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Advanced Packaging & System Integration Technology Symposium
From Thursday 20 April 2017
To Friday 21 April 2017
Contact Camille Veyrier (This email address is being protected from spambots. You need JavaScript enabled to view it.)
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SMIC and Brewer Science as Keynotes, and other key players will be there !


Unparalleled gathering of the leading executives from the Advanced Packaging industry! - The Yole Développement and NCAP’s symposium

20-21 April, 2017 | Wuxi, China

For the 3rd time, Yole Développement & NCAP partner to organize the Advanced Packaging Symposium focused on Advanced Packaging & System Integration Technology. This symposium is an unparalleled gathering of the leading executives from around the world discussing the timeliest issues, challenges and opportunities. The unique single-meeting event will take place in one of the most dynamic place in the field of advanced packaging: Wuxi, China, from April 20 to 21, 2017.

During 2 days, all aspects including Fan Out Packaging, System in Package, Advanced Substrates, 3D Technology & Embedded Technologies, as well as MEMS & Sensors packaging, RF, Photonics... will be addressed in one conference, special sessions and key industrial talks.
Also, there will be time for networking and a panel discussion.


Gain an insight into a unique symposium...

  • 5 key industry focuses
  • About 25 inspiring presentations
  • Unique access to leading players and experts
  • A panel session to debate
  • Several networking times to discuss with your peers

Don't miss this opportunity to exchange with key players !

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Program unveiled!

The structure of the symposium will allow attendees to get valuable insights into the advanced packaging industry as well as provide unprecedented opportunities for meeting with industry leaders. Key sessions and speakers include:

  • Fan Out Packaging: from Integration to IP with SMIC, Huatian Technology (Kunshan) Electronics, nepes,...
  • 3D Integration & Processes for Advanced Packaging with BroadPak Corporation, Kobus,...
  • Equipment for Advanced Packaging Platforms with Besi, Unity SC,...
  • Advanced Materials & Processes with Brewer Science, DISCO Corp.,...
  • Applicative Packaging & Materials with Infineon Technologies, Dow Electronics Materials,...

Networking sessions during the two days. Get the opportunity to exchange with all the leading players in the advanced packaging industry.

Discover the agenda here!


Registration

  • Early bird rate until March 31, 2017: €320.00.
  • Standard rate from April 1, 2017: €400.00.
    Registration fees include access to the symposium, lunches, coffee breaks and networking party.

Register now !


Sponsorship opportunities available

Sponsoring the Advanced Packaging & System Integration Technology Symposium is a prime opportunity to put your company in front of more than 100 of the key industry players and decision makers of the industry. Different levels of opportunities to suit your needs - More

 

For more information, please contact Camille (This email address is being protected from spambots. You need JavaScript enabled to view it.)


Travel and venue

The symposium will be held at the Pullman Wuxi New Lake (Website). Rooms at discounted rate are available for our attendees.

Kind reminder to the overseas visitors: China visa are required to all the overseas passport holders for entry into Chinese territories. Visa Application may take a long period, and we kindly remind you to apply for the China visa as early as possible. If you need invitation letter, please contact This email address is being protected from spambots. You need JavaScript enabled to view it..

 

For more information, please contact Camille (This email address is being protected from spambots. You need JavaScript enabled to view it.)

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Location Wuxi, China

Past events



Category: Displays

From: Wednesday June 21 To Wednesday June 21, Location: Grenoble, France



Category: Compound Semi

From: Monday May 22 To Tuesday May 23, Location: Stockholm, Sweden



Category: Power electronics

From: Wednesday May 17 To Wednesday May 17, Location: Nuremberg, Germany



Category: Advanced Packaging

From: Thursday April 20 To Friday April 21, Location: Wuxi, China



Category: Imaging

From: Thursday September 8 To Thursday September 8, Location: Shenzhen, China



Category: Compound Semi

From: Tuesday September 6 To Wednesday September 7, Location: Shenzen, China



Category: RF Devices & Technologies

From: Thursday July 21 To , Location: From your computer



Category: Compound Semi

From: Wednesday May 18 To Thursday May 19, Location: Stockholm, Sweden



Category: Power electronics

From: Wednesday May 11 To Wednesday May 11, Location: Nuremberg, Germany



Category: Advanced Packaging

From: Thursday April 21 To Friday April 22, Location: Wuxi, China



Category: MEMS & Sensors

From: Wednesday November 4 To Friday November 6, Location: Paris, France

June 2017
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