyon, France).






Couv Status of advanced substrates 2018 Status of Advanced Substrates 2018: Embedded Dies & Interconnects, Substrates Like PCB Trends

Apple’s usage of substrate-like PCBs in the latest iPhone 8 and X will revolutionize the substrate and PCB markets.
Get more here.



Apple A11 inFO Packaging SPC 2018 Second Generation of TSMC’s Integrated Fan-Out (inFO) Packaging for the Apple A11 found in the iPhone X

The latest Apple application processor engine : from the stacked board to the A11, and reverse costing of TSMC's updated inFO packaging.
Get more here.



STMicroelectronics Proximity Sensor Floor Illuminator STMicroelectronics’ Time of Flight Proximity Sensor & Flood Illuminator in the Apple iPhone X

A unique combination of STMicroelectronics’ latest proximity sensor, based on single-photon avalanche diode (SPAD) technology and a VCSEL illuminator, all in Apple’s most advanced handset.
Get more here.


Discover more related reports about Advanced Substrates here



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