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YOLE EVENTS

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Advanced Packaging & System Integration Technology Symposium
From Wednesday 20 June 2018
To Thursday 21 June 2018
Contact Camille Veyrier (This email address is being protected from spambots. You need JavaScript enabled to view it.)
banniere ncap 646x220 2018

 

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The advanced packaging is on the move.
Join our symposium to be part of it!


Unparalleled gathering of the leading executives from the Advanced Packaging industry! - The Yole Développement and NCAP’s symposium

20-21 June, 2018 | Wuxi, China

After the three last successful events, Yole Développement & NCAP have decided to continue and strengthen the collaboration to organize the Advanced Packaging & System Integration Technology Symposium for the 4th time.

The advanced packaging is on the move. Emerging application are bringing new challenges, and packaging experts from all over the world will come to exchange on their vision and future perspectives. Don’t miss it!

The unique single-meeting event will take place in one of the most dynamic places in the semiconductor: Wuxi, China, from June 20 to 21, 2018.

During 2 days, all packaging aspects including Panel Level, Fan Out, System in Package, Advanced Substrates, 3D Technology will be discussed. Focus on key applications such as 5G, Automotive, Artificial Intelligence and Memory will be at the heart of the conference.



Gain an insight into a unique symposium...

  • 5 key industry focuses
  • About 20 inspiring presentations
  • Unique access to leading players and experts
  • A panel session to debate
  • Several networking times to discuss with your peers
  • Short courses (in Chinese) to cover a broad range of topic areas
    at a variety of educational levels

Don't miss this opportunity to exchange with key players!

Powered by:

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Hosted by:

NCAP China Logo


Registration

  • Early bird rate until May 31, 2018: €310.00.
  • Standard rate from June 1, 2018: €400.00.
    Registration fees include access to the symposium, lunches, coffee breaks and networking party.

Registration will open soon!


Sponsorship opportunities available

Sponsoring the Advanced Packaging & System Integration Technology Symposium is a prime opportunity to put your company in front of more than 150 of the key industry players and decision makers of the industry. Different levels of opportunities to suit your needs - Discover our offers now

 

For more information, please contact Camille (This email address is being protected from spambots. You need JavaScript enabled to view it.)


Travel and venue

The symposium will be held at the hotel Nikko Wuxi (Website).

Kind reminder to the overseas visitors: China visa are required to all the overseas passport holders for entry into Chinese territories. Visa Application may take a long period, and we kindly remind you to apply for the China visa as early as possible. If you need invitation letter, please contact This email address is being protected from spambots. You need JavaScript enabled to view it. or This email address is being protected from spambots. You need JavaScript enabled to view it. or download it.

 

 For more information, please contact Camille (This email address is being protected from spambots. You need JavaScript enabled to view it.)


Previous editions

Please consult the program of previous events:

Advanced Packaging & System Integration Technology Symposium 2017
Advanced Packaging & System Integration Technology Symposium 2016

 

For more information, please contact Camille (This email address is being protected from spambots. You need JavaScript enabled to view it.)

Powered by: Hosted by:
logo yole moyen NCAP China Logo
Sponsored by:  
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Location Wuxi, China

Past events



Category: Manufacturing

From: Wednesday September 6 To Thursday September 7, Location: Shenzhen, China



Category: Imaging

From: Thursday September 7 To Thursday September 7, Location: Shenzhen, China



Category: MEMS & Sensors

From: Monday July 3 To Tuesday July 4, Location: Munich, Germany



Category: Displays

From: Tuesday June 27 To Tuesday June 27, Location: San Jose, CA, USA



Category: Displays

From: Wednesday June 21 To Wednesday June 21, Location: Grenoble, France



Category: Compound Semi

From: Monday May 22 To Tuesday May 23, Location: Stockholm, Sweden



Category: Power electronics

From: Wednesday May 17 To Wednesday May 17, Location: Nuremberg, Germany



Category: Advanced Packaging

From: Thursday April 20 To Friday April 21, Location: Wuxi, China



Category: Imaging

From: Thursday September 8 To Thursday September 8, Location: Shenzhen, China



Category: Compound Semi

From: Tuesday September 6 To Wednesday September 7, Location: Shenzen, China

April 2018
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