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Advanced Packaging & System Integration Technology Symposium
From Thursday 21 April 2016
To Friday 22 April 2016
Contact Clotilde Fabre (This email address is being protected from spambots. You need JavaScript enabled to view it.)

NCAP Yole Symposium 2016


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Click on the flag to get
information in Chinese  

Discover the detailed agenda HERE

For the 2nd time, Yole Développement & NCAP signed a partnership to organize the Advanced Packaging Seminar focused on Advanced Packaging & System Integration Technology. The dedicated symposium will take place in one of the most dynamic place in the field of advanced packaging: Wuxi , China, from April 21 to 22, 2016.

Based on its expertise and its strong knowledge of the industry, the "More than Moore" market research and strategy consulting company, Yole Développement shall detail the technology roadmap and give a comprehensive market outlook.

Yole Développement's experts and invited speakers will be part of this strategic conference.  


PROGRAM (more)

This 1,5 day of conference will include presentations on Interposer and 3D Integration Technologies, Fan Out & Embedded Technologies, Packaging for IoT, Advanced Substrates & System in Package, Sensors & MEMS Packages, Silicon Photonics and others ….
Also, there will be time for networking and a panel discussion around: "Is the supply chain ready to support the latest advancements in packaging?"

Speakers from:  Alpha Szenszor, ASE Group, ASM Pacific Technology, ASTRI, Besi, Brewer Sciences, BroadPak Corporation,  Evatec, EV Group, Huawei, JCAP, JCET Group, Huatian Technology, NCAP, Nepes, Plasma-Therm, SCHOTT, Sinyang, SMIC, SPTS/Orbotech,  STATS ChipPAC, Yole Développement, Zeta Instruments...  and many others to be announced soon. Stay tuned !


Registration online is now available, please click here, or access the registration form to complete and return to Clotilde fabre (This email address is being protected from spambots. You need JavaScript enabled to view it.).

Early bird rate*: EUR 300 (2200 CNY) by March 21, 2016
Standard rate*: EUR 380 (2800 CNY) after March 21, 2016

*For French companies, a 20% VAT will apply 



The Symposium will take place the 21st and 22nd of April in the Wuxi Gloria Grand Hotel (无锡凯莱大饭店).
The address is: 202 West Gaolang Road, Binghu District, Wuxi, Jiangsu Province, China(无锡滨湖区高浪西路202号)
You can consult its website: or contact them at: This email address is being protected from spambots. You need JavaScript enabled to view it.

Benefit from a discount when booking your accommodation by precising the code "NCAP" or "华进半导体" 


More information or any question, please contact Clotilde ( This email address is being protected from spambots. You need JavaScript enabled to view it. ).  


  Organized by Hosted by  In collaboration with
logo yole moyen NCAP China astri logo

Sponsored by  

Logo Besi Sponosr Yole NCAP


SPTS An Orbotech Company logo
Location Wuxi, China

Past events

Category: Manufacturing

From: Wednesday September 6 To Thursday September 7, Location: Shenzhen, China

Category: Imaging

From: Thursday September 7 To Thursday September 7, Location: Shenzhen, China

Category: MEMS & Sensors

From: Monday July 3 To Tuesday July 4, Location: Munich, Germany

Category: Displays

From: Tuesday June 27 To Tuesday June 27, Location: San Jose, CA, USA

Category: Displays

From: Wednesday June 21 To Wednesday June 21, Location: Grenoble, France

Category: Compound Semi

From: Monday May 22 To Tuesday May 23, Location: Stockholm, Sweden

Category: Power electronics

From: Wednesday May 17 To Wednesday May 17, Location: Nuremberg, Germany

Category: Advanced Packaging

From: Thursday April 20 To Friday April 21, Location: Wuxi, China

Category: Imaging

From: Thursday September 8 To Thursday September 8, Location: Shenzhen, China

Category: Compound Semi

From: Tuesday September 6 To Wednesday September 7, Location: Shenzen, China

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