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Challenges and strategies for mass adoption of emerging NVM technologies - Webcast
Thursday 24 January 2019, 05:00pm - 06:00pm
Contact Fanny (This email address is being protected from spambots. You need JavaScript enabled to view it.)

webcast ENVM 2000x526

FREE WEBCAST - January 24th, 2019 at 5 PM CET - 8 AM PDT

After 15+ years in development, stand-alone PCM has finally taken off in 2018 - and STT-MRAM now leads the embedded memory race

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Emerging non-volatile memory (eNVM) has long been restricted to niche applications because of poor scalability, high cost, and a lack of support from major memory makers. But in 2017, after more than 15 years in development, the first PCM-based technology for storage-class memory (i.e. 3D XPoint) finally entered the market. And thanks to the rise of 3D XPoint enabled by Intel’s leading position in the enterprise processor business, PCM is poised to dominate the stand-alone eNVM market.

In the embedded business, the top foundries are preparing with 28/22nm technology processes for eNVM to be integrated in MCUs/SoCs. STT-MRAM has advanced faster than RRAM, and in the coming years it will lead the embedded emerging NVM market.

This webcast provides an overview of stand-alone and embedded eNVM technologies/markets, covering their current status and evolution. What are the latest technology developments for (STT-) MRAM, PCM, and RRAM? What will 3DX Point’s future entail once Micron and Intel’s joint venture ends? What goals are foundries pursuing within the embedded memory business? What strategies are emerging eNVM players adopting to introduce their new technologies to the market?

Join Yole Développement’s webcast for a discussion of these questions and gain a better understanding of memory market trends from several perspectives, including market & technology and competitive dynamics.





Photo SimoneBertolazzi YOLE 2018

Simone Bertolazzi, PhD is a Technology & Market analyst at Yole Développement (Yole) working with the Semiconductor & Software division. He is member of the Yole’s memory team and he contributes on a day-to-day basis to the analysis of nonvolatile memory technologies, their related materials and fabrication processes.
Previously, Simone carried out experimental research in the field of nanoscience and nanotechnology, focusing on emerging semiconducting materials and their opto-electronic device applications. He (co-) authored more than ten papers in high-impact scientific journals and was awarded the prestigious Marie Curie Intra-European Fellowship.
Simone obtained a PhD in physics in 2015 from École Polytechnique Fédérale de Lausanne (Switzerldand), where he developed novel flash memory cell based on heterostructures of graphene, 2D semiconductors and high-κ dielectrics.


Photo IvanDonaldson YOLE 2018

Ivan Donaldson is the VP of financial market development at Yole Développement (Yole). He is responsible for managing services and client relationships in the global financial segment including institutional investors, research firms, private equity funds, venture capital funds, and investment bankers.
Prior to Yole, as VP of Corporate Strategy at Micron Technology, Ivan’s responsibilities included corporate strategic planning, M&A and business development, and generating strategic intelligence. In addition, he represented the company externally with key counterparties, business partners, and government officials. He was also previously the head of Micron Technology's Investor Relations team, representing the company with investors worldwide.
In addition to the memory industry, Ivan has developed expertise in imaging and compound semiconductor markets, all of which are a focus in his position with Yole.
Ivan earned a Bachelor of Business Administration degree in Finance from Boise State University (Idaho, United-States), graduating Magna Cum Laude.



DavidJourdan Casual YOLE2018 BD GreyBackground circleDavid Jourdan has been working in Sales Marketing Dept. of the Discrete and Standard Group of STMicroelectronics. Then he has been working for several months within Ernst & Young, mainly in collaboration with Jean-Christophe Eloy. In 1998, he joined Yole Développement for its very early beginning. David has been Marketing Analyst for a few years and later on he held Sales & Marketing position of our reports publication activity. For a few years, he has been managing the customer support & the promotion of our publications. He now works as a Global Sales Support. Coordinator
David is cofounder of Yole company. And he graduated with Business Manager diploma from the Wesford High School in Grenoble and earned a degree in Applied Language in Lyon II University.





microled displays IP jan2018 yoleEmerging Non-Volatile Memory 2018

After more than 15 years in development, PCM has finally taken off in stand-alone applications. STT-MRAM will lead the embedded memory race.
Get more here.

microled displays IP jan2018 yoleMemory Packaging Market and Technology Report 2017

Wire bond is still the dominant interconnect for memory packaging, but flip-chip is making inroads into mainstream memory packaging.
Get more here.





couv MicroLED displays july2018 DRAM Service – Memory Research

2018 will be the peak year for DRAM market value, with price moving down Q3.
Get more here.





microled displays IP jan2018 yoleNAND Service – Memory Research

NAND is expected to set another revenue record in 2018, before a flattish 2019.
Get more here.

Discover more related reports and monitors about Memory here




webcast DRAM yole link 400x400DRAM and NAND market: What to expect? - Webcast

Despite near-term challenges, structural changes ensure that memory will remain the largest segment of the semiconductor market

Yole Developpement and System Plus Consulting organized a special webcast on December 6th, 2018 - More information and replay here!





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Category: Displays

From: Friday February 15 To Friday February 15, Location: 

Category: Compound Semi

From: Wednesday January 30 To Wednesday January 30, Location: 

Category: Memory

From: Thursday January 24 To Thursday January 24, Location: 

Category: Advanced Packaging

From: Tuesday January 22 To Tuesday January 22, Location: 

Category: MEMS & Sensors

From: Tuesday January 15 To Tuesday January 15, Location: 

Category: Memory

From: Thursday December 6 To Thursday December 6, Location: 

Category: Software & Computing

From: Tuesday November 20 To Tuesday November 20, Location: 

Category: Solid-state lighting

From: Wednesday October 31 To Wednesday October 31, Location: 

Category: MEMS & Sensors

From: Tuesday October 30 To Tuesday October 30, Location: 

Category: MEMS & Sensors

From: Tuesday October 16 To Tuesday October 16, Location: 

Category: Solid-state lighting

From: Thursday October 11 To Thursday October 11, Location: 

Category: MEMS & Sensors

From: Wednesday September 5 To Wednesday September 5, Location: On your computer

Category: Imaging

From: Tuesday July 10 To Tuesday July 10, Location: on your computer

Category: Manufacturing

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Category: Power electronics

From: Wednesday June 27 To Wednesday June 27, Location: on your computer

Category: RF Devices & Technologies

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Category: Imaging

From: Tuesday April 17 To Tuesday April 17, Location: 

Category: Advanced Packaging

From: Wednesday March 28 To Wednesday March 28, Location: On your computer

Category: Manufacturing

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Category: Batteries/Energy Mgmt

From: Tuesday December 12 To Tuesday December 12, Location: On your computer

Category: Medtech

From: Friday December 8 To Friday December 8, Location: on your computer

Category: MEMS & Sensors

From: Tuesday November 28 To Tuesday November 28, Location: On your computer

Category: Power electronics

From: Tuesday November 7 To Tuesday November 7, Location: 

Category: MEMS & Sensors

From: Thursday October 26 To Thursday October 26, Location: On your computer

Category: Advanced Packaging

From: Wednesday October 25 To Wednesday October 25, Location: On your computer

Category: Imaging

From: Tuesday September 26 To Tuesday September 26, Location: 

Category: Advanced Packaging

From: Thursday September 7 To Thursday September 7, Location: From your computer

Category: Advanced Packaging

From: Wednesday July 26 To Wednesday July 26, Location: From your computer