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Status and Perspectives in Power Semiconductor (Si, SiC, GaN) Business - Power Electronics Market Briefing
Wednesday 17 May 2017, 10:00am - 11:30am
Contact Camille (This email address is being protected from spambots. You need JavaScript enabled to view it.)
 
Tetiere 2017 MBPCIM 2000x526 2017


For the 5th consecutive year, Yole Développement organizes its Power Electronics Market Briefing during the PCIM Europe show. Entitled "Status and Perspectives in Power Semiconductor (Si, SiC, GaN) Business", the 2017 edition will take place on May 17, 2017 in the Industry Forum Area (Hall 6 - 143) of PCIM Europe (Nuremberg, Germany), from 10:00 to 11:30 AM. Entrance is free for PCIM Europe visitors.

This market briefing will provide market metrics and forecasted trends for Power Semiconductors and evaluate their impact on the supply-chain and technologies. Also, Yole Développement’s team will present the findings from its related analysis. This will be followed by presentations on the topic from main industrial players and technology.
Afterwards, all attendees are welcome to participate in a panel discussion, during which we’ll compare and contrast different points-of-view and visions.

Join the Market Briefing to listen to presentations and take part in panel discussions between speakers from key companies:

  • Peter Friedrichs, Infineon
  • Marnix Tack, ON Semiconductor
  • Pierric Gueguen, Yole Développement

Also, our team invites you to exchange on our booth 6-461.

For any questions, please contact Camille (This email address is being protected from spambots. You need JavaScript enabled to view it.).
 

 Organized by Supported by 
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Choose a minimum of three reports in our Power Electronics Bundle from Yole Group of Companies (including Yole Développement, System Plus Consulting and KnowMade) and receive a discount of at least 39% on your package. This email address is being protected from spambots. You need JavaScript enabled to view it. or find more information here.

 

 

Location Nuremberg, Germany

Past events



Category: Manufacturing

From: Wednesday September 6 To Thursday September 7, Location: Shenzhen, China



Category: Imaging

From: Thursday September 7 To Thursday September 7, Location: Shenzhen, China



Category: MEMS & Sensors

From: Monday July 3 To Tuesday July 4, Location: Munich, Germany



Category: Displays

From: Tuesday June 27 To Tuesday June 27, Location: San Jose, CA, USA



Category: Displays

From: Wednesday June 21 To Wednesday June 21, Location: Grenoble, France



Category: Compound Semi

From: Monday May 22 To Tuesday May 23, Location: Stockholm, Sweden



Category: Power electronics

From: Wednesday May 17 To Wednesday May 17, Location: Nuremberg, Germany



Category: Advanced Packaging

From: Thursday April 20 To Friday April 21, Location: Wuxi, China



Category: Imaging

From: Thursday September 8 To Thursday September 8, Location: Shenzhen, China



Category: Compound Semi

From: Tuesday September 6 To Wednesday September 7, Location: Shenzen, China



Category: RF Devices & Technologies

From: Thursday July 21 To , Location: From your computer



Category: Compound Semi

From: Wednesday May 18 To Thursday May 19, Location: Stockholm, Sweden



Category: Power electronics

From: Wednesday May 11 To Wednesday May 11, Location: Nuremberg, Germany



Category: Advanced Packaging

From: Thursday April 21 To Friday April 22, Location: Wuxi, China

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