Discover the detailed agenda HERE
For the 2nd time, Yole Développement & NCAP signed a partnership to organize the Advanced Packaging Seminar focused on Advanced Packaging & System Integration Technology. The dedicated symposium will take place in one of the most dynamic place in the field of advanced packaging: Wuxi , China, from April 21 to 22, 2016.
Based on its expertise and its strong knowledge of the industry, the "More than Moore" market research and strategy consulting company, Yole Développement shall detail the technology roadmap and give a comprehensive market outlook.
Yole Développement's experts and invited speakers will be part of this strategic conference.
This 1,5 day of conference will include presentations on Interposer and 3D Integration Technologies, Fan Out & Embedded Technologies, Packaging for IoT, Advanced Substrates & System in Package, Sensors & MEMS Packages, Silicon Photonics and others ….
Also, there will be time for networking and a panel discussion around: "Is the supply chain ready to support the latest advancements in packaging?"
Speakers from: Alpha Szenszor, ASE Group, ASM Pacific Technology, ASTRI, Besi, Brewer Sciences, BroadPak Corporation, Evatec, EV Group, Huawei, JCAP, JCET Group, Huatian Technology, NCAP, Nepes, Plasma-Therm, SCHOTT, Sinyang, SMIC, SPTS/Orbotech, STATS ChipPAC, Yole Développement, Zeta Instruments... and many others to be announced soon. Stay tuned !
Early bird rate*: EUR 300 (2200 CNY) by March 21, 2016
Standard rate*: EUR 380 (2800 CNY) after March 21, 2016
*For French companies, a 20% VAT will apply
The Symposium will take place the 21st and 22nd of April in the Wuxi Gloria Grand Hotel (无锡凯莱大饭店).
The address is: 202 West Gaolang Road, Binghu District, Wuxi, Jiangsu Province, China（无锡滨湖区高浪西路202号）
Benefit from a discount when booking your accommodation by precising the code "NCAP" or "华进半导体"
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