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1st Executive Infrared Imaging Forum: From Niche to Large Volume Applications
Thursday 08 September 2016
Contact Clotilde

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Yole Développement is proud to collaborate with CIOE to organize the 1st Executive Infrared Imaging Forum : From Niche to Large Volume Applications. It will take place on September 8, 2016 in Shenzhen, alongside the 18th China International Optoelectronic Expo 2016. This event presents applications and technologies within the infrared imaging industry. AGENDA
Keynote speakers from Autoliv and Heimann Sensors, and speakers from ULIS, Umicore, Yole Développement, Device-ALab, INO, Mikrosens, Shanghai Institute of Technical Physics, Sirius Inc, System Plus Consulting, Telops... For more information about the program, discover the AGENDA



Register online here or via PDF form here
For any questions, email Clotilde at This email address is being protected from spambots. You need JavaScript enabled to view it.
The 1st Executive Infrared Imaging Forum : From niche to large volume applications will provide timely, comprehensive coverage of infrared imaging industry. If you are looking for increased visibility, new business development (...) or any combination, the forum enables you to develop and highlight your brand towards a key audience.

More information on the sponsorship opportunities here!



This 1st Executive Infrared Imaging Forum : From niche to large volume applications is must for all infrared imaging industry executives as well as for users and application managers to network and learn about all the latest industry trends.

The forum will bring together a worldclass panel of users and application experts and allow participants to get valuable insights into the status and future of the infrared imaging industry as well as provide unprecedented opportunities for meeting with industry leaders. Sessions will include:

- Key applications: building automation, automotive, mobile phones, service robotics, consumer, medical, drones, …
- New technologies: integration and miniaturization, sensor fusion, lenses, packaging, imager technologies (micro bolometer, thermopile, pyroelectric), camera module, camera architecture, sensor integration…
- New functions: biometry, night vision, motions sensing, people counting, spot thermometer, gesture recognition, …
- Manufacturing process, material and equipment: silicon as an optical material, wafer level packaging, wafer level optics, chalcogenide, wafer level test, new detection material, functional test, …

Find a list of hotel near the convention center here 
Discover the photos gallery here.

More information or any question, please contact Clotilde Fabre (This email address is being protected from spambots. You need JavaScript enabled to view it.).

 Organized by Hosted by  Sponsored by:
  logo yole moyen CIOE Logo 1 Ulis couleur RVB 

 Association partners
  logo epic SEMI LOGO   

Location Shenzhen, China

Past events

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From: Wednesday September 6 To Thursday September 7, Location: Shenzhen, China

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From: Thursday September 7 To Thursday September 7, Location: Shenzhen, China

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From: Monday July 3 To Tuesday July 4, Location: Munich, Germany

Category: Displays

From: Tuesday June 27 To Tuesday June 27, Location: San Jose, CA, USA

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From: Wednesday June 21 To Wednesday June 21, Location: Grenoble, France

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From: Monday May 22 To Tuesday May 23, Location: Stockholm, Sweden

Category: Power electronics

From: Wednesday May 17 To Wednesday May 17, Location: Nuremberg, Germany

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From: Thursday April 20 To Friday April 21, Location: Wuxi, China

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From: Thursday September 8 To Thursday September 8, Location: Shenzhen, China

Category: Compound Semi

From: Tuesday September 6 To Wednesday September 7, Location: Shenzen, China

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