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International Wide Bandgap Materials (WBG) Power Electronics Applications Workshop - IWBGPEAW
From Monday 22 May 2017
To Tuesday 23 May 2017
Contact Camille Veyrier (This email address is being protected from spambots. You need JavaScript enabled to view it.)

 

From ISiCPEAW to IWBGPEAW - RISE Acreo AB, SiC Power Center, Yole Développement and Enterprise Europe Network’s workshop

RISE Acreo AB and SiC Power Center, in collaboration with Yole Développement and Enterprise Europe Network, are pleased to announce their collaboration on the International Wide Bandgap Materials (WBG) Power Electronics Applications Workshop, IWBGPEAW. This year with support from the Swedish Energy Agency, as well as the Interreg Baltic Sea Region project Green Power Electronics.

IWBGPEAW 2017 is a three-day event, consisting of two workshop days, May 22 - 23, preceded by one tutorial day, May 21. The event will cover the latest results and innovations in power electronics applications of wide bandgap materials, such as silicon carbide and gallium nitride.

Workshop

The workshop takes place Monday - Tuesday May 22 - 23. It has the overall aim to promote the use of the latest research and development results, by bringing together the foremost experts from both academia and industry. The focus lies on the use of wide bandgap materials (WBG) technology in power electronics applications, components, modules, packaging, reliability and benchmarking versus silicon power electronics. The program is defined by WBG experts and reflects the status of WBG from an industry point of view. Specialists from all over the world will present their views on current status, ongoing development and the opportunities of applications in the power electronics area. They will also present the latest products and solutions, and will be available for detailed technical discussions.

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Exhibition and sponsorship

More than just a conference, the IWBGPEAW event includes debates and numerous networking opportunities throughout the entire workshop. An exhibition area dedicated to the experts of the WBG industry is set up by the organizers.

There are also several possibilities to sponsor the event without exhibiting. For further details, please see "Exhibition and sponsors".

Exhibitors and other sponsors get their company logo and a short presentation on this web site, as well as the logo in the printed IWBGPEAW programme.

If you wish to be an event sponsor, please choose one of the four Sponsorship Packages in your registration and contact the person in charge (This email address is being protected from spambots. You need JavaScript enabled to view it.).

For further details, please see "Exhibition and sponsors".

 

B2B Matchmaking

In parallel with the workshop, a business to business (B2B) matchmaking event is arranged by Enterprise Europe Network. The matchmaking is a platform for discussion and exchange between research, product development and application. All participants will have the opportunity to book One-on-One meetings. This is a quick and easy way to meet with potential cooperation partners. If you wish to attend the matchmaking, please check the boxes when you register. There are four matchmaking sessions to choose from.

Please note: Participation in the B2B Matchmaking is free of charge, however it requires a Workshop registration.
Also please note: To avoid collisions with presentations you wish to attend (or are going to give), please check the Workshop programme before you choose your Matchmaking sessions.

For further details, please see "Matchmaking".

Venue

This event will take place at Hotel Birger Jarl, Birger Jarlsgatan 61 A, Stockholm. The hotel has 70 rooms pre-reserved for workshop attendees, Sunday through Tuesday.

For further details, please see "Accomodation".

Previous editions

Please consult the program of previous events:

- ISiCPEAW 2016

- ISiCPEAW 2015

For more information, please contact Camille (This email address is being protected from spambots. You need JavaScript enabled to view it.)

Location Stockholm, Sweden

Past events



Category: Manufacturing

From: Wednesday September 6 To Thursday September 7, Location: Shenzhen, China



Category: Imaging

From: Thursday September 7 To Thursday September 7, Location: Shenzhen, China



Category: MEMS & Sensors

From: Monday July 3 To Tuesday July 4, Location: Munich, Germany



Category: Displays

From: Tuesday June 27 To Tuesday June 27, Location: San Jose, CA, USA



Category: Displays

From: Wednesday June 21 To Wednesday June 21, Location: Grenoble, France



Category: Compound Semi

From: Monday May 22 To Tuesday May 23, Location: Stockholm, Sweden



Category: Power electronics

From: Wednesday May 17 To Wednesday May 17, Location: Nuremberg, Germany



Category: Advanced Packaging

From: Thursday April 20 To Friday April 21, Location: Wuxi, China



Category: Imaging

From: Thursday September 8 To Thursday September 8, Location: Shenzhen, China



Category: Compound Semi

From: Tuesday September 6 To Wednesday September 7, Location: Shenzen, China



Category: RF Devices & Technologies

From: Thursday July 21 To , Location: From your computer



Category: Compound Semi

From: Wednesday May 18 To Thursday May 19, Location: Stockholm, Sweden



Category: Power electronics

From: Wednesday May 11 To Wednesday May 11, Location: Nuremberg, Germany



Category: Advanced Packaging

From: Thursday April 21 To Friday April 22, Location: Wuxi, China

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