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YOLE EVENTS

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Advanced Packaging & System Integration Technology Symposium
From Thursday 21 April 2016
To Friday 22 April 2016
Contact Clotilde Fabre (This email address is being protected from spambots. You need JavaScript enabled to view it.)

NCAP Yole Symposium 2016

 

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information in Chinese  
 

Discover the detailed agenda HERE


For the 2nd time, Yole Développement & NCAP signed a partnership to organize the Advanced Packaging Seminar focused on Advanced Packaging & System Integration Technology. The dedicated symposium will take place in one of the most dynamic place in the field of advanced packaging: Wuxi , China, from April 21 to 22, 2016.

Based on its expertise and its strong knowledge of the industry, the "More than Moore" market research and strategy consulting company, Yole Développement shall detail the technology roadmap and give a comprehensive market outlook.

Yole Développement's experts and invited speakers will be part of this strategic conference.  

 

PROGRAM (more)

This 1,5 day of conference will include presentations on Interposer and 3D Integration Technologies, Fan Out & Embedded Technologies, Packaging for IoT, Advanced Substrates & System in Package, Sensors & MEMS Packages, Silicon Photonics and others ….
Also, there will be time for networking and a panel discussion around: "Is the supply chain ready to support the latest advancements in packaging?"

Speakers from:  Alpha Szenszor, ASE Group, ASM Pacific Technology, ASTRI, Besi, Brewer Sciences, BroadPak Corporation,  Evatec, EV Group, Huawei, JCAP, JCET Group, Huatian Technology, NCAP, Nepes, Plasma-Therm, SCHOTT, Sinyang, SMIC, SPTS/Orbotech,  STATS ChipPAC, Yole Développement, Zeta Instruments...  and many others to be announced soon. Stay tuned !


REGISTRATION

Registration online is now available, please click here, or access the registration form to complete and return to Clotilde fabre (This email address is being protected from spambots. You need JavaScript enabled to view it.).

Early bird rate*: EUR 300 (2200 CNY) by March 21, 2016
Standard rate*: EUR 380 (2800 CNY) after March 21, 2016

*For French companies, a 20% VAT will apply 

 

VENUE

The Symposium will take place the 21st and 22nd of April in the Wuxi Gloria Grand Hotel (无锡凯莱大饭店).
The address is: 202 West Gaolang Road, Binghu District, Wuxi, Jiangsu Province, China(无锡滨湖区高浪西路202号)
You can consult its website: www.wuxigloriahotel.com or contact them at: This email address is being protected from spambots. You need JavaScript enabled to view it.

Benefit from a discount when booking your accommodation by precising the code "NCAP" or "华进半导体" 

 

More information or any question, please contact Clotilde ( This email address is being protected from spambots. You need JavaScript enabled to view it. ).  

 

  Organized by Hosted by  In collaboration with
logo yole moyen NCAP China astri logo

  
Sponsored by  

Logo Besi Sponosr Yole NCAP

PlasmaTherm

SPTS An Orbotech Company logo
 
Location Wuxi, China

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From: Monday July 3 To Tuesday July 4, Location: Munich, Germany



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From: Monday May 22 To Tuesday May 23, Location: Stockholm, Sweden



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From: Wednesday May 17 To Wednesday May 17, Location: Nuremberg, Germany



Category: Advanced Packaging

From: Thursday April 20 To Friday April 21, Location: Wuxi, China



Category: Imaging

From: Thursday September 8 To Thursday September 8, Location: Shenzhen, China



Category: Compound Semi

From: Tuesday September 6 To Wednesday September 7, Location: Shenzen, China



Category: RF Devices & Technologies

From: Thursday July 21 To , Location: From your computer



Category: Compound Semi

From: Wednesday May 18 To Thursday May 19, Location: Stockholm, Sweden



Category: Power electronics

From: Wednesday May 11 To Wednesday May 11, Location: Nuremberg, Germany



Category: Advanced Packaging

From: Thursday April 21 To Friday April 22, Location: Wuxi, China

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