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2nd Executive Infrared Imaging Forum: Uncooled Infrared Imaging for Volume Applications
Thursday 07 September 2017
Contact Clotilde

IR Forum 2017 - Yole Développement & CIOE

 

Home IR Forum 2017

Call for paper IR Forum 2017

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Yole Développement is proud to collaborate with CIOE to organize the 2nd Executive Infrared Imaging Forum: Uncooled Infrared Imaging For Volume Applications. It will take place on September 7, 2017 in Shenzhen, alongside the 19th China International Optoelectronic Expo 2017. This event presents applications and technologies within the infrared imaging industry.

 

CALL FOR PAPER - Extended until May 10th

The Call for Paper is now open!
List of topics, submission requirements are detailed in the Call for Paper webpage.
Feel free to submit your abstract and be part of this unique executive forum.

First speakers announced soon!

 

2016 EDITION

The first edition of the forum featured thirteen speakers from leading companies across the entire value chain (Heimann Sensors, Autoliv Global Night Vision, ULIS, Robert Bosch, Umicore...). Attendance exceeded all expectations with close to 80 participants. The audience included multiple CEOs and high level executives representing the entire infrared imaging ecosystem. See what happened last year here.

 

More information or any question, please contact Clotilde Fabre (This email address is being protected from spambots. You need JavaScript enabled to view it.).

 

 Organized by Hosted by 
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Location Shenzhen, China

Past events



Category: Compound Semi

From: Monday May 22 To Tuesday May 23, Location: Stockholm, Sweden



Category: Power electronics

From: Wednesday May 17 To Wednesday May 17, Location: Nuremberg, Germany



Category: Advanced Packaging

From: Thursday April 20 To Friday April 21, Location: Wuxi, China



Category: Imaging

From: Thursday September 8 To Thursday September 8, Location: Shenzhen, China



Category: Compound Semi

From: Tuesday September 6 To Wednesday September 7, Location: Shenzen, China



Category: RF Devices & Technologies

From: Thursday July 21 To , Location: From your computer



Category: Compound Semi

From: Wednesday May 18 To Thursday May 19, Location: Stockholm, Sweden



Category: Power electronics

From: Wednesday May 11 To Wednesday May 11, Location: Nuremberg, Germany



Category: Advanced Packaging

From: Thursday April 21 To Friday April 22, Location: Wuxi, China



Category: MEMS & Sensors

From: Wednesday November 4 To Friday November 6, Location: Paris, France



Category: Advanced Packaging

From: Tuesday October 27 To Tuesday October 27, Location: Orlando, USA

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