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DRAM and NAND market: What to expect? - Webcast
Thursday 06 December 2018, 05:00pm - 06:00pm
Contact Fanny (This email address is being protected from spambots. You need JavaScript enabled to view it.)

webcast technologiesrobotic2000x526

FREE WEBCAST - December 6th, 2018 at 5 PM CET - 8 AM PDT

Despite near-term challenges, structural changes ensure that memory will remain the largest segment of the semiconductor market

Register to watch the replay and share this webcast with your colleagues !

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The DRAM and NAND markets have a history of cyclicality and volatility, but consolidation and diversifying end demand have led to record revenues and profits for the memory suppliers over the past few years. The long-term outlook for the industry appears bright, but will new entrants from China change the narrative?

The DRAM and NAND memory markets have experienced unprecedented growth over the past 2 years, with combined revenues expected to reach $170 billion in 2018, up from $77 billion in 2016. Macro demand trends have been extremely positive for the memory markets, led by robust growth in the datacenter and continued strength in mobile, augmented by emerging demand from IoT, AR/VR, autonomous vehicles, and other applications. Trends in machine learning, Big Data, and artificial intelligence, combined with the emergence of 5G provide great opportunities for future growth.

This webcast will examine the current status of the memory markets and future drivers of growth. How have structural changes impacted the memory markets over the past few years? What is expected to fuel growth in the future? What is causing near-term softness in the DRAM and NAND markets, and how long is this situation expected to last? How are the market dynamics different between the two major memory technologies? Is the emergence of domestic memory suppliers in China going to disrupt the market?

Join Yole Développement and System Plus' webcast for a discussion of these questions, and gain a better understanding of trends within the memory markets from several perspectives, including market and technology, and competitive dynamics.




Photo MikeHoward YOLE 2018

Mike Howard is member of the memory team at Yole Développement (Yole) as VP of DRAM and Memory Research.
Mike’s mission at Yole is to deliver a comprehensive understanding of the entire memory and semiconductor landscape (with special emphasis on DRAM) via market updates, Market Monitors, and Pricing Monitors. Mike is also deeply involved in the business development of all memory activities.
Mike has a deep understanding of the DRAM and memory markets with a valuable combination of industry and market research experience. For the decade prior to joining Yole, Mike was the Senior Director of DRAM and Memory Research at IHS. Before IHS, Mike worked at Micron Technology where he had roles in corporate development, marketing, and engineering.
Mike earned a Master of Business Administration at The Ohio State University (United-States), a Bachelor of Science in Chemical Engineering and a Bachelor of Arts in Finance at the University of Washington (Washington, United-States).

Photo WaltCoon YOLE 2018

Walt Coon joins Yole Développement’s memory team as VP of NAND and Memory Research, part of the Semiconductor & Software division.
Walt is leading the day-to-day production of both market updates, Market Monitors and Pricing Monitors, with a focus on the NAND market and semiconductor industries. In addition, he is deeply involved in the business development of these activities.
Walt has significant experience within the memory & semiconductor industry. He spent 16 years at Micron Technology, managing the team responsible for competitor benchmarking, and industry supply, demand, and cost modeling. His team also supported both corporate strategy and Mergers & Acquisitions analysis. Previously, he spent time in Information Systems, developing engineering applications to support memory process and yield enhancement.
Walt Coon earned a Master of Business Administration from Boise State University (Idaho, United-States) and a Bachelor of Science in Computer Science from the University of Utah (United-States).

Belinda Dube SystemPlusConsulting 2018 circle

Belinda Dube is working for System Plus Consulting as a Semiconductor Cost Analyst. Belinda is also engaged in the development of reverse engineering & costing analyses with the power electronics and compound semiconductors team.
With an expertise focused on Micro & Nano Electronics, Belinda graduated from INSA (Lyon, France) with a master degree in Instrumentation & Nanotechnology Engineering.





DavidJourdan Casual YOLE2018 BD GreyBackground circleDavid Jourdan has been working in Sales Marketing Dept. of the Discrete and Standard Group of STMicroelectronics. Then he has been working for several months within Ernst & Young, mainly in collaboration with Jean-Christophe Eloy. In 1998, he joined Yole Développement for its very early beginning. David has been Marketing Analyst for a few years and later on he held Sales & Marketing position of our reports publication activity. For a few years, he has been managing the customer support & the promotion of our publications. He now works as a Global Sales Support. Coordinator
David is cofounder of Yole company. And he graduated with Business Manager diploma from the Wesford High School in Grenoble and earned a degree in Applied Language in Lyon II University.





couv MicroLED displays july2018 DRAM Service – Memory Research

2018 will be the peak year for DRAM market value, with price moving down Q3.
Get more here.



microled displays IP jan2018 yoleNAND Service – Memory Research

NAND is expected to set another revenue record in 2018, before a flattish 2019.
Get more here.




microled displays IP jan2018 yoleEmerging Non-Volatile Memory 2018

After more than 15 years in development, PCM has finally taken off in stand-alone applications. STT-MRAM will lead the embedded memory race.
Get more here.



SP18422 3D NAND Memories Comparaison 2018 coverLeading-edge 3D NAND Memory Comparison 2018

A deep technology analysis and cost comparison report on cutting edge 3D NAND memory chips from Toshiba/SanDisk, Samsung, SK Hynix and Intel/Micron.
Get more here.



microled displays IP jan2018 yoleMemory Packaging Market and Technology Report 2017

Wire bond is still the dominant interconnect for memory packaging, but flip-chip is making inroads into mainstream memory packaging.
Get more here.



Discover more related reports and monitors about Memory here



webcast ENVM yole link 400x400Challenges and strategies for mass adoption of emerging NVM technologies - Webcast

After 15+ years in development, stand-alone PCM has finally taken off in 2018 - and STT-MRAM now leads the embedded memory race.

Yole Developpement is organizing a special webcast onJanuary 24th, 2018 at 5 PM CET - 8 AM PDT - More information and registration here, do not miss it!




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Category: Memory

From: Thursday December 6 To Thursday December 6, Location: 

Category: Software & Computing

From: Tuesday November 20 To Tuesday November 20, Location: 

Category: Solid-state lighting

From: Wednesday October 31 To Wednesday October 31, Location: 

Category: MEMS & Sensors

From: Tuesday October 30 To Tuesday October 30, Location: 

Category: MEMS & Sensors

From: Tuesday October 16 To Tuesday October 16, Location: 

Category: Solid-state lighting

From: Thursday October 11 To Thursday October 11, Location: 

Category: MEMS & Sensors

From: Wednesday September 5 To Wednesday September 5, Location: On your computer

Category: Imaging

From: Tuesday July 10 To Tuesday July 10, Location: on your computer

Category: Manufacturing

From: Thursday June 28 To Thursday June 28, Location: 

Category: Power electronics

From: Wednesday June 27 To Wednesday June 27, Location: on your computer

Category: RF Devices & Technologies

From: Wednesday May 2 To Wednesday May 2, Location: 

Category: Imaging

From: Tuesday April 17 To Tuesday April 17, Location: 

Category: Advanced Packaging

From: Wednesday March 28 To Wednesday March 28, Location: On your computer

Category: Manufacturing

From: Wednesday March 21 To , Location: 

Category: Batteries/Energy Mgmt

From: Tuesday December 12 To Tuesday December 12, Location: On your computer

Category: Medtech

From: Friday December 8 To Friday December 8, Location: on your computer

Category: MEMS & Sensors

From: Tuesday November 28 To Tuesday November 28, Location: On your computer

Category: Power electronics

From: Tuesday November 7 To Tuesday November 7, Location: 

Category: MEMS & Sensors

From: Thursday October 26 To Thursday October 26, Location: On your computer

Category: Advanced Packaging

From: Wednesday October 25 To Wednesday October 25, Location: On your computer

Category: Imaging

From: Tuesday September 26 To Tuesday September 26, Location: 

Category: Advanced Packaging

From: Thursday September 7 To Thursday September 7, Location: From your computer

Category: Advanced Packaging

From: Wednesday July 26 To Wednesday July 26, Location: From your computer

Category: RF Devices & Technologies

From: Wednesday June 14 To Wednesday June 14, Location: From your computer

Category: Medtech

From: Tuesday April 25 To Tuesday April 25, Location: From your computer