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Advanced Packaging & System Integration Technology Symposium
From Wednesday 20 June 2018
To Thursday 21 June 2018
Contact Camille Veyrier (This email address is being protected from spambots. You need JavaScript enabled to view it.)
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The advanced packaging is on the move.
Join our symposium to be part of it!


Unparalleled gathering of the leading executives from the Advanced Packaging industry! - The Yole Développement and NCAP’s symposium

20-21 June, 2018 | Wuxi, China

After the three last successful events, Yole Développement & NCAP have decided to continue and strengthen the collaboration to organize the Advanced Packaging & System Integration Technology Symposium for the 4th time.

The advanced packaging is on the move. Emerging application are bringing new challenges, and packaging experts from all over the world will come to exchange on their vision and future perspectives. Don’t miss it!

The unique single-meeting event will take place in one of the most dynamic places in the semiconductor: Wuxi, China, from June 20 to 21, 2018.

During 2 days, all packaging aspects including Panel Level, Fan Out, System in Package, Advanced Substrates, 3D Technology will be discussed. Focus on key applications such as 5G, Automotive, Artificial Intelligence and Memory will be at the heart of the conference.



Gain an insight into a unique symposium...

  • 6 key industry focuses
  • About 20 inspiring presentations
  • Unique access to leading players and experts
  • A panel session to debate
  • Several networking times to discuss with your peers
  • Short courses to cover a broad range of topic areas at a variety of educational levels

Don't miss this opportunity to exchange with key players!

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Hosted by:

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Program unveiled!

The structure of the symposium will allow attendees to get valuable insights into the advanced packaging industry as well as provide unprecedented opportunities for meeting with industry leaders. Key sessions and speakers include:

  • Advanced Power Packaging with Atotech, Schweizer Electronic
  • Panel Level Packaging with EVATEC, Semsysco, Yole Développement,...
  • Fan-Out Wafer Level Packaging with Huatian Group (keynote), KLA-Tencor, NCAP, SPTS,...
  • High End with Veeco, Central South University,...
  • Equipment for WLP with Brewer Science, EV Group, Nordson, SCREEN,...
  • Advanced Packaging Materials with Dipsol, Yiztec,...
  • Short courses with ASE Global, University of Science & Technology of China and GaTech

Networking sessions during the two days. Get the opportunity to exchange with all the leading players in the advanced packaging industry.

Discover the agenda here!


Registration

  • Symposium - Early bird rate until June 8, 2018: €310.00
  • Symposium + Short courses - Early bird rate until June 8, 2018: €400.00
  • Symposium - Standard rate from June 9, 2018: €400.00
  • Symposium + Short courses - Standard rate from June 9, 2018: €500.00

Registration fees include access to the symposium, lunches, coffee breaks and networking party.

Registration is now open: HERE!


Sponsorship opportunities available

Sponsoring the Advanced Packaging & System Integration Technology Symposium is a prime opportunity to put your company in front of more than 150 of the key industry players and decision makers of the industry. Different levels of opportunities to suit your needs - Discover our offers now

 

For more information, please contact Camille (This email address is being protected from spambots. You need JavaScript enabled to view it.)


Travel and venue

The symposium will be held at the hotel Nikko Wuxi (Website).

Kind reminder to the overseas visitors: China visa are required to all the overseas passport holders for entry into Chinese territories. Visa Application may take a long period, and we kindly remind you to apply for the China visa as early as possible. If you need invitation letter, please contact This email address is being protected from spambots. You need JavaScript enabled to view it. or This email address is being protected from spambots. You need JavaScript enabled to view it. or download it.

Learn more about the city of Wuxi here and enjoy your time there!

For more information, please contact Camille (This email address is being protected from spambots. You need JavaScript enabled to view it.)


Previous editions

Please consult the program of previous events:

Advanced Packaging & System Integration Technology Symposium 2017
Advanced Packaging & System Integration Technology Symposium 2016

 

For more information, please contact Camille (This email address is being protected from spambots. You need JavaScript enabled to view it.)

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Sponsored by: 
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Location Wuxi, China

Past events



Category: Advanced Packaging

From: Wednesday June 20 To Thursday June 21, Location: Wuxi, China



Category: Compound Semi

From: Monday June 11 To Tuesday June 12, Location: Stockholm, Sweden



Category: Power electronics

From: Wednesday June 6 To Wednesday June 6, Location: Nuremberg, Germany



Category: Manufacturing

From: Wednesday September 6 To Thursday September 7, Location: Shenzhen, China



Category: Imaging

From: Thursday September 7 To Thursday September 7, Location: Shenzhen, China



Category: MEMS & Sensors

From: Monday July 3 To Tuesday July 4, Location: Munich, Germany



Category: Displays

From: Tuesday June 27 To Tuesday June 27, Location: San Jose, CA, USA



Category: Displays

From: Wednesday June 21 To Wednesday June 21, Location: Grenoble, France



Category: Compound Semi

From: Monday May 22 To Tuesday May 23, Location: Stockholm, Sweden



Category: Power electronics

From: Wednesday May 17 To Wednesday May 17, Location: Nuremberg, Germany



Category: Advanced Packaging

From: Thursday April 20 To Friday April 21, Location: Wuxi, China

August 2018
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